Image reading device and image forming apparatus configured to determine measurements of an object-to-be scanned

    公开(公告)号:US11743403B2

    公开(公告)日:2023-08-29

    申请号:US17498864

    申请日:2021-10-12

    申请人: Masahiro Ishida

    发明人: Masahiro Ishida

    摘要: An image reading device and an image forming apparatus. The image reading device includes a scanned-image acquisition unit configured to scan a mounting table to obtain image data of a to-be-scanned object placed on the mounting table, a capturing unit configured to capture an image of the to-be-scanned object to obtain image data of the to-be-scanned object, and a shape measuring device configured to perform a shape measurement process to measure a shape of the to-be-scanned object placed on the mounting table based on the image data of the to-be-scanned object obtained by the scanned-image acquisition unit and the image data of the to-be-scanned object obtained by the capturing unit. The image forming apparatus includes the image reading device and an image recording unit configured to record an image on a recording material.

    Method and apparatus for detecting positions of wafers

    公开(公告)号:US11721573B2

    公开(公告)日:2023-08-08

    申请号:US17302437

    申请日:2021-05-03

    IPC分类号: H01L21/68 G01B11/26 G01B11/24

    摘要: A method for detecting positions of wafers includes: rotating a rotation table with a wafer thereon in a first direction at a first speed; detecting a contour of the wafer rotating in the first direction at the first speed to provide contour data; rotating the rotation table in a second direction at a second speed when an aiming feature of the wafer passes the detector in the first direction at the first speed; detecting the contour of the wafer rotating in the second direction at the second speed to provide new contour data; and stopping the rotation of the rotation table and the detection of the wafer according to an accumulation of contour data and corresponding rotation angles, to estimate an eccentric position of the wafer and a position of the aiming feature when the aiming feature passes the detector in the second direction at the second speed.

    LIGHT-EMITTING APPARATUS, LIGHT-EMITTING DEVICE, AND MEASURING APPARATUS

    公开(公告)号:US20230246413A1

    公开(公告)日:2023-08-03

    申请号:US17967151

    申请日:2022-10-17

    发明人: Daisuke IGUCHI

    IPC分类号: H01S5/042 G01B11/24

    CPC分类号: H01S5/042 G01B11/24

    摘要: A light-emitting apparatus includes: a light-emitting unit including a light-emitting element; a drive unit including a first element connected to a cathode electrode provided on a cathode side of the light-emitting element, the drive unit being configured to drive the light-emitting element by supplying current that causes light emission; and a capacitive unit provided in parallel with a route of current that causes light emission, between an anode electrode provided on an anode side of the light-emitting element and the cathode electrode.

    PRODUCTION METHOD AND MEASUREMENT METHOD
    57.
    发明公开

    公开(公告)号:US20230243644A1

    公开(公告)日:2023-08-03

    申请号:US18296733

    申请日:2023-04-06

    摘要: A method for measuring a surface shape of an optical element, wherein the optical element has a main body with a substrate and a reflective surface, and wherein at least one cooling channel for receiving a coolant is formed in the substrate, comprising: a) recording a cooling channel pressure, b) recording a measurement environment pressure, c) determining a pressure difference based on the cooling channel pressure and the measurement environment pressure, d) comparing the pressure difference with a predetermined target pressure difference, e) monitoring for a deviation between the pressure difference and the target pressure difference, wherein, if a deviation greater than a predetermined limit value is detected, the cooling channel pressure is adapted in such a way that the deviation becomes less than or equal to the predetermined limit value, and f) measuring the surface shape if the deviation is less than or equal to the predetermined limit value.

    Bending estimation device, bending estimation method, and program

    公开(公告)号:US11709049B2

    公开(公告)日:2023-07-25

    申请号:US16977868

    申请日:2019-02-28

    摘要: Even when a missing portion occurs in a solid data set on a columnar structure, an estimator for a deflection value and an accuracy of the deflection value are correctly estimated according to an extent of the missing portion and the like. A measurement accuracy estimation unit (15) is included that: calculates a deflection of a columnar structure and an extent of a missing portion, from a solid data set on the columnar structure; calculates an accuracy assessment indicator for the deflection that is acquirable when a plurality of missing portion patterns occur on a virtual basis, based on a plurality of solid data sets in each of which the calculated extent of the missing portion is smaller than a preset threshold value, the accuracy assessment indicator being calculated for each missing portion pattern; and calculates an accuracy of the deflection calculated from the solid data set, based on the calculated accuracy assessment indicator for each missing portion pattern, and based on the calculated extent of the missing portion in the solid data set.