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公开(公告)号：US4359701A
公开(公告)日：1982-11-16
申请号：US212099
申请日：1980-12-02
Applicant: Kazuharu Aoki
Inventor： Kazuharu Aoki
IPC: H04B1/08 , H01P5/02 , H01P7/04 , H03J1/00 , H03J3/18 , H03J3/20 , H04N5/64 , H05K1/02 , H05K1/18 , H05K3/34 , H05K3/40
CPC classification number: H05K1/184 , H01P5/02 , H03J3/185 , H05K1/0243 , H01R12/523 , H05K1/0237 , H05K2201/043 , H05K2201/10015 , H05K2201/10174 , H05K2201/10295 , H05K2201/10371 , H05K2201/10454 , H05K2201/10636 , H05K2201/10643 , H05K3/3405 , H05K3/3447 , H05K3/4046 , Y02P70/611
Abstract: A printed circuit board lamination consisting of upper and lower printed circuit boards is provided with an area consisting of the sole lower printed circuit board, and a varactor diode and a resonance rod portion parallel to the lamination are arranged in this area. Thus, the length of lead of the varactor diode is reduced in effect, and also the effects of variation of the dielectric constant of the printed circuit board due to changes of the temperature thereof and relative humidity are reduced.
Abstract translation: 由上下印刷电路板组成的印刷电路板层叠件设置有由底部下印刷电路板组成的区域，并且在该区域中布置变容二极管和平行于层压件的共振杆部分。 因此，变容二极管的引线长度有效地降低，并且由于温度和相对湿度的变化也导致印刷电路板的介电常数的变化的影响降低。
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公开(公告)号：US20180347780A1
公开(公告)日：2018-12-06
申请号：US15608241
申请日：2017-05-30
Applicant: Valeo North America, Inc.
Inventor： Gavin WARNER , Patrick MARTIN , Cameron BETZ , Brian HUNT , Sergio AGUIRRE
CPC classification number: F21S41/192 , F21S41/141 , F21S41/151 , F21S41/155 , H05K1/0295 , H05K1/144 , H05K2201/041 , H05K2201/043 , H05K2201/10106 , H05K2201/10189
Abstract: A dual printed circuit board assembly for vehicle lights, the dual printed circuit board including a dual printed circuit board and a dual connector. The dual printed circuit board having a first substrate with a first layout, a second substrate opposite to the first substrate with a second layout, and a common panel that supports the first substrate on a first side and the second substrate on a second side, wherein the first layout is populable by a first plurality of light sources to be used in a first light of the vehicle lights and the second layout is populable by a second plurality of light sources to be used in a second light of the vehicle lights. The dual connector having a first jumper connector electrically connected to the first layout, and a second jumper connector opposite to the first jumper connector and electrically connected to the second layout.
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公开(公告)号：US09674960B2
公开(公告)日：2017-06-06
申请号：US14700204
申请日：2015-04-30
Inventor： Johannes Stahr , Markus Leitgeb
CPC classification number: H05K1/185 , H05K1/0218 , H05K1/0298 , H05K1/115 , H05K1/14 , H05K1/144 , H05K1/181 , H05K1/186 , H05K3/4623 , H05K3/4697 , H05K2201/041 , H05K2201/042 , H05K2201/043 , H05K2201/045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09072 , H05K2201/09618 , H05K2201/10 , H05K2201/10083 , H05K2201/10151 , Y10T29/49126 , Y10T29/49144
Abstract: A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.
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54.发明授权公开(公告)号：US09055706B2
公开(公告)日：2015-06-09
申请号：US13635364
申请日：2011-04-11
Applicant: Johannes Stahr , Markus Leitgeb
Inventor： Johannes Stahr , Markus Leitgeb
CPC classification number: H05K1/185 , H05K1/0218 , H05K1/0298 , H05K1/115 , H05K1/14 , H05K1/144 , H05K1/181 , H05K1/186 , H05K3/4623 , H05K3/4697 , H05K2201/041 , H05K2201/042 , H05K2201/043 , H05K2201/045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09072 , H05K2201/09618 , H05K2201/10 , H05K2201/10083 , H05K2201/10151 , Y10T29/49126 , Y10T29/49144
Abstract: A method for integrating a component into a printed circuit board includes the following steps: providing two completed printed circuit board elements, which more particularly consist of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression, arranging the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component integrated therein is provided.
