公开(公告)号：US06309212B1

公开(公告)日：2001-10-30

申请号：US09570061

申请日：2000-05-12

Applicant: Hiroshi Nakazato

Inventor： Hiroshi Nakazato

IPC: B65G4907

CPC classification number: H01L21/67103 ,  G03F7/7075 ,  G03F7/70875 ,  H01L21/67763 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/14 ,  Y10S414/141

Abstract: In a substrate conveying system, the temperature adjustment for a substrate is performed by use of a temperature adjusting plate which is provided at a substrate transfer station where a substrate can be transferred from or to an outside structure, by which the substrate temperature adjustment can be accomplished without a decrease of a processing speed of a semiconductor manufacturing apparatus and without deposition of contaminations.

Abstract translation: 在基板输送系统中，通过使用温度调节板来进行基板的温度调节，所述温度调节板设置在基板传送站处，其中基板可以从外部结构转移到外部结构，基板温度调节可以 在不降低半导体制造装置的处理速度并且不沉积污染物的情况下实现。

公开(公告)号：US20230298913A1

公开(公告)日：2023-09-21

申请号：US18152071

申请日：2023-01-09

Applicant: All Ring Tech Co., Ltd.

Inventor： Chun-Hung Tsai ,  An-Tien Wang ,  Kuan-Lin Cheng ,  Shih-Min Lee

IPC: H01L21/67 ,  H01L21/677 ,  B32B37/12 ,  H01L21/683

CPC classification number: H01L21/67132 ,  H01L21/67763 ,  B32B37/1207 ,  H01L21/6836 ,  B32B2457/14 ,  H01L2221/68318 ,  H01L2221/6834

Abstract: A bonding apparatus for attaching an adhering pad to a base component includes a feeding and holding frame for feeding and holding the base component in a conveying route, a suspending carrier mounted above the conveying route, and a bonding device disposed on and movable with the suspending carrier. The bonding device has a feeding reel on which the tape assembly is disposed and from which the tape assembly is pulled and fed along a feeding route, and an attaching head which is disposed at said feeding route to divide the pulled section into an input side and an output side. When the attaching head is moved toward the input side, the adhering pad is removed from the carrier tape while attached to the base component.

公开(公告)号：US20230253228A1

公开(公告)日：2023-08-10

申请号：US18130302

申请日：2023-04-03

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Jeffery C. Hudgens

IPC: H01L21/677 ,  H01L21/673 ,  B65D85/00

CPC classification number: H01L21/67763 ,  H01L21/67386 ,  H01L21/67393 ,  H01L21/67775 ,  B65D85/70 ,  Y10S414/137

Abstract: A semiconductor processing system includes a first component forming a first chamber. A first sealed environment in the first chamber is at a first state prior to a door being opened. A load port structure is disposed between the first component and a second component. The load port structure includes walls disposed around an opening of the load port structure. The load port structure is separate from the first component and the second component. A third component is configured to change at least one of the first state of the first sealed environment within the first chamber or a second state of a second sealed environment within a second chamber formed by the second component to cause the first state and the second state to be substantially similar before the door between the first sealed environment and the second sealed environment is opened.

公开(公告)号：US20230203647A1

公开(公告)日：2023-06-29

申请号：US18111385

申请日：2023-02-17

Applicant: Applied Materials, Inc.

Inventor： Karl J. ARMSTRONG ,  Ludovic GODET ,  Brian Alexander COHEN ,  Wayne MCMILLAN ,  James D. STRASSNER ,  Benjamin B. RIORDON

IPC: C23C16/40 ,  C23C14/04 ,  C23C16/04 ,  C23C16/455 ,  C23C14/08 ,  C23C14/06 ,  C23C14/14 ,  C23C16/24 ,  C23C16/34 ,  H01L21/677 ,  C23C16/56

CPC classification number: C23C16/405 ,  C23C14/042 ,  C23C16/042 ,  C23C16/45525 ,  C23C14/083 ,  C23C16/407 ,  C23C14/0652 ,  C23C14/14 ,  C23C16/24 ,  C23C16/345 ,  C23C14/086 ,  H01L21/67766 ,  H01L21/67763 ,  C23C16/56 ,  G02B6/132

Abstract: Embodiments of the present disclosure relate to forming multi-depth films for the fabrication of optical devices. One embodiment includes disposing a base layer of a device material on a surface of a substrate. One or more mandrels of the device material are disposed on the base layer. The disposing the one or more mandrels includes positioning a mask over of the base layer. The device material is deposited with the mask positioned over the base layer to form an optical device having the base layer with a base layer depth and the one or more mandrels having a first mandrel depth and a second mandrel depth.

公开(公告)号：US20180138068A1

公开(公告)日：2018-05-17

申请号：US15871855

申请日：2018-01-15

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Jeffrey C. Hudgens

IPC: H01L21/677 ,  H01L21/673 ,  B65D85/00

CPC classification number: H01L21/67763 ,  B65D85/70 ,  H01L21/67386 ,  H01L21/67393 ,  H01L21/67775 ,  Y10S414/137

Abstract: An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

公开(公告)号：US20170301570A1

公开(公告)日：2017-10-19

申请号：US15477139

申请日：2017-04-03

Applicant: Semiconductor Manufacturing International (Shanghai) Corporation ,  Semiconductor Manufacturing International (Beijing) Corporation

Inventor： Si Jun NIAN ,  Tzu Chieh CHIEN ,  Xiao Jin LI ,  Pan Lin DONG

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/6773 ,  H01L21/6732 ,  H01L21/67383 ,  H01L21/67763 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/6779

Abstract: A wafer cassette and a method for placing a wafer are provided. The wafer cassette includes a box body including a plurality of groups of card slots formed on sidewalls of the box body. Each group of the card slots is configured to hold a wafer and includes a wafer input terminal. The wafer cassette also includes a guide device including a plurality of groups of guide slots configured to be docked to the wafer input terminals. Each group of the guide slots and a docking group of the card slots are formed at a same floor.

