Electronic device having a composite structure

    公开(公告)号:US11418638B2

    公开(公告)日:2022-08-16

    申请号:US16569525

    申请日:2019-09-12

    Applicant: Apple Inc.

    Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

    SUBSTRATE MARKING FOR SEALING SURFACES
    66.
    发明申请

    公开(公告)号:US20190077177A1

    公开(公告)日:2019-03-14

    申请号:US16126984

    申请日:2018-09-10

    Applicant: Apple Inc.

    Abstract: An electronic device includes a housing having an opening that includes an interior surface with a portion that is only viewable from an external vantage point at a viewing angle that is other than ninety degrees (90°). The electronic device also includes a SIM card tray that is removable from the housing via the opening and the SIM card tray includes an angled surface. Information is encoded in the form of text that is laser etched on the angled surface. The text is characterized as having an aspect ratio that corresponds to the viewing angle.

    Thermal features of an electronic device and method for forming an electronic device including thermal features

    公开(公告)号:US10156874B2

    公开(公告)日:2018-12-18

    申请号:US15146825

    申请日:2016-05-04

    Applicant: Apple Inc.

    Abstract: This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.

    Acoustic mesh and methods of use for electronic devices
    69.
    发明授权
    Acoustic mesh and methods of use for electronic devices 有权
    声网和电子设备的使用方法

    公开(公告)号:US09538272B2

    公开(公告)日:2017-01-03

    申请号:US14659319

    申请日:2015-03-16

    Applicant: APPLE INC.

    Abstract: An acoustically permeable material is disposed within an aperture of an electronic device to provide aesthetic appeal for the electronic device and protection for an acoustic device mounted within the electronic device. A stiffener is used in conjunction with the acoustically permeable material to improve its ability to resist permanent mechanical deformation from external forces. In some embodiments the stiffener may have multiple cavities enabling improved isolation between multiple acoustic devices within the same aperture. Other methods of employing acoustically permeable materials are disclosed that improve the aesthetic appeal, acoustic performance and/or manufacturability of the electronic device.

    Abstract translation: 声透性材料设置在电子设备的孔内,以为电子设备提供美观的吸引力,并且保护安装在电子设备内的声学设备。 加强筋与声透射材料结合使用,以提高其抗外力的永久性机械变形的能力。 在一些实施例中,加强件可以具有多个空腔,从而能够改善在同一孔内的多个声学装置之间的隔离。 公开了采用声透射材料的其它方法,其提高了电子设备的美学吸引力,声学性能和/或可制造性。

    Flexible shock absorbing connections within a mobile computing device
    70.
    发明授权
    Flexible shock absorbing connections within a mobile computing device 有权
    移动计算设备内的灵活的减震连接

    公开(公告)号:US09318802B2

    公开(公告)日:2016-04-19

    申请号:US14567850

    申请日:2014-12-11

    Applicant: Apple Inc.

    CPC classification number: H01R11/01 H01Q1/20 H01Q1/243 H01Q1/50 H01R4/48

    Abstract: The subject matter of the disclosure relates to connectors for antenna feed assemblies and display coupling components of a mobile device. The flexible connectors can be configured with a flexible spring connector component that couples a mobile device antenna to a main logic board of the mobile device within a housing of the mobile device such that the flexible connector can withstand a drop event, while at the same providing for an in-line inductance as part of an antenna-defined design requirement. The display of the mobile device can be coupled to a housing of the mobile device using a pin-screw arrangement that allows the display to controllably shift in the X-direction and the Y-direction, while only being purposefully constrained in the Z-direction (with reference to a 3-dimensional graph having X, Y, and Z axes). This configuration can prevent the display from being pulled out of alignment during a drop event.

    Abstract translation: 本公开的主题涉及用于移动设备的天线馈送组件和显示器耦合部件的连接器。 柔性连接器可以配置有柔性弹簧连接器部件,该柔性弹簧连接器部件将移动设备天线耦合到移动设备的壳体内的移动设备的主逻辑板,使得柔性连接器能够承受跌落事件,同时在相同的提供 作为天线定义设计要求的一部分的串联电感。 移动装置的显示器可以使用销螺钉装置联接到移动装置的壳体,该销螺钉装置允许显示器在X方向和Y方向上可控地移动,同时仅在Z方向上被有目的地约束 (参考具有X,Y和Z轴的三维图)。 此配置可以防止在丢弃事件期间显示被拉出对齐。

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