Abstract translation: 一种用于将部件集成到印刷电路板中的方法包括以下步骤：提供两个完整的印刷电路板元件，其更具体地由多个互连的层或层组成，其中至少一个印刷电路板元件具有切口或凹陷 将要被集成在所述印刷电路板元件之一或所述至少一个印刷电路板元件的所述切口中的部件布置，并且将所述印刷电路板元件与容纳在所述切口中的部件连接，结果， 可以在印刷电路板中获得组件或传感器的安全可靠的适应。 此外，提供一种包括集成在其中的电子部件的这种类型的印刷电路板。
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公开(公告)号：US20140202742A1
公开(公告)日：2014-07-24
申请号：US14161310
申请日：2014-01-22
Applicant: CAMBRIOS TECHNOLOGIES CORPORATION
Inventor： David Jones , Paul Mansky , Michael A. Spaid
CPC classification number: H05K3/027 , B23K26/0006 , B23K26/0619 , B23K26/18 , B23K26/355 , B23K2101/34 , B23K2101/40 , B23K2103/56 , G06F3/044 , G06F2203/04103 , H01L31/1884 , H05K1/0326 , H05K1/0393 , H05K1/097 , H05K1/144 , H05K2201/0108 , H05K2201/0112 , H05K2201/0145 , H05K2201/015 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/026 , H05K2201/043 , H05K2203/108 , H05K2203/1142 , H05K2203/1572 , Y02E10/50
Abstract: Disclosed herein are double-sided transparent conductive films suitable for patterning by laser ablation.
Abstract translation: 本文公开了适用于通过激光烧蚀进行图案化的双面透明导电膜。
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Patent Agency Ranking
56.发明申请公开(公告)号：US20130008703A1
公开(公告)日：2013-01-10
申请号：US13635364
申请日：2011-04-11
Applicant: Johannes Stahr , Markus Leitgeb
Inventor： Johannes Stahr , Markus Leitgeb
CPC classification number: H05K1/185 , H05K1/0218 , H05K1/0298 , H05K1/115 , H05K1/14 , H05K1/144 , H05K1/181 , H05K1/186 , H05K3/4623 , H05K3/4697 , H05K2201/041 , H05K2201/042 , H05K2201/043 , H05K2201/045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09072 , H05K2201/09618 , H05K2201/10 , H05K2201/10083 , H05K2201/10151 , Y10T29/49126 , Y10T29/49144
Abstract: In a method for integrating a component (3) into a printed circuit board, the following steps are provided: providing two completed printed circuit board elements (1, 4), which more particularly consist of a plurality of interconnected plies or layers (6, 7, 8), wherein at least one printed circuit board element (4) has a cutout or depression (10), arranging the component (3) to be integrated on one of the printed circuit board elements (1) or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements (1, 4) with the component (3) being accommodated in the cutout (10), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor (3) in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component (3) integrated therein is provided.
Abstract translation: 在将组件（3）集成到印刷电路板中的方法中，提供以下步骤：提供两个完整的印刷电路板元件（1,4），其更特别地由多个相互连接的层或层（6， 其中至少一个印刷电路板元件（4）具有切口或凹陷（10），将组件（3）布置成集成在一个印刷电路板元件（1）上或者在 所述至少一个印刷电路板元件，并且将所述印刷电路板元件（1,4）与所述部件（3）连接在所述切口（10）中，结果可以获得安全可靠的住宿 在印刷电路板中的部件或传感器（3）。 此外，提供一种包括集成在其中的电子部件（3）的这种类型的印刷电路板。
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公开(公告)号：US08273990B2
公开(公告)日：2012-09-25
申请号：US12694550
申请日：2010-01-27
Applicant: Gwun-Jin Lin , Chih-Heng Chuo , Kuo-Fu Su
Inventor： Gwun-Jin Lin , Chih-Heng Chuo , Kuo-Fu Su
IPC: H01B7/08
CPC classification number: H05K1/028 , H05K1/144 , H05K2201/043 , H05K2201/09063 , H05K2201/09109 , H05K2201/09254 , H05K2201/10598
Abstract: A flexible flat circuit cable includes first and second flexible circuit substrates extending in an extension direction. The first flexible circuit substrate has a first surface forming a first conductor layer and an insulation layer, and the second flexible circuit substrate has a first surface forming a second conductor layer and an insulation layer. A bonding material layer is applied at a predetermined section between the first flexible circuit substrate and the second flexible circuit substrate to bond the first and second flexible circuit substrates together in such a way to maintain a predetermined spacing distance between the first and second flexible circuit substrate and forming a gapped segment at sections where no bonding material is applied. The first and second flexible circuit substrates form a cluster section within the gapped segment, which has opposite ends respectively forming first and second connected sections each of which forms a connection plug or is provided with a connector.
