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    Beam forming auxiliary unit for antenna and terminal including the same
    61.
    发明授权
    Beam forming auxiliary unit for antenna and terminal including the same 有权

    公开(公告)号：US10601111B2

    公开(公告)日：2020-03-24

    申请号：US15822781

    申请日：2017-11-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seungtae Ko ,  Jungsuek Oh ,  Youngju Lee

    IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q15/00 ,  H01Q19/28 ,  H01Q3/30 ,  H01Q3/40 ,  H01Q21/22 ,  H01Q15/23 ,  H01Q19/06 ,  H01Q21/00 ,  H04B7/06

    Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A terminal is provided. The terminal includes a metal bezel disposed along an edge of the terminal, an antenna incorporated into the terminal and configured to emit electronic waves, and a beam forming auxiliary unit incorporated into the terminal, separately disposed by a predetermined distance from the antenna, and configured such that the electronic waves emitted from the antenna pass through the metal bezel.

    Separable antenna and electronic device comprising same
    63.
    发明授权
    Separable antenna and electronic device comprising same 有权

    公开(公告)号：US12300898B2

    公开(公告)日：2025-05-13

    申请号：US18192910

    申请日：2023-03-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sanghoon Park ,  Kwanghyun Baek ,  Juneseok Lee ,  Dohyuk Ha ,  Jungho Park ,  Youngju Lee ,  Jungyub Lee ,  Jinsu Heo

    IPC: H01Q21/28 ,  H01Q1/22

    Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.

    Antenna module and device including same
    64.
    发明授权
    Antenna module and device including same 有权

    公开(公告)号：US12218407B2

    公开(公告)日：2025-02-04

    申请号：US17946688

    申请日：2022-09-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Juneseok Lee ,  Youngsub Kim ,  Sanghoon Park ,  Jungho Park ,  Kwanghyun Baek ,  Youngju Lee ,  Jungyub Lee ,  Dohyuk Ha ,  Jinsu Heo

    IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q1/38

    Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.

    Antenna structure and electronic device including the same
    65.
    发明授权
    Antenna structure and electronic device including the same 有权

    公开(公告)号：US12107334B2

    公开(公告)日：2024-10-01

    申请号：US18075850

    申请日：2022-12-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Bumhee Lee ,  Seungtae Ko ,  Junsig Kum ,  Yoongeon Kim ,  Seokmin Lee ,  Youngju Lee ,  Jongmin Lee ,  Seungho Choi

    IPC: H01Q1/24 ,  H01Q21/00

    CPC classification number: H01Q21/0006 ,  H01Q1/246

    Abstract: The disclosure relates to a fifth generation (5G) or pre-5G communication system supporting higher data rates after a fourth generation (4G) communication system such as Long Term Evolution (LTE). A module in a wireless communication system is provided. The module includes a plurality of antenna elements, an antenna substrate coupled to the plurality of antenna elements, a metal plate coupled to the antenna substrate, a calibration substrate coupled to a Radio Frequency (RF) component on a first face, and a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate. The conductive adhesive material may be coupled to the calibration substrate on a second face different from the first face of the calibration substrate. The conductive adhesive material may include an air gap formed along a signal line included in the calibration substrate.

    INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
    68.
    发明申请
    INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20230139839A1

    公开(公告)日：2023-05-04

    申请号：US18090876

    申请日：2022-12-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Choonghyun Lee ,  Joonyong Choe ,  Youngju Lee

    IPC: H01L23/522 ,  H10B12/00 ,  H01L21/768

    Abstract: An integrated circuit device includes a conductive line including a metal layer and an insulation capping structure covering the conductive line. The first insulation capping structure includes a first insulation capping pattern that is adjacent to the metal layer in the insulation capping structure and has a first density, and a second insulation capping pattern spaced apart from the metal layer with the first insulation capping pattern therebetween and having a second density that is greater than the first density. In order to manufacture the integrated circuit device, the conductive line having a metal layer is formed on a substrate, a first insulation capping layer having the first density is formed directly on the metal layer, and a second insulation capping layer having the second density that is greater than the first density is formed on the first insulation capping layer.

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