公开(公告)号：US11822308B2

公开(公告)日：2023-11-21

申请号：US16268043

申请日：2019-02-05

申请人： FANUC Corporation

发明人： He Zhang

IPC分类号： B24B49/00 ,  G05B19/404 ,  G06N3/02 ,  G06N20/00 ,  B24B49/14

CPC分类号： G05B19/404 ,  B24B49/003 ,  B24B49/14 ,  G06N3/02 ,  G06N20/00 ,  G05B2219/37256

摘要： A polishing tool wear amount prediction device, machine learning device, and system capable of predicting a wear amount of a polishing tool unit of a polishing tool during polishing are provided. The polishing tool wear amount prediction device includes a machine learning device which observes polishing condition data indicating a processing condition of polishing as a state variable indicating a current environment state and performs, based on the state variable, learning or prediction by using a learning model which stores a correlation of the wear amount of the polishing tool with respect to the processing condition of polishing.

公开(公告)号：US11701829B2

公开(公告)日：2023-07-18

申请号：US16340647

申请日：2017-10-10

申请人： PostProcess Technologies, Inc.

发明人： Daniel Joshua Hutchinson

IPC分类号： B29C64/35 ,  B33Y50/00 ,  B29C64/386 ,  B08B3/12 ,  B24B49/00 ,  B24B49/14 ,  B33Y30/00 ,  B29C64/30 ,  B33Y40/20 ,  B24B31/10

CPC分类号： B29C64/35 ,  B08B3/12 ,  B24B49/003 ,  B24B49/14 ,  B29C64/30 ,  B29C64/386 ,  B33Y30/00 ,  B33Y40/20 ,  B33Y50/00 ,  B24B31/10

摘要： A process for support material removal for 3D printed parts wherein the part is placed in a media filled tank and support removal is optimized in a multi-parameter system through an artificial intelligence process which may include, but is not limited to, the use of historical data, parametric testing data, normal support removal data, and outputs from other support removal AI models to generate optimally efficient use of each parameter in terms of pulse repetition interval (PRI) and cycle time as defined by pulse width (PW). The input parameters may include heat, circulation, ultrasound and chemical reaction, which are used in sequence and/or in parallel, to optimize efficiency of support removal. Sequentially and/or in parallel, heat, pump circulation and ultrasound may vary in application or intensity. Selection of means of agitation depends on monitored feedback from the support removal tank and application of a statistically dynamic rule based system (SDRBS).

公开(公告)号：US11697187B2

公开(公告)日：2023-07-11

申请号：US16849912

申请日：2020-04-15

申请人： Applied Materials, Inc.

发明人： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Chih Chung ,  Hui Chen ,  Hari Soundararajan ,  Benjamin Cherian

IPC分类号： B24B1/00 ,  B24B57/02 ,  H01L21/304 ,  B24B37/04 ,  B24B37/015 ,  B24B37/10 ,  B24B37/22 ,  B24B37/34 ,  B24B55/02 ,  B24B53/017 ,  B24B49/14

CPC分类号： B24B57/02 ,  B24B37/015 ,  B24B37/042 ,  B24B37/105 ,  B24B37/22 ,  B24B37/34 ,  B24B55/02 ,  H01L21/304 ,  B24B49/14 ,  B24B53/017

摘要： A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid supply port to supply a polishing liquid to the polishing surface, a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface, an actuator to move the nozzle radially relative to an axis of rotation of the platen, and a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface.

公开(公告)号：US20180021917A1

公开(公告)日：2018-01-25

申请号：US15697047

申请日：2017-09-06

申请人： EBARA CORPORATION

发明人： Toru MARUYAMA ,  Hisanori MATSUO ,  Yasuyuki MOTOSHIMA

IPC分类号： B24B37/015 ,  B24B49/14 ,  G01J5/02 ,  G01J5/00

CPC分类号： B24B37/015 ,  B24B49/14 ,  B24B55/02 ,  G01J5/025 ,  G01J2005/0085

摘要： A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

公开(公告)号：US09855637B2

公开(公告)日：2018-01-02

申请号：US14638892

申请日：2015-03-04

申请人： Apple Inc.

发明人： Lucas Allen Whipple ,  Simon Regis Louis Lancaster-Larocque ,  Collin D. Chan ,  Christopher R. Fagan ,  Vincent Yan ,  Ian S. Theilacker ,  Brian K. Miehm ,  Shravan Bharadwaj

IPC分类号： B24B49/14 ,  B24B49/12 ,  B24B49/16 ,  B24B49/00 ,  B24B37/015

CPC分类号： B24B49/14 ,  B24B5/00 ,  B24B7/00 ,  B24B29/00 ,  B24B37/015 ,  B24B41/061 ,  B24B49/006 ,  B24B49/12 ,  B24B49/16

摘要： A method and system for observing and monitoring thermal characteristics of a machining operation, such as a surface finishing operation, performed on a workpiece is disclosed. The surface finishing operation can be performed on the workpiece in order to remove a surface defect, e.g. a parting line, on a surface of the workpiece and/or to provide a mirror-like finish to the workpiece. In one embodiment, an emissive layer is applied to the workpiece to increase a thermal emissivity of the workpiece. In some embodiments, a finishing surface, such as a polishing or buffing wheel, and/or a lubricant used in a finishing operation is monitored. A thermal profile of the surface of the workpiece, finishing surface and/or lubricant can be obtained. The finishing operation can be modified in response to the monitored thermal characteristics to prevent the occurrence of defects and improve the efficacy of the finishing operation.