Abstract translation: 柔性扁平电路电缆包括沿延伸方向延伸的第一和第二柔性电路基板。 第一柔性电路基板具有形成第一导体层和绝缘层的第一表面，第二柔性电路基板具有形成第二导体层和绝缘层的第一表面。 在第一柔性电路基板和第二柔性电路基板之间的预定部分处施加接合材料层，以将第一和第二柔性电路基板接合在一起，以便保持第一和第二柔性电路基板之间的预定间隔距离 并且在不施加接合材料的部分形成间隙段。 第一和第二柔性电路基板在间隙段内形成集束部分，其具有分别形成第一和第二连接部分的相对端部，每个部分形成连接插头或设置有连接器。
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公开(公告)号：US20110138617A1
公开(公告)日：2011-06-16
申请号：US12932087
申请日：2011-02-17
Applicant: James E. Clayton , Zakaryae Fathi
Inventor： James E. Clayton , Zakaryae Fathi
IPC: H05K3/00
CPC classification number: H05K1/189 , H01L2224/16225 , H01L2224/73253 , H01L2924/07811 , H01L2924/15311 , H05K1/147 , H05K3/0061 , H05K2201/043 , H05K2201/056 , H05K2201/09109 , H05K2201/10159 , H05K2201/1056 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49179 , H01L2924/00
Abstract: A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.
Abstract translation: 多芯片模块包括在其表面上具有导电图案的柔性电路，微电子器件连接到该表面上。 柔性电路由两个刚性框架封闭并支撑，其可以进一步设置有保护性散热盖。 刚性框架上的接触垫可以被配置为接合配合插座，或者它们可焊接到印刷电路板。
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公开(公告)号：US20110116244A1
公开(公告)日：2011-05-19
申请号：US12930971
申请日：2011-01-21
Applicant: James E. Clayton , Zakaryae Fathi
Inventor： James E. Clayton , Zakaryae Fathi
IPC: H05K1/18
CPC classification number: H05K1/189 , H01L2224/16225 , H01L2224/73253 , H01L2924/07811 , H01L2924/15311 , H05K1/147 , H05K3/0061 , H05K2201/043 , H05K2201/056 , H05K2201/09109 , H05K2201/10159 , H05K2201/1056 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49179 , H01L2924/00
Abstract: A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.
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公开(公告)号：US20110094790A1
公开(公告)日：2011-04-28
申请号：US12694550
申请日：2010-01-27
Applicant: Gwun-Jin Lin , Chih-Heng Chuo , Kuo-Fu Su
Inventor： Gwun-Jin Lin , Chih-Heng Chuo , Kuo-Fu Su
CPC classification number: H05K1/028 , H05K1/144 , H05K2201/043 , H05K2201/09063 , H05K2201/09109 , H05K2201/09254 , H05K2201/10598
Abstract: A flexible flat circuit cable includes first and second flexible circuit substrates extending in an extension direction. The first flexible circuit substrate has a first surface forming a first conductor layer and an insulation layer, and the second flexible circuit substrate has a first surface forming a second conductor layer and an insulation layer. A bonding material layer is applied at a predetermined section between the first flexible circuit substrate and the second flexible circuit substrate to bond the first and second flexible circuit substrates together in such a way to maintain a predetermined spacing distance between the first and second flexible circuit substrate and forming a gapped segment at sections where no bonding material is applied. The first and second flexible circuit substrates form a cluster section within the gapped segment, which has opposite ends respectively forming first and second connected sections each of which forms a connection plug or is provided with a connector.
Abstract translation: 柔性扁平电路电缆包括沿延伸方向延伸的第一和第二柔性电路基板。 第一柔性电路基板具有形成第一导体层和绝缘层的第一表面，第二柔性电路基板具有形成第二导体层和绝缘层的第一表面。 在第一柔性电路基板和第二柔性电路基板之间的预定部分处施加接合材料层，以将第一和第二柔性电路基板接合在一起，以便保持第一和第二柔性电路基板之间的预定间隔距离 并且在不施加接合材料的部分形成间隙段。 第一和第二柔性电路基板在间隙段内形成集束部分，其具有分别形成第一和第二连接部分的相对端部，每个部分形成连接插头或设置有连接器。
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