公开(公告)号：US09661761B2

公开(公告)日：2017-05-23

申请号：US13965194

申请日：2013-08-13

Applicant: Unimicron Technology Corp.

Inventor： Chun-Ting Lin

IPC: H05K3/46 ,  H05K3/40 ,  H05K3/06 ,  H01L23/00

CPC classification number: H05K3/40 ,  H01L21/67265 ,  H01L21/673 ,  H01L21/67346 ,  H01L21/67763 ,  H01L21/6779 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12042 ,  H05K1/11 ,  H05K3/06 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0979 ,  H05K2203/0369 ,  H05K2203/0376 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00

Abstract: A carrier substrate includes an insulation layer, conductive towers and a circuit structure layer. A diameter of each of the conductive towers is increased gradually from a top surface to a bottom surface, and the conductive towers include first conductive towers and second conductive towers surrounding the first conductive towers. The circuit structure layer is disposed on the insulation layer and includes at least one dielectric layer, at least two circuit layers and first conductive vias. Each of the second conductive towers correspondingly connects to at least two of the first conductive vias, and each of the first conductive towers correspondingly connects to one of the first conductive vias. An interface exists between the first conductive vias and the first and the second conductive towers.

公开(公告)号：US20160189993A1

公开(公告)日：2016-06-30

申请号：US14903072

申请日：2014-07-02

Applicant: HITACHI KOKUSAI ELECTRIC INC.

Inventor： Yoshihiko NAKAGAWA ,  Hiroshi KOTANI

IPC: H01L21/673 ,  C23C16/455 ,  C23C16/52 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67389 ,  C23C16/455 ,  C23C16/52 ,  H01L21/67253 ,  H01L21/67353 ,  H01L21/67763 ,  H01L21/67772

Abstract: A substrate processing apparatus includes a process chamber configured to process a substrate, a carrier mounting part configured to mount a carrier which accommodates the substrate, the substrate capable of being brought into and out of the carrier when a door of the carrier mounted on the carrier mounting part is opened, a carrier opener configured to open and close the door of the carrier mounted on the carrier mounting part, a purge gas supply part configured to supply an inert gas into the carrier with the door kept opened, and a control part configured to perform control so as to carry out at least one inert gas purge among a load purge, an unload purge and a standby purge.

Abstract translation: 基板处理装置包括：处理室，被配置为处理基板;载体安装部，其构造成安装容纳基板的载体，所述基板能够在载体的门安装在载体上时进入和离开载体 打开安装部件，构造成打开和关闭安装在托架安装部上的托架的门的托架开启器，构造成在门保持打开的状态下将惰性气体供应到托架中的清除气体供给部件，以及配置 以执行控制，以便在负载清除，卸载吹扫和备用吹扫之间执行至少一个惰性气体吹扫。

公开(公告)号：US20150155192A1

公开(公告)日：2015-06-04

申请号：US14541934

申请日：2014-11-14

Applicant: Brooks Automation, Inc.

Inventor： Ulysses Gilchrist ,  Michael L. Bufano ,  William Fosnight ,  Christopher Hofmeister ,  Gerarld M. Friedman

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67763 ,  H01L21/67326 ,  H01L21/67353 ,  H01L21/67369 ,  H01L21/67373 ,  H01L21/67376 ,  H01L21/67383 ,  H01L21/67389 ,  H01L21/67393 ,  H01L21/67772 ,  H01L21/67778 ,  H01L21/6779 ,  Y10S414/139

Abstract: A substrate transport apparatus is provided. The apparatus has a casing and a door. The casing is adapted to form a controlled environment therein. The casing has supports therein for holding at least one substrate in the casing. The casing defines a substrate transfer opening through which a substrate transport system accesses the substrate in the casing. The door is connected to the casing for closing the substrate transfer opening in the casing. The casing has structure forming a fast swap element allowing replacement of the substrate from the apparatus with another substrate without retraction of the substrate transport system and independent of substrate loading in the casing.

Abstract translation: 提供了一种基板输送装置。 该装置具有外壳和门。 壳体适于在其中形成受控的环境。 壳体具有用于在壳体中保持至少一个基板的支撑。 壳体限定衬底传送开口，衬底传送系统通过该衬底传送系统访问壳体中的衬底。 门连接到壳体以封闭壳体中的基板传送开口。 壳体具有形成快速互换元件的结构，其允许用另一个基板从设备更换基板，而不会退回基板输送系统，而与壳体中的基板负载无关。

公开(公告)号：US20150083640A1

公开(公告)日：2015-03-26

申请号：US14558445

申请日：2014-12-02

Applicant: Entegris, Inc.

Inventor： Barry GREGERSON ,  Michael S. ADAMS ,  Jason T. STEFFENS

IPC: B65D25/10 ,  H01L21/673 ,  B65D85/00 ,  B65D25/28 ,  B65D43/02

CPC classification number: B65D25/103 ,  B65D25/28 ,  B65D43/02 ,  B65D85/70 ,  H01L21/6732 ,  H01L21/67369 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67763

Abstract: A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion includes a means for accommodating large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.

Abstract translation: 用于大直径晶片的前半导体开口晶片容器包括容器部分和门。 容器部分包括左封闭侧，右封闭侧，闭合背部，开放前部和包括用于接收和容纳晶片的多个狭槽的开放内部。 门可附接到容器部分以封闭敞开的前部，并可选择性地闩锁到容器部分。 容器部分包括用于容纳大直径晶片的装置，特别是450mm的晶片。 提供优化的下垂控制以及增强的结构刚度和晶片座位功能。