Abstract:
An apparatus that includes a photovoltaic cell is provided. The photovoltaic cell includes a p-type thin film having a first rare earth sulfide, and an n-type thin film having a second rare earth sulfide. A p-n junction is formed between the p-type thin film and the n-type thin film. The photovoltaic cell includes a substrate and an at least partially transparent layer. The p-type and n-type thin films are deposited between the substrate and the at least partially transparent layer.
Abstract:
Provided is a method for fabricating a nano-wire field effect transistor including steps of: preparing an SOI substrate having a (100) surface orientation, and nano-wire field effect transistor where two triangular columnar members configuring the nano-wires and being made of a silicon crystal layer are arranged one above the other on an SOI substrate having a (100) surface such a way that the ridge lines of the triangular columnar members face via an insulator; processing the silicon crystal configuring the SOI substrate into a standing plate-shaped member having a rectangular cross-section; and as a nanowire, processing the silicon crystal by orientation dependent wet etching into a shape where two triangular columnar members are arranged one above the other in such a way that the ridge lines of the triangular columnar members configuring the nano-wires face through the ridge lines thereof, and an integrated circuit including the nano-wire field effect transistor.
Abstract:
Provided is a nitride semiconductor device including: a nitride semiconductor layer over a substrate wherein the nitride semiconductor has a two-dimensional electron gas (2DEG) channel inside; a drain electrode in ohmic contact with the nitride semiconductor layer; a source electrode spaced apart from the drain electrode, in Schottky contact with the nitride semiconductor layer, and having an ohmic pattern in ohmic contact with the nitride semiconductor layer inside; a dielectric layer formed on the nitride semiconductor layer between the drain electrode and the source electrode and on at least a portion of the source electrode; and a gate electrode disposed on the dielectric layer to be spaced apart from the drain electrode, wherein a portion of the gate electrode is formed over a drain-side edge portion of the source electrode with the dielectric layer interposed therebetween, and a manufacturing method thereof.
Abstract:
An optoelectronic device assembly can include: a coated element and an electroactive cell on the coated element, wherein the electroactive cell is selected from the group consisting of a light emitting diode and a photovoltaic cell. The coated element can include: transparent thermoplastic substrate and a protective weathering layer. The transparent thermoplastic substrate can include a material selected from the group consisting of aromatic polycarbonate and polyester, and combinations including at least one of the foregoing materials. The protective weathering layer can have a UV absorbance loss rate at 330 nm of less than or equal to 0.15 A/year as estimated from filtered xenon arc exposure and/or having a rate of erosion of less than or equal to 5 μm per year as estimated from filtered xenon arc exposure.
Abstract:
Embodiments described include straining transistor quantum well (QW) channel regions with metal source/drains, and conformal regrowth source/drains to impart a uni-axial strain in a MOS channel region. Removed portions of a channel layer may be filled with a junction material having a lattice spacing different than that of the channel material to causes a uni-axial strain in the channel, in addition to a bi-axial strain caused in the channel layer by a top barrier layer and a bottom buffer layer of the quantum well.
Abstract:
Light-emitting devices and associated methods are provided. The light emitting devices can have a wavelength converting material-coated emission surface.
Abstract:
An improved bipolar transistor (40, 40′) is provided, manufacturable by a CMOS IC process without added steps. The improved transistor (40, 40′) comprises an emitter (48) having first (482) and second (484) portions of different depths (4821, 4841), a base (46) underlying the emitter (48) having a central portion (462) of a first base width (4623) underlying the first portion (482) of the emitter (48), a peripheral portion (464) having a second base width (4643) larger than the first base width (4623) partly underlying the second portion (484) of the emitter (48), and a transition zone (466) of a third base width (4644) and lateral extent (4661) lying laterally between the first (462) and second (464) portions of the base (46), and a collector (44) underlying the base (46). The gain of the transistor (40, 40′) is much larger than a conventional bipolar transistor (20) made using the same CMOS process. By adjusting the lateral extent (4661) of the transition zone (466), the properties of the improved transistor (40, 40′) can be tailored to suit different applications without modifying the underlying CMOS IC process.
Abstract:
A group III nitride semiconductor device having a gallium nitride based semiconductor film with an excellent surface morphology is provided. A group III nitride optical semiconductor device includes a group III nitride semiconductor supporting base, a GaN based semiconductor region, an active layer, and a GaN semiconductor region. The primary surface of the group III nitride semiconductor supporting base is not any polar plane, and forms a finite angle with a reference plane that is orthogonal to a reference axis extending in the direction of a c-axis of the group III nitride semiconductor. The GaN based semiconductor region, grown on the semipolar primary surface, includes a semiconductor layer of, for example, an n-type GaN based semiconductor doped with silicon. A GaN based semiconductor layer of an oxygen concentration of 5×1016 cm−3 or more provides an active layer, grown on the primary surface, with an excellent crystal quality.
Abstract:
A nitride-based semiconductor device is provided. The nitride-base semiconductor device includes a substrate comprising one or more locally etched regions and a buffer layer comprising one or multiple InAlGaN layers on the substrate. A channel layer includes GaN on the buffer layer. A barrier layer includes one or multiple AlGaN layers on the channel layer.
Abstract:
A semiconductor device includes at least one semiconductor layer, a metal layer in electrical contact with the semiconductor layer, and a carbon nanotube contact layer interposed between the metal layer and the semiconductor layer. The contact layer electrically couples the metal layer to the semiconductor layer and provides a semiconductor contact having low specific contact resistance. The contact layer can be substantially optically transparent layer in at least a portion of the visible light range.