公开(公告)号：US20130105539A1

公开(公告)日：2013-05-02

申请号：US13663073

申请日：2012-10-29

Applicant: MEMC Electronic Materials, Inc.

Inventor： Gregory A. Young ,  Jeffrey L. Libbert

IPC: H01L21/301 ,  B26F3/00

CPC classification number: B32B43/006 ,  B32B38/10 ,  C09J2205/302 ,  H01L21/67092 ,  H01L2221/68386 ,  H01L2221/6839 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1961 ,  Y10T156/1978 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/357 ,  Y10T225/393

Abstract: Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.

Abstract translation: 公开了用于机械地切割接合晶片结构的装置和方法。 该装置和方法涉及夹持键合晶片结构并被致动以使接合结构断裂的夹具。

公开(公告)号：US20130011997A1

公开(公告)日：2013-01-10

申请号：US13635457

申请日：2010-03-31

Applicant: Jürgen Burggraf ,  Markus Wimplinger ,  Harald Wiesbauer

Inventor： Jürgen Burggraf ,  Markus Wimplinger ,  Harald Wiesbauer

IPC: H01L21/30

CPC classification number: H01L21/6835 ,  H01L21/486 ,  H01L21/561 ,  H01L23/5384 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2221/6839 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2224/81001 ,  H01L2224/81 ,  H01L2924/00

Abstract: A method for producing a product wafer having chips thereon, comprising the steps of: processing the first side of the product wafer bonding the product wafer with its first side onto a first rigid carrier wafer with a first intermediate layer consisting of one first adhesion layer applied at least on the edge side, processing a second side of the product wafer, bonding of the product wafer with its second side on a second rigid carrier wafer with a second intermediate layer consisting of one second adhesion layer applied at least on the edge side, characterized in that the first intermediate layer and the second intermediate layer are made different such that the first carrier wafer can be separated selectively before the second carrier wafer.

Abstract translation: 一种用于制造具有芯片的产品晶片的方法，包括以下步骤：将产品晶片的第一侧与第一侧接合到第一刚性载体晶片上，其中第一中间层由施加有第一粘合层的第一中间层 至少在边缘侧处理产品晶片的第二面，将产品晶片与其第二面接合在第二刚性载体晶片上，其中第二中间层由至少施加在边缘侧上的一个第二粘合层组成， 其特征在于，使第一中间层和第二中间层不同，使得第一载体晶片可以在第二载体晶片之前被选择性地分离。

公开(公告)号：US20110297771A1

公开(公告)日：2011-12-08

申请号：US13213553

申请日：2011-08-19

Applicant: Kazuki NODA ,  Masaru Iwasawa

Inventor： Kazuki NODA ,  Masaru Iwasawa

IPC: B02C23/00

CPC classification number: B32B43/006 ,  B32B2457/14 ,  H01L21/2007 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/6839 ,  Y10S156/93 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T156/1944

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract translation: 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底被研磨成非常小的厚度，然后可以与支撑体分离而不损坏基底。 本发明的一个实施方案是一种层叠体，其包括待研磨的基材，与待研磨基材接触的接合层，包含光吸收剂和可热分解树脂的光热转换层和透光性支持体。 在与接合层接触的基板表面研磨后，通过透光层照射层叠体，分解光电转换层，分离基板和透光支撑体。

公开(公告)号：US07938930B2

公开(公告)日：2011-05-10

申请号：US11389122

申请日：2006-03-27

Applicant: Masaki Sakata ,  Masayuki Yamamoto

Inventor： Masaki Sakata ,  Masayuki Yamamoto

IPC: B29C63/00

CPC classification number: B29C63/0013 ,  H01L21/67132 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2221/6839 ,  Y10T29/49126 ,  Y10T156/1179 ,  Y10T156/19

Abstract: An aligned workpiece is mounted on and held by a holding table, and a support board separating mechanism separates a support board from a semiconductor wafer. Herein, a double-faced adhesive tape is left on one of the support board and the semiconductor wafer. Either the support board or the semiconductor wafer on which the double-faced adhesive tape is left is transported to an adhesive tape peeling mechanism while being held by the holding table, and the double-faced adhesive tape is peeled off and removed from the surface of thereof. The separated semiconductor wafer and support board are collected independently.

