SEALED SUBSTRATE CARRIERS AND SYSTEMS AND METHODS FOR TRANSPORTING SUBSTRATES

    公开(公告)号:US20230253228A1

    公开(公告)日:2023-08-10

    申请号:US18130302

    申请日:2023-04-03

    Abstract: A semiconductor processing system includes a first component forming a first chamber. A first sealed environment in the first chamber is at a first state prior to a door being opened. A load port structure is disposed between the first component and a second component. The load port structure includes walls disposed around an opening of the load port structure. The load port structure is separate from the first component and the second component. A third component is configured to change at least one of the first state of the first sealed environment within the first chamber or a second state of a second sealed environment within a second chamber formed by the second component to cause the first state and the second state to be substantially similar before the door between the first sealed environment and the second sealed environment is opened.

    Sealed substrate carriers and systems and methods for transporting substrates

    公开(公告)号:US11990358B2

    公开(公告)日:2024-05-21

    申请号:US18130302

    申请日:2023-04-03

    Abstract: A semiconductor processing system includes a first component forming a first chamber. A first sealed environment in the first chamber is at a first state prior to a door being opened. A load port structure is disposed between the first component and a second component. The load port structure includes walls disposed around an opening of the load port structure. The load port structure is separate from the first component and the second component. A third component is configured to change at least one of the first state of the first sealed environment within the first chamber or a second state of a second sealed environment within a second chamber formed by the second component to cause the first state and the second state to be substantially similar before the door between the first sealed environment and the second sealed environment is opened.

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