公开(公告)号：US09080932B2

公开(公告)日：2015-07-14

申请号：US13892748

申请日：2013-05-13

Applicant: Apple Inc.

Inventor： Dhaval N. Shah ,  Shayan Malek ,  Vivek Katiyar

IPC: G01N3/30 ,  G01M99/00 ,  G01N3/303 ,  G01N33/00

CPC classification number: G01N3/30 ,  G01L1/2262 ,  G01L1/2287 ,  G01M5/0033 ,  G01M99/00 ,  G01N3/303 ,  G01N2033/0078 ,  G01P15/0891 ,  G06F1/1633 ,  H04M1/0277 ,  H04M1/185 ,  H04M2250/12

Abstract: An electronic device may contain electrical components mounted on one or more substrates such as printed circuit boards. During a drop event, the printed circuit boards and components may be subjected to stresses. Strain gauges may be formed from metal traces embedded within dielectric layers in the printed circuit boards. The strain gauges may be used to make stress measurements at various locations on the boards. Stress data may be collected in response to data from an accelerometer indicating that the device has been dropped. Stress data collection may be halted in response to determining that the device has struck an external surface. Impact may be detected using accelerometer data, strain gauge output, or other sensor data. Stress data may be analyzed by the electronic device or external equipment.

Abstract translation: 电子设备可以包含安装在诸如印刷电路板的一个或多个基板上的电气部件。 在跌落事件期间，印刷电路板和部件可能受到应力。 应变计可以由嵌入印刷电路板的电介质层中的金属迹线形成。 应变计可用于在板上的各个位置进行应力测量。 应答数据可以响应于来自加速度计的数据而被收集，表示该设备已被丢弃。 响应于确定设备已经撞击到外部表面，可以停止压力数据收集。 可以使用加速度计数据，应变计输出或其他传感器数据检测影响。 应力数据可以由电子设备或外部设备分析。

公开(公告)号：US08982582B2

公开(公告)日：2015-03-17

申请号：US13690629

申请日：2012-11-30

Applicant: Apple Inc.

Inventor： Shayan Malek ,  John B. Ardisana, II ,  Michael B. Wittenberg

IPC: H02G3/32 ,  H01Q1/24 ,  H01Q1/38

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H02G3/32

Abstract: An electronic device contains circuitry such as radio-frequency transceiver circuitry and antenna structures that are coupled using transmission line paths such as coaxial cable paths. A coaxial cable is mounted within an electronic device housing cable mounting structures. The coaxial cable has a meandering portion that forms a service loop. The cable mounting structures includes grooves that receive the meandering portion of the cable. The grooves may be formed within a molded plastic body. Patterned metal may be formed on the surface of the molded plastic body using laser-based processing techniques. The cable in the meandering portion may have a segment in which an outer cable conductor is exposed. The patterned metal on the molded plastic body may short the exposed outer conductor to the electronic device housing or other ground structure.

Abstract translation: 电子设备包含诸如射频收发器电路和使用诸如同轴电缆路径的传输线路径耦合的天线结构的电路。 同轴电缆安装在电子设备外壳电缆安装结构内。 同轴电缆具有形成服务循环的曲折部分。 电缆安装结构包括接收电缆的曲折部分的槽。 凹槽可以形成在模制塑料体内。 可以使用基于激光的处理技术在模制塑料体的表面上形成图案化的金属。 蜿蜒部分中的电缆可以具有露出外部电缆导体的部分。 模制的塑料体上的图案化的金属可能将暴露的外部导体缩短到电子设备外壳或其他接地结构。

公开(公告)号：US20150060126A1

公开(公告)日：2015-03-05

申请号：US14015938

申请日：2013-08-30

Applicant: Apple Inc.

Inventor： Shayan Malek ,  John B. Ardisana, II ,  Dhaval N. Shah

IPC: H05K1/11

CPC classification number: H05K1/0284 ,  H05K1/115 ,  H05K1/141 ,  H05K3/36 ,  H05K2201/09145 ,  H05K2201/10598 ,  H05K2203/061

Abstract: The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.

Abstract translation: 所描述的实施例通常涉及电子设备和用于增加与其相关联的电路板上的可用空间的三维模块。 在一些实施例中，模块可以具有长方体几何形状，并且可以包括多个表面，其具有被配置为互连布置在模块的各个表面上的电子部件的嵌入式电路迹线。 模块的一个表面可以包括至少一个通信接口，其被配置为将模块上的电路迹线互连到与模块耦合到的电路板上的相关联的电路路径。 在一些实施例中，该模块可以作为电路板和电子设备的另一个组件之间的间隔来操作。

公开(公告)号：USD719085S1

公开(公告)日：2014-12-09

申请号：US29466512

申请日：2013-09-09

Applicant: Apple Inc.