公开(公告)号：US09757840B2

公开(公告)日：2017-09-12

申请号：US14991525

申请日：2016-01-08

申请人： Klingelnberg AG

发明人： Karl-Martin Ribbeck

IPC分类号： B24B49/00 ,  B24B49/14 ,  B23F23/12 ,  B24B49/18 ,  B24B53/08

CPC分类号： B24B49/14 ,  B23F23/1225 ,  B24B49/18 ,  B24B53/08

摘要： Method for compensating temperature-induced deviations in a grinding machine includes controlling the movements of the dressing tool relative to the grinding tool in order to relatively move the dressing tool towards the grinding tool; checking whether a first-cut detection signalizes a contact of the grinding tool and the dressing tool; repeating the controlling and checking steps until a contact between the grinding tool and the dressing tool is detected, and when the contact is detected, then (i) recording the Current Position, and (ii) carrying out a compensation calculation using the Current Position and a reference position.

公开(公告)号：US09707659B2

公开(公告)日：2017-07-18

申请号：US13976205

申请日：2011-10-19

申请人： Shinichi Ogata ,  Ryuichi Tanimoto ,  Keiichi Takanashi

发明人： Shinichi Ogata ,  Ryuichi Tanimoto ,  Keiichi Takanashi

IPC分类号： B24B37/005 ,  B24B37/015 ,  B24B37/08 ,  B24B37/14 ,  B24B49/14

CPC分类号： B24B37/005 ,  B24B37/015 ,  B24B37/08 ,  B24B49/14

摘要： In a polishing method of the present invention, the temperature of a carrier plate is measured, and the amount of polishing removal of a workpiece (workpiece) is accurately controlled based on change in the measured temperature of the carrier plate.

公开(公告)号：US09662765B2

公开(公告)日：2017-05-30

申请号：US14387471

申请日：2013-03-25

申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. ,  Technische Universität Berlin

发明人： Holger Hüning ,  Jens König ,  Eckart Uhlmann ,  Christoph König

IPC分类号： B24B39/06 ,  B24B39/00 ,  B24B1/00 ,  B23P9/02 ,  B24B49/14 ,  C21D7/08 ,  C21D7/04

CPC分类号： B24B39/06 ,  B23P9/02 ,  B24B1/002 ,  B24B39/00 ,  B24B39/003 ,  B24B49/14 ,  C21D7/04 ,  C21D7/08 ,  Y10T29/47

摘要： A device for electromechanically assisted roller burnishing (EMRB) may comprise: a roller burnishing tool with exactly one current-leading roller burnishing element for burnishing a workpiece, wherein the roller burnishing element represents a first electrical contact element for electrically contacting first location of the workpiece, and a second electrical contact element for electrically contacting second location of the workpiece; wherein the first and the second electrical contact elements can be positioned at a settable spatial distance to one another, so that on moving the roller burnishing element on the workpiece, a current path in the workpiece between the first and the second contact elements is always a constant length.

公开(公告)号：US20170072527A1

公开(公告)日：2017-03-16

申请号：US15310502

申请日：2015-05-06

申请人： SCANIA CV AB

发明人： Peter KRAJNIK ,  Radovan DRAZUMERIC

IPC分类号： B24B19/12 ,  B24B49/14 ,  B24B51/00

CPC分类号： B24B19/125 ,  B24B49/14 ,  B24B51/00 ,  G05B19/40937 ,  Y02P90/265

摘要： The present disclosure relates to a grinding method for grinding of non-circular workpieces with an improved productivity and quality of the resulting workpiece. The method comprises a first and a second stage. The rotational speed profile of the workpiece in the first stage is controlled with the purpose of maintaining a pre-selected maximum surface temperature of the workpiece during said first stage, and grinding of the workpiece in said second stage is performed while controlling an aggressiveness number of said second stage so as to achieve an intended final surface quality. The present disclosure also relates to a method for determining the processing parameters of such a grinding method wherein the first and the second stage of the grinding method are iterated to thereby determine the processing parameters leading to a high productivity and desired quality of the workpiece after grinding.

摘要翻译： 本公开涉及一种用于研磨非圆形工件的研磨方法，其具有提高的所得工件的生产率和质量。 该方法包括第一和第二阶段。 为了在第一阶段保持工件的预选最大表面温度，在第一阶段中工件的转速分布被控制，并且在所述第二阶段中对工件进行研磨，同时控制侵蚀性数量 所述第二阶段以达到期望的最终表面质量。 本公开还涉及一种用于确定这种研磨方法的处理参数的方法，其中重复研磨方法的第一阶段和第二阶段，从而确定导致研磨后工件的高生产率和期望质量的加工参数 。

公开(公告)号：US20160375542A1

公开(公告)日：2016-12-29

申请号：US15258112

申请日：2016-09-07

申请人： ROESLER HOLDING GMBH & CO. KG

发明人： Egon Schmidt ,  Raif Mueller ,  Erwin Denninger ,  Dennis Eichenberg

IPC分类号： B24B31/12 ,  B24B31/108 ,  B24B31/02

CPC分类号： B24B31/12 ,  B24B31/02 ,  B24B31/108 ,  B24B49/08 ,  B24B49/14

摘要： In a method for the automatic gap setting in slide grinding machines having a turntable, the gap width between the turntable and the work container is automatically set by a regulation, with a reference value for the gap width of zero being determined.

摘要翻译： 在具有转盘的滑动磨床中的自动间隙设定方法中，通过调节来自动设定转台与工作容器之间的间隙宽度，确定间隙宽度为零的基准值。