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公开(公告)号：US08952503B2
公开(公告)日：2015-02-10
申请号：US13752737
申请日：2013-01-29
发明人： William L. Brodsky , Timothy W. Budell , Samuel R. Connor , Mark Curtis Hayes Lamorey , Janak G. Patel , Peter Slota, Jr. , David B. Stone
IPC分类号： H01L23/552 , H01L23/29 , H01L21/50 , H01L23/31
CPC分类号： H01L23/552 , H01L21/50 , H01L23/053 , H01L23/295 , H01L23/3128 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/14 , H01L2924/15311 , H01L2924/16172 , H01L2924/16178 , H01L2924/16179 , H01L2924/167 , H01L2924/1676 , H01L2924/16793 , H01L2924/16798 , H01L2924/19041 , H01L2924/19105 , H05K3/284 , H05K9/0081 , Y10T29/49128 , H01L2924/014
摘要： Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An electromagnetic interference (EMI) shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.
摘要翻译： 用于电子封装的装置和方法，其包含防止电磁干扰（EMI）发射的屏蔽。 根据集成电路结构，衬底在印刷电路板上。 集成电路芯片在基板上。 集成电路芯片电连接到基板。 电磁干扰（EMI）屏蔽单元位于集成电路芯片和基板上。 EMI屏蔽单元包括覆盖集成电路芯片的盖和集成电路芯片外的基板的部分。 填充材料可以沉积在形成在盖和基底之间的空腔内。 填充材料包括EMI吸收材料。 盖的周边包括侧裙，侧裙围绕集成电路芯片和衬底。 EMI吸收材料在印刷电路板上，并且侧裙的一部分嵌入在EMI吸收材料中。
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公开(公告)号：US20150033554A1
公开(公告)日：2015-02-05
申请号：US14515597
申请日：2014-10-16
发明人： William L. Brodsky , Timothy W. Budell , Samuel R. Connor , Mark Curtis Hayes Lamorey , Janak G. Patel , Peter Slota, JR. , David B. Stone
IPC分类号： H05K3/28 , H01L23/552 , H05K9/00
CPC分类号： H01L23/552 , H01L21/50 , H01L23/053 , H01L23/295 , H01L23/3128 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/14 , H01L2924/15311 , H01L2924/16172 , H01L2924/16178 , H01L2924/16179 , H01L2924/167 , H01L2924/1676 , H01L2924/16793 , H01L2924/16798 , H01L2924/19041 , H01L2924/19105 , H05K3/284 , H05K9/0081 , Y10T29/49128 , H01L2924/014
摘要： Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An EMI shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.
摘要翻译： 用于电子封装的装置和方法，其包含防止电磁干扰（EMI）发射的屏蔽。 根据集成电路结构，衬底在印刷电路板上。 集成电路芯片在基板上。 集成电路芯片电连接到基板。 EMI屏蔽单元位于集成电路芯片和基板上。 EMI屏蔽单元包括覆盖集成电路芯片的盖和集成电路芯片外的基板的部分。 填充材料可以沉积在形成在盖和基底之间的空腔内。 填充材料包括EMI吸收材料。 盖的周边包括侧裙，侧裙围绕集成电路芯片和衬底。 EMI吸收材料在印刷电路板上，并且侧裙的一部分嵌入在EMI吸收材料中。
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公开(公告)号：US10956623B2
公开(公告)日：2021-03-23
申请号：US16007408
申请日：2018-06-13
发明人： Silvio Dragone , Michael Fisher , William Santiago Fernandez , Ryan Elsasser , James Busby , John R. Dangler , William L. Brodsky , David C. Long , Stefano S. Oggioni
IPC分类号： G06F21/87 , H01L41/04 , H01L41/047 , H01L41/37 , H01L41/113 , H01L41/18 , H01L41/23 , H01L41/053
摘要： The present invention relates to a method to fabricate a tamper respondent assembly. The tamper respondent assembly includes an electronic component and an enclosure fully enclosing the electronic component. The method includes printing, by a 3-dimensional printer, a printed circuit board that forms a bottom part of the enclosure and includes a first set of embedded detection lines for detecting tampering events and signal lines for transferring signals between the electronic component and an external device. The electronic component is assembled on the printed circuit board, and a cover part of the enclosure is printed on the printed circuit board. The cover part includes a second set of embedded detection lines. Sensing circuitry can be provided for sensing the conductance of the first set of embedded detection lines and the second set of embedded detection lines to detect tampering events.
