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87 条记录 (耗时 0.027 秒)

    Method for bonding members, composite film and use thereof
    52.
    发明授权
    Method for bonding members, composite film and use thereof 有权
    粘合部件，复合膜及其用途的方法

    公开(公告)号：US08216684B2

    公开(公告)日：2012-07-10

    申请号：US11883525

    申请日：2006-01-30

    申请人： Yuichi Ito ,  Yugo Yamamoto ,  Kimihiko Saito

    发明人： Yuichi Ito ,  Yugo Yamamoto ,  Kimihiko Saito

    IPC分类号： B32B27/00 ,  C09J163/00

    CPC分类号： C23C16/345 ,  B32B37/12 ,  B32B38/0008 ,  B32B2307/412 ,  B32B2310/14 ,  B32B2457/00 ,  Y10T156/1089 ,  Y10T428/31511 ,  Y10T428/31598 ,  Y10T428/31667

    摘要： The bonding method of the present invention is a method of bonding a member (a) having a layer (a1) comprising an organic polymer (A), and a member (b) containing a compound (B) having specific functional groups, wherein the bonding method comprises bonding the member (a) and the member (b) via a layer comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom, which is at least partly provided on the outermost surface of the member (a).The composite film of the present invention is, firstly, a composite film formed with a laminate having a layer (a1) comprising an organic polymer (A) and a layer (c1) comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom; secondly, a composite film formed with a laminate having the layer (a1), the layer (c1) and a layer (b1) comprising an adhesive resin (B1) disposed in this order, wherein the layer (c1) and the layer (b1) are directly laminated; and thirdly, a composite film formed with a laminate having the layer (a1), the layer (c1), and a transparent conductive layer (d1) disposed in this order, wherein one outermost surface or both outermost surfaces of the composite film are partially formed with the layer (c1).

    摘要翻译： 本发明的接合方法是将具有包含有机聚合物（A）的层（a1）的成分（a）和含有具有特定官能团的化合物（B）的成分（b）的粘合方法，其中， 粘合方法包括通过包含具有氮原子和氢原子的无机化合物（C）的层至少部分地设置在构件（a）的最外表面上的部件（a）和构件（b） 。 本发明的复合膜首先是由具有包含有机聚合物（A）的层（a1）和包含具有氮原子的无机化合物（C）的层（c1）的层叠体形成的复合膜， 氢原子; 其次，由具有层（a1），层（c1）和层（b1）的层叠体形成的复合膜，所述层（c1）和层（b1）依次配置有粘合树脂（B1），其中，层（c1）和层（b1 ）直接层压; 第三，由具有层（a1），层（c1）和透明导电层（d1）的层叠体形成的复合膜，其中复合膜的一个最外表面或两个最外表面部分地部分地 与层（c1）形成。

    WEB SERVICE PROCESSING METHOD FOR A WEB SERVER PROVIDING DEVICE, AND A WEB SERVICE PROVIDING DEVICE
    55.
    发明申请
    WEB SERVICE PROCESSING METHOD FOR A WEB SERVER PROVIDING DEVICE, AND A WEB SERVICE PROVIDING DEVICE 审中-公开
    WEB服务器提供设备的WEB服务处理方法和提供设备的网络服务

    公开(公告)号：US20100325266A1

    公开(公告)日：2010-12-23

    申请号：US12818124

    申请日：2010-06-17

    申请人： Nobuhiko Nishimura ,  Toshihiro Hagiwara ,  Atsushi Sakai ,  Yuichi Ito

    发明人： Nobuhiko Nishimura ,  Toshihiro Hagiwara ,  Atsushi Sakai ,  Yuichi Ito

    IPC分类号： G06F15/173

    CPC分类号： H04L67/141 ,  H04L67/14 ,  H04L67/16

    摘要： A web service processing method for a web server providing device, and a web service providing device enable eliminating the process delay that occurs the first time a web service is accessed. A web service provider 1 has a services table 26 storing a list of web services 24 that can be provided, and provides web services 24 to users. The web service provider 1 monitors if the web services 24 stored in the services table 26 are in a usable state, and if as a result of this monitoring determines that a web service 24 is not usable, asserts an initialization process request to the web service 24 to initialize the web service 24 for use.