Abstract translation: 对准的工件安装在保持台上并由保持台保持，并且支撑板分离机构将支撑板与半导体晶片分离。 这里，双面胶带留在支撑板和半导体晶片之一上。 将双面胶带留在其上的支撑板或半导体晶片被保持台传送到胶带剥离机构，双面胶带从表面剥离 其中。 分离的半导体晶片和支撑板被独立地收集。

公开(公告)号：US07849900B2

公开(公告)日：2010-12-14

申请号：US11358140

申请日：2006-02-22

Applicant: Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

Inventor： Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

IPC: B29C65/18

CPC classification number: B29C63/0013 ,  H01L21/67132 ,  H01L2221/6839 ,  Y10T156/1105 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1906 ,  Y10T156/1978

Abstract: During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a non-contact manner. Based on the detection result, a joining member is stopped in the position of the end edge of the protective tape and is moved close to the semiconductor wafer to press and bring a separation tape against and into contact with an end of the protective tape. In this state, the mount frame and the joining member are relatively and horizontally moved to join the separation tape onto the protective tape. Then, the mount frame and the joining member are relatively and horizontally moved to separate the separation tape together with the protective tape from a surface of the semiconductor wafer.

Abstract translation: 在具有保护带的半导体晶片通过支撑胶带被支撑在环形框架上的安装框架的相对和水平移动以及接合构件中，在保护带的端部边缘的位置被检测到 非接触式 基于检测结果，接合构件停止在保护带的端缘的位置，并且移动靠近半导体晶片，以将分离带抵靠并与保护带的端部接触。 在这种状态下，安装框架和接合构件被相对且水平地移动以将分离带连接到保护带上。 然后，安装框架和接合构件被相对且水平地移动，以将分离带与保护带一起从半导体晶片的表面分离。

公开(公告)号：US07785926B2

公开(公告)日：2010-08-31

申请号：US12585547

申请日：2009-09-17

Applicant: Atsushi Yoshimura ,  Tadanobu Ookubo

Inventor： Atsushi Yoshimura ,  Tadanobu Ookubo

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: A first semiconductor element is bonded on a substrate. A complex film formed of integrated dicing film and adhesive film is affixed on a rear surface of a semiconductor wafer which is to be second semiconductor elements, the dicing film having a thickness within a range of not less than 50 μm nor more than 140 μm and a room temperature elastic modulus within a range of not less than 30 MPa nor more than 120 MPa, and the adhesive film having a thickness of 30 μm or more and a room temperature elastic modulus before curing within a range of not less than 500 MPa nor more than 1200 MPa. The semiconductor wafer together with the adhesive film is divided into the second semiconductor elements. The second semiconductor element is picked up from the dicing film to be bonded on the first semiconductor element.

Abstract translation: 第一半导体元件结合在基板上。 由作为第二半导体元件的半导体晶片的背面固定由集成的切割膜和粘合膜形成的复合膜，该切割膜的厚度在50μm以上140μm以下， 室温弹性模量在30MPa以上120MPa以下的范围内，粘合膜的厚度为30μm以上，固化前的室温弹性模量在500MPa以上的范围内，也不 超过1200MPa。 半导体晶片与粘合膜一起分为第二半导体元件。 第二半导体元件从要切割的第一半导体元件上的切割膜拾取。

公开(公告)号：US20100151689A1

公开(公告)日：2010-06-17

申请号：US12640796

申请日：2009-12-17

Applicant: Thomas Gmitter ,  Gang He ,  Melissa Archer ,  Andreas Hegedus

Inventor： Thomas Gmitter ,  Gang He ,  Melissa Archer ,  Andreas Hegedus

IPC: H01L21/306 ,  C23F1/08

CPC classification number: H01L21/7813 ,  H01L21/30612 ,  H01L21/67086 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L31/184 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2221/6839

Abstract: Embodiments of the invention generally relate to apparatuses and methods for producing epitaxial thin films and devices by epitaxial lift off (ELO) processes. In one embodiment, a method for forming thin film devices during an ELO process is provided which includes coupling a plurality of substrates to an elongated support tape, wherein each substrate contains an epitaxial film disposed over a sacrificial layer disposed over a wafer, exposing the substrates to an etchant during an etching process while moving the elongated support tape, and etching the sacrificial layers and peeling the epitaxial films from the wafers while moving the elongated support tape. Embodiments also include several apparatuses, continuous-type as well as a batch-type apparatuses, for forming the epitaxial thin films and devices, including an apparatus for removing the support tape and epitaxial films from the wafers on which the epitaxial films were grown.

