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    Circuit board assembly and electronic device including the same
    51.
    发明授权
    Circuit board assembly and electronic device including the same 有权

    公开(公告)号：US12237561B2

    公开(公告)日：2025-02-25

    申请号：US18319648

    申请日：2023-05-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jongwon Lee ,  Dongil Son

    IPC: H01Q1/02 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q23/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K9/00

    Abstract: Disclosed is an electronic device including a first circuit board including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; a second circuit board including a third surface facing the first direction and a fourth surface facing the second direction; an interposer disposed between the first circuit board and the second circuit board; an antenna disposed at the first surface of the first circuit board; a first electronic component disposed on the second surface of the first circuit board and electrically connected with the antenna; and a thermal interface material (TIM) disposed between the second surface of the first circuit board and the third surface of the second circuit board and contacting a surface of the first electronic component.

    SEMICONDUCTOR PACKAGE
    52.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20250029936A1

    公开(公告)日：2025-01-23

    申请号：US18672372

    申请日：2024-05-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jongwon Lee

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H10B80/00

    Abstract: A semiconductor package includes a substrate that includes a first surface and a second surface that is opposite to the first surface, where the first surface includes a first region and a second region, where the substrate includes a wiring circuit layer; first connection pads in the first region of the substrate and second connection pads in the second region of the substrate, a semiconductor chip structure that is on the first region of the substrate and is connected to the first connection pads by conductive bumps, a stiffener that extends along the first side and is in the first region of the substrate, an underfill on the first region of the substrate, where the underfill is spaced apart from the stiffener, and external connection conductors that are on the second surface of the substrate and electrically connected to the wiring circuit layer.

    Electronic device comprising antenna
    54.
    发明授权
    Electronic device comprising antenna 有权

    公开(公告)号：US12095531B2

    公开(公告)日：2024-09-17

    申请号：US18125867

    申请日：2023-03-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jongwon Lee ,  Daehee Park ,  Chonghwa Seo

    IPC: H04B7/06

    CPC classification number: H04B7/0608 ,  H04B7/066

    Abstract: An electronic device according to various embodiments may include a plurality of antennas including a first antenna group and a second antenna group and a wireless communication circuit, and the wireless communication circuit may control the first antenna group to receive a first signal by establishing a first wireless communication channel of the first frequency band with an external device, measure a first channel capacity, select at least one antenna from the second antenna group based on correlation, identify a second channel capacity of a second wireless communication channel of the first frequency band which is able to be established using some of the first antenna group and the selected at least one antenna of the second antenna group, and control to receive the signal of the first frequency band by using some of the first antenna group and the selected at least one antenna.

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