Silicon-based thermal energy transfer device and apparatus

    公开(公告)号:US09746254B2

    公开(公告)日:2017-08-29

    申请号:US13924515

    申请日:2013-06-21

    申请人: Gerald Ho Kim

    发明人: Gerald Ho Kim

    摘要: A thermal energy transfer device attached to an object to dissipate thermal energy from the object is described. In one aspect, the device includes a non-metal base plate and first and second non-metal plate structures. The base plate includes at least one groove on one of its primary surfaces. An edge of the first plate structure is received in a first groove of the at least one groove of the base plate. An edge of the second plate structure is received in a second groove of the at least one groove of the base plate. At least the first groove or the second groove is a V-notch groove such that the edge of the first plate structure or the edge of the second plate structure that is received in the first groove or the second groove is interlockingly received in the V-notch groove.

    Flat heat pipe and fabrication method thereof
    56.
    发明授权
    Flat heat pipe and fabrication method thereof 有权
    扁平热管及其制造方法

    公开(公告)号:US09179577B2

    公开(公告)日:2015-11-03

    申请号:US13572176

    申请日:2012-08-10

    申请人: Seok Hwan Moon

    发明人: Seok Hwan Moon

    摘要: Disclosed are a flat heat pipe which has a structure integrated with a heat sink, and a facilitated fabrication method thereof. The flat heat pipe includes: a flat body portion including a plurality of heat sink fins formed on an outer surface thereof, and a plurality of through-holes formed therein and being separated by at least one separation film; and at least one groove formed in at least one surface from among a top surface and a bottom surface of one side portion of each of the plurality of through-holes.

    摘要翻译: 公开了具有与散热器一体化的结构的扁平热管及其制造方法。 扁平热管包括:平坦体部分,其包括形成在其外表面上的多个散热鳍片,以及形成在其中并被至少一个分离膜隔开的多个通孔; 以及形成在所述多个通孔中的每一个的一个侧部的顶表面和底表面中的至少一个表面中的至少一个凹槽。

    MODULAR HEAT-TRANSFER SYSTEMS
    60.
    发明申请
    MODULAR HEAT-TRANSFER SYSTEMS 有权
    模块化传热系统

    公开(公告)号:US20130025818A1

    公开(公告)日:2013-01-31

    申请号:US13559340

    申请日:2012-07-26

    摘要: Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from an operable element. A manifold module can have a distribution manifold and a collection manifold. A decoupleable inlet coupler can be configured to fluidicly couple the distribution manifold to a respective heat-transfer element. A decoupleable outlet coupler can be configured to fluidicly couple the respective heat-transfer element to the collection manifold. An environmental coupler can be configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold.

    摘要翻译: 一些模块化的热传递系统可以具有至少一个传热元件的阵列,其被配置为将热量从可操作元件传递到工作流体。 歧管模块可以具有分配歧管和收集歧管。 可分离的入口联接器可以被配置成将分配歧管流体耦合到相应的传热元件。 可解耦的出口联接器可以被配置成将相应的传热元件流体耦合到收集歧管。 环境耦合器可以被构造成从收集歧管接收工作流体,将热量从工作流体传递到环境流体,或者将热量从环境流体传递到工作流体,并将工作流体排放到分配歧管 。