    摘要翻译： 用于web服务器提供设备的Web服务处理方法和web服务提供设备能够消除第一次访问web服务时发生的进程延迟。 网络服务提供商1具有服务表26，其存储可以提供的web服务24的列表，并向用户提供web服务24。 Web服务提供商1监视服务表26中存储的Web服务24是否处于可用状态，并且如果作为该监视的结果确定Web服务24不可用，则向Web服务断言初始化处理请求 24来初始化web服务24以供使用。

    Semiconductor processing method for processing substrate to be processed and its apparatus
    59.
    发明申请
    Semiconductor processing method for processing substrate to be processed and its apparatus 审中-公开
    用于处理待处理衬底的半导体加工方法及其装置

    公开(公告)号：US20050272271A1

    公开(公告)日：2005-12-08

    申请号：US10523974

    申请日：2004-02-04

    申请人： Haruhiko Furuya ,  Yuihiro Morozumi ,  Hiroaki Ikegawa ,  Makoto Hirayama ,  Yuichi Ito

    发明人： Haruhiko Furuya ,  Yuihiro Morozumi ,  Hiroaki Ikegawa ,  Makoto Hirayama ,  Yuichi Ito

    IPC分类号： C23C16/44 ,  H01L21/30 ,  H01L21/31 ,  H01L21/46 ,  H01L21/469

    CPC分类号： C23C16/44

    摘要： A method for processing a target substrate (10) in a semiconductor processing apparatus (1) controls temperature of a first substrate (10) at a process temperature inside a process container (2), while supplying a process gas into the process container, thereby subjecting the first substrate to a semiconductor process, during which a by-product film is formed inside the process container. After the semiconductor process and unload of the first substrate (10) out of the process container (2), a reforming gas is supplied into the process container, thereby subjecting the by-product film to a reformation process, which is set to reduce thermal reflectivity of the by-product film. After the reformation process, temperature of a second substrate (10) is controlled at the process temperature inside the process container (2), while supplying the process gas into the process container, thereby subjecting the second substrate to the semiconductor process.

    摘要翻译： 在半导体处理装置（1）中处理目标衬底（10）的方法在处理容器（2）内的处理温度下控制第一衬底（10）的温度，同时将处理气体供应到处理容器中，从而 使第一基板经受半导体工艺，在该过程中，在处理容器内部形成副产物膜。 在半导体处理和将第一基板（10）从工艺容器（2）中卸载之后，将重整气体供给到处理容器中，从而使副产物膜进行重整过程，该过程设定为减少热 副产品薄膜的反射率。 在改造过程之后，在处理容器（2）内的处理温度下控制第二基板（10）的温度，同时将处理气体供应到处理容器中，从而使第二基板进行半导体处理。

    Thermoplastic olefin elastomer composition
    60.
    发明授权
    Thermoplastic olefin elastomer composition 失效
    热塑性烯烃弹性体组合物

    公开(公告)号：US06803398B1

    公开(公告)日：2004-10-12

    申请号：US09486368

    申请日：2000-02-28

    申请人： Yuichi Ito ,  Hiroyasu Yamaoka ,  Akira Uchiyama ,  Chika Kako ,  Hideo Nishimura ,  Junzo Ukai

    发明人： Yuichi Ito ,  Hiroyasu Yamaoka ,  Akira Uchiyama ,  Chika Kako ,  Hideo Nishimura ,  Junzo Ukai

    IPC分类号： C08K515

    CPC分类号： C08L23/10 ,  C08L23/06 ,  C08L23/0807 ,  C08L23/0815 ,  C08L23/16 ,  C08L23/22 ,  C08L2666/04

    摘要： An olefin-based thermoplastic elastomer composition comprising a thermoplastic elastomer blended with other resins and rubbers is provided. The thermoplastic elastomer contains polypropylene resin and an olefin-based copolymer rubber, and optionally, a linear polyethylene resin, and the thermoplastic elastomer has been crosslinked to a gel content of 95% or higher. A polyolefin resin, an olefin-based copolymer rubber and a softening agent are further blended with optional inorganic filler to provide the olefin-based thermoplastic elastomer composition. This composition is excellent in oil resistance and extrudability, and well-adapted for use as an energy-saving, resources-saving elastomer in applications including surface or skin material in autoparts, industrial mechanical parts, electric and electronic parts, and construction materials.

    摘要翻译： 提供了包含与其它树脂和橡胶共混的热塑性弹性体的烯烃类热塑性弹性体组合物。 热塑性弹性体含有聚丙烯树脂和烯烃系共聚物橡胶，任意地为直链状聚乙烯树脂，热塑性弹性体的交联凝胶含量为95％以上。 将聚烯烃树脂，烯烃类共聚物橡胶和软化剂进一步与任选的无机填料共混以提供烯烃系热塑性弹性体组合物。 该组合物的耐油性和挤出性优异，适用于汽车零部件，工业机械部件，电气电子部件和建筑材料中的表面或表皮材料的节能，节省资源的弹性体。