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公开(公告)号：US10903608B1
公开(公告)日：2021-01-26
申请号：US16551861
申请日：2019-08-27
发明人： Suraush Khambati , William L. Brodsky , Ryan Elsasser , Noah Singer , Khaalid Persaud Juggan McMillan
IPC分类号： H01R13/66 , H01R33/76 , H01R107/00
摘要： Multi-directional monitoring of connector motion is provided to facilitate identifying potential wear of one or more connector electrodes. A sensor assembly is configured to sense in multiple directions motion of a plug connector relative to a connector receptacle when the plug connector is operatively plugged to the connector receptacle, and to generate sensor data based on sensed motion of the plug connector relative to the connector receptacle. A control system is provided to monitor, based on the sensor data, motion of the plug connector relative to the connector receptacle to facilitate identifying potential wear of one or more electrodes of the plug electrode(s) and the receptacle electrode(s) due to the motion.
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公开(公告)号：US10834491B2
公开(公告)日：2020-11-10
申请号：US16145967
申请日：2018-09-28
发明人： William L. Brodsky , Byron S. Green , Robert K. Mullady , Jeffrey A. Newcomer , Arkadiy O. Tsfasman , John S. Werner
摘要： Acoustic attenuating ear muffs include a first ear pod having a first ear cup provide with a first acoustic attenuating member including an outer surface, and a first opening. A second ear pod includes a second ear cup having a second acoustic attenuating member including an outer surface portion, and a second opening. A first selectively deployable plug member is mounted to the outer surface of the first acoustic attenuating member. A second selectively deployable plug member mounted to the outer surface of the second acoustic attenuating member. An acoustic sensor is operable to detect ambient noise. An actuator system is operable to shift the first and second selectively deployable plug members into corresponding ones of the first and second openings based on ambient noise detected by the acoustic sensor.
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公开(公告)号：US10700466B2
公开(公告)日：2020-06-30
申请号：US16175801
申请日：2018-10-30
IPC分类号： H01R13/44 , H01R13/453 , H01R43/26 , H01R13/631
摘要： A connector system that includes first and second connector components. The first connector component includes a female connector. The second connector component includes a male connector having blades for insertion into the female connector; an enclosure enclosing the male connector and having an open end wherein the blades of the male connector face the open end; a locked shield within the open end of the enclosure to obscure the blades and to prevent contact with the blades; and an actuator to unlock the locked shield. Upon insertion of the first connector component into the enclosure, the first connector component causes the actuator to unlock the locked shield and upon further insertion of the first connector component into the enclosure, the first connector component opens the unlocked shield away from the male connector to expose the blades and to allow the female connector to engage the blades of the male connector.
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公开(公告)号：US10685146B2
公开(公告)日：2020-06-16
申请号：US16358956
申请日：2019-03-20
摘要： Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
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公开(公告)号：US20200163592A1
公开(公告)日：2020-05-28
申请号：US16201163
申请日：2018-11-27
发明人： John S. Werner , Byron S. Green , William L. Brodsky , Robert K. Mullady , Jeffrey A. Newcomer , Arkadiy O. Tsfasman
摘要： A device is used to monitor, in real-time, one or more environment conditions of an environment in which a user is located. Based on the monitoring, an alert condition relating to the environment is detected. Based on detecting the alert condition, on-demand testing of a sensory component of the user is initiated. The on-demand testing tests for a selected condition relating to the health of the user.
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公开(公告)号：US20190320560A1
公开(公告)日：2019-10-17
申请号：US16448236
申请日：2019-06-21
IPC分类号： H05K9/00 , H01R13/74 , H01R13/6584 , H01R13/6592
摘要： A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.
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公开(公告)号：US10378925B2
公开(公告)日：2019-08-13
申请号：US16162679
申请日：2018-10-17
发明人： William L. Brodsky , Silvio Dragone , Roger S. Krabbenhoft , David C. Long , Stefano S. Oggioni , Michael T. Peets , William Santiago-Fernandez
摘要： Electronic circuits, electronic packages, and methods of fabrication are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.
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