Abstract translation: 本发明的实施例一般涉及通过外延剥离（ELO）工艺制造外延薄膜和器件的装置和方法。 在一个实施例中，提供了一种在ELO工艺期间形成薄膜器件的方法，其包括将多个衬底耦合到细长支撑带，其中每个衬底包含设置在设置在晶片上方的牺牲层上的外延膜， 在移动细长的支撑带的同时蚀刻过程中的蚀刻剂，以及蚀刻牺牲层并在移动细长支撑带的同时从晶片剥离外延膜。 实施例还包括几种用于形成外延薄膜和器件的连续型和间歇式器件的装置，包括用于从其上生长外延膜的晶片去除支撑带和外延膜的装置。

公开(公告)号：US20100041211A1

公开(公告)日：2010-02-18

申请号：US12603775

申请日：2009-10-22

Applicant: Kazuki NODA ,  Masaru Iwasawa

Inventor： Kazuki NODA ,  Masaru Iwasawa

IPC: H01L21/78 ,  B23K26/38

CPC classification number: B32B43/006 ,  B32B2457/14 ,  H01L21/2007 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/6839 ,  Y10S156/93 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T156/1944

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract translation: 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底被研磨成非常小的厚度，然后可以与支撑体分离而不损坏基底。 本发明的一个实施方案是一种层叠体，其包括待研磨的基材，与待研磨基材接触的接合层，包含光吸收剂和可热分解树脂的光热转换层和透光性支持体。 在与接合层接触的基板表面研磨后，通过透光层照射层叠体，分解光电转换层，分离基板和透光支撑体。

公开(公告)号：US20080023133A1

公开(公告)日：2008-01-31

申请号：US11819827

申请日：2007-06-29

Applicant: Masayuki Yamamoto

Inventor： Masayuki Yamamoto

IPC: B29C63/00 ,  B29C65/00

CPC classification number: H01L21/67132 ,  H01L21/6835 ,  H01L21/68714 ,  H01L21/68721 ,  H01L21/68735 ,  H01L2221/6834 ,  H01L2221/6839 ,  Y10T156/1126 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1928 ,  Y10T156/1978

Abstract: An annular convex portion is formed along an outer periphery of a back face of a wafer so as to surround a ground area in the back face. The annular convex portion is suction held by a holding table while being brought into close contact with the holding table, and fluid is supplied into a space defined between the back face of the wafer and the holding table; thus, an internal pressure in the space is increased. In this state, a separating adhesive tape is supplied toward a surface of a protective tape, and then a joining roller moves from a first end to a second end of the wafer while pressing a non-adhesive surface of the adhesive tape against the wafer; thus, the adhesive tape is joined to the surface of the protective tape. Then, a guide member moves from the first end to the second end of the wafer to guide the adhesive tape joined to the protective tape in a reverse direction; thus, the adhesive tape and the protective tape are simultaneously separated from the front face of the wafer.

Abstract translation: 沿着晶片的背面的外周形成环状凸部，以围绕背面的接地区域。 环状凸部在与保持台紧密接触的同时由保持台保持的吸引，并且将流体供给到在晶片的背面和保持台之间限定的空间中; 因此，空间中的内部压力增加。 在这种状态下，向保护带的表面供给分离胶带，然后将粘合带的非粘合表面压在晶片上，接合辊从晶片的第一端移动到第二端; 因此，胶带与保护带的表面接合。 然后，引导构件从晶片的第一端移动到第二端，以相反方向引导与保护带接合的粘合带; 因此，胶带和保护带与晶片的前表面同时分离。

公开(公告)号：US20050126694A1

公开(公告)日：2005-06-16

申请号：US10972536

申请日：2004-10-26

Applicant: Masayuki Yamamoto

Inventor： Masayuki Yamamoto

IPC: B65H41/00 ,  B29C63/00 ,  B29C63/02 ,  H01L21/00 ,  H01L21/304 ,  H01L21/683 ,  B32B31/00

CPC classification number: H01L21/67132 ,  B29C63/0013 ,  B29C63/02 ,  B29C2793/009 ,  B32B2457/14 ,  H01L2221/6839 ,  Y10T156/1093 ,  Y10T156/1744 ,  Y10T156/1906

Abstract: The protective tape is joined at an optional angle with respect to the recesses formed between the patterns on the surface of the article, which has irregularities and on which patterns as a plurality of chips are formed in a matrix. After that, joining the adhesive tape to the surface of the protective tape at an optional angle with respect to recesses formed between patterns on the surface of the article, and separating the protective tape at an optional angle with respect to the recesses.

Abstract translation: 保护带相对于形成在制品表面上的图案之间的凹部以可选的角度接合，该凹槽具有不规则性，并且在其上以矩阵形成多个芯片的图案。 之后，相对于在物品表面上的图案之间形成的凹部以任意角度将胶粘带粘合到保护带的表面上，并且相对于凹部以任意角度分离保护带。