Designer： Shota Aoyagi ,  Richard Hung Minh Dinh ,  Richard P. Howarth ,  Daniel W. Jarvis ,  Shayan Malek ,  Gregory Stephens

公开(公告)号：US20140339736A1

公开(公告)日：2014-11-20

申请号：US13895954

申请日：2013-05-16

Applicant: Apple Inc.

Inventor： Michael B. Wittenberg ,  Miguel C. Christophy ,  Daniel W. Jarvis ,  Shayan Malek

IPC: B29C45/76

CPC classification number: B29C45/7613 ,  B29C45/0025 ,  B29C45/2806 ,  B29C45/30 ,  B29C2045/306

Abstract: The described embodiments relate generally to improvements to injection molding equipment. More specifically, concepts for reducing sink and improving cosmetics of portions of injection molded parts in close proximity to gate areas of an injection mold are disclosed. A cold runner system is described in which molding material disposed in a mold cavity is separated from excess molding material in the runner system shortly after the mold is filled at a predetermined packing pressure.

Abstract translation: 所描述的实施例一般涉及注射成型设备的改进。 更具体地，公开了一种用于减少注射模具的浇注区域附近的注射成型部件的凹部和改善化妆品的概念。 描述了一种冷流道系统，其中在模具以预定包装压力填充之后不久，设置在模腔中的成型材料与流浆系统中的多余成型材料分离。

公开(公告)号：US20140159989A1

公开(公告)日：2014-06-12

申请号：US13706758

申请日：2012-12-06

Applicant: APPLE INC.

Inventor： Shayan Malek ,  John B. Ardisana, II ,  Michael B. Wittenberg

IPC: H01Q1/50 ,  H01P11/00

CPC classification number: H01Q1/243 ,  H01Q7/00 ,  H01Q9/0421 ,  H01Q9/0442 ,  H01Q13/10 ,  Y10T29/49018

Abstract: Adjustable antenna structures may be used to compensate for manufacturing variations in electronic device antennas. An electronic device antenna may have an antenna feed and conductive structures such as portions of a peripheral conductive electronic device housing member and other conductive antenna structures. The adjustable antenna structures may have a movable dielectric support. Multiple conductive paths may be formed on the dielectric support. The movable dielectric support may be installed within an electronic device housing so that a selected one of the multiple conductive paths is coupled into use to convey antenna signals. Coupling the selected path into use adjusts the position of an antenna feed terminal for the antenna feed and compensates for manufacturing variations in the conductive antenna structures that could potentially lead to undesired variations in antenna performance.

Abstract translation: 可调节天线结构可用于补偿电子设备天线的制造变化。 电子设备天线可以具有天线馈电和导电结构，例如外围导电电子器件壳体部件和其它导电天线结构的部分。 可调天线结构可以具有可移动的电介质支撑。 可以在介电支撑件上形成多个导电路径。 可移动介电支撑件可以安装在电子设备壳体内，使得多个导电路径中的所选择的一个被耦合到用于传送天线信号。 将所选择的路径耦合到使用中调整用于天线馈电的天线馈电端子的位置，并且补偿导电天线结构中可能导致天线性能的不期望变化的制造变化。

公开(公告)号：US20140153211A1

公开(公告)日：2014-06-05

申请号：US13690629

申请日：2012-11-30

Applicant: APPLE INC.

Inventor： Shayan Malek ,  John B. Ardisana, II ,  Michael B. Wittenberg

IPC: H05K5/02 ,  H02G3/04

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H02G3/32

Abstract: An electronic device contains circuitry such as radio-frequency transceiver circuitry and antenna structures that are coupled using transmission line paths such as coaxial cable paths. A coaxial cable is mounted within an electronic device housing cable mounting structures. The coaxial cable has a meandering portion that forms a service loop. The cable mounting structures includes grooves that receive the meandering portion of the cable. The grooves may be formed within a molded plastic body. Patterned metal may be formed on the surface of the molded plastic body using laser-based processing techniques. The cable in the meandering portion may have a segment in which an outer cable conductor is exposed. The patterned metal on the molded plastic body may short the exposed outer conductor to the electronic device housing or other ground structure.

Abstract translation: 电子设备包含诸如射频收发器电路和使用诸如同轴电缆路径的传输线路径耦合的天线结构的电路。 同轴电缆安装在电子设备外壳电缆安装结构内。 同轴电缆具有形成服务循环的曲折部分。 电缆安装结构包括接收电缆的曲折部分的槽。 凹槽可以形成在模制塑料体内。 可以使用基于激光的处理技术在模制塑料体的表面上形成图案化的金属。 蜿蜒部分中的电缆可以具有露出外部电缆导体的部分。 模制的塑料体上的图案化的金属可能将暴露的外部导体缩短到电子设备外壳或其他接地结构。

公开(公告)号：US20140140533A1

公开(公告)日：2014-05-22

申请号：US13682609

申请日：2012-11-20

Applicant: APPLE INC.

Inventor： Shayan Malek ,  Michael B. Wittenberg ,  Warren Z. Jones

IPC: H04R1/02 ,  H04R1/10 ,  H04R31/00 ,  H04R1/08

CPC classification number: H04R31/006 ,  H04R1/06 ,  H04R1/086 ,  H04R2499/11 ,  Y10T29/4998

Abstract: An electronic device has a housing in which components are installed. The components contain audio components having audio ports and terminals. Elastomeric material is molded over the surface of an audio component so that the leads attached to the terminals protrude through the elastomeric material. The protruding portions of the leads are bent back to lie flush with the surface of the elastomeric material. The elastomeric material are configured to form elastomeric structures with an opening that is aligned with the audio port in a component. The housing of an electronic device has one or more openings that form an audio port. The opening in the elastomeric structures that are molded onto the audio component is aligned with the audio port in the housing and the audio port in the audio component. Mesh structures cover the audio port in the housing.

Abstract translation: 电子设备具有其中安装有部件的壳体。 这些组件包含具有音频端口和终端的音频组件。 弹性材料被模制在音频部件的表面上，使得附接到端子的引线突出穿过弹性体材料。 引线的突出部分被折回以与弹性体材料的表面齐平。 弹性体材料被构造成形成具有与部件中的音频端口对准的开口的弹性体结构。 电子设备的壳体具有形成音频端口的一个或多个开口。 模制在音频组件上的弹性体结构中的开口与外壳中的音频端口和音频组件中的音频端口对准。 网格结构覆盖了外壳中的音频端口。

公开(公告)号：US20140085859A1

公开(公告)日：2014-03-27

申请号：US13628773

申请日：2012-09-27

Applicant: APPLE INC.

Inventor： Lee E. Hooton ,  Michael B. Wittenberg ,  Shayan Malek

IPC: F21V21/00 ,  G03B15/02 ,  H05K7/20

CPC classification number: G03B15/02 ,  G03B2215/0567

Abstract: An electronic device may be provided with an electronic component such as a camera light source containing a light-emitting diode. During operation, the light-emitting diode may produce heat. Thermally conducting elastomeric structures may have features such as sidewalls that mate with external surface of the camera light source or other electronic component to dissipate heat from the electronic component. Metal structures such as a bracket may be used to press the elastomeric structures and the electronic component towards a wall of a housing for the electronic device. Support structures may be interposed between the wall of the housing and the elastomeric structures. The support structures may have an opening that is aligned with an opening in the housing wall. Insert structures may be received within the opening in the support structures. The electronic component may be aligned with the insert structures and the opening in the support structures.

Abstract translation: 电子设备可以设置有诸如包含发光二极管的照相机光源的电子部件。 在操作期间，发光二极管可能产生热量。 导热弹性体结构可具有诸如与相机光源或其他电子部件的外表面相配合以散发来自电子部件的热量的侧壁的特征。 诸如支架的金属结构可用于将弹性体结构和电子部件朝向用于电子装置的壳体的壁挤压。 支撑结构可以插入在壳体的壁和弹性体结构之间。 支撑结构可以具有与壳体壁中的开口对准的开口。 插入结构可以被容纳在支撑结构内的开口内。 电子部件可以与插入结构和支撑结构中的开口对准。

公开(公告)号：US20130233611A1

公开(公告)日：2013-09-12

申请号：US13631236

申请日：2012-09-28

Applicant: APPLE INC.

Inventor： Shayan Malek ,  Scott A. Myers ,  Michael B. Wittenberg

IPC: H05K9/00 ,  B29C37/00

CPC classification number: H05K9/0032

Abstract: One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction.

Abstract translation: 模制屏蔽件的一个实施例可以包括符合并接收电气部件的空腔，适合和接收金属框架的狭缝以及耦合到模制屏蔽件的顶侧和侧面的金属层。 在一个实施例中，模制的屏蔽可以由硅形成，并且可以包括用于增强导电性的材料。 模制的屏蔽件可以耦合到金属框架，金属框架又可以耦合到地面，所得到的结构用于减少电气排放。 模制的屏蔽件可以通过传导将热量从电气部件传送出去。