公开(公告)号：US08182873B2

公开(公告)日：2012-05-22

申请号：US10558172

申请日：2004-03-31

申请人： Toru Imori ,  Junnosuke Sekiguchi ,  Atsushi Yabe ,  Yoshihisa Fujihira

发明人： Toru Imori ,  Junnosuke Sekiguchi ,  Atsushi Yabe ,  Yoshihisa Fujihira

IPC分类号： C23C18/18 ,  B05D1/38 ,  B05D3/02 ,  B05D3/10

CPC分类号： C23C18/18 ,  C23C18/1865 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/1893 ,  C23C18/2033 ,  C23C18/2066 ,  C23C18/2086 ,  C23C18/30

摘要： A method for metal plating with good adhesion to materials that are difficult to plate wherein a material to be plated is surface-treated with a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability, is heat treated at a high temperature of at least 150° C. in air or an inert gas atmosphere, surface treatment is performed with a solution containing a noble metal compound, and electroless plating is performed. Alternatively, a metal plating method is provided wherein a material to be plated is surface-treated with a liquid in which a noble metal compound and a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability have already been mixed or reacted, is heat treated at a high temperature of at least 150° C. in air or an inert gas atmosphere, and electroless plating is performed.

摘要翻译： 一种金属电镀方法，对于难以镀覆的材料具有良好的粘附性，其中用分子中的具有金属捕获能力的官能团的硅烷偶联剂对待镀覆的材料进行表面处理，在 在空气或惰性气体气氛中高温至少为150℃，用含有贵金属化合物的溶液进行表面处理，进行化学镀。 或者，提供一种金属镀覆方法，其中将待镀材料用贵金属化合物和其分子中具有金属捕集能力的官能团的硅烷偶联剂已经混合的液体进行表面处理 或反应后，在空气或惰性气体气氛中，在至少150℃的高温下进行热处理，进行化学镀。

公开(公告)号：US08163400B2

公开(公告)日：2012-04-24

申请号：US12311207

申请日：2008-07-18

申请人： Atsushi Yabe ,  Junichi Ito ,  Yoshiyuki Hisumi ,  Junnosuke Sekiguchi ,  Toru Imori

发明人： Atsushi Yabe ,  Junichi Ito ,  Yoshiyuki Hisumi ,  Junnosuke Sekiguchi ,  Toru Imori

IPC分类号： H01L29/00 ,  H05K3/00

CPC分类号： H01L21/76843 ,  C23C14/165 ,  C23C14/584 ,  C23C18/1879 ,  C23C18/31 ,  C23C18/54 ,  H01L21/288 ,  H01L21/76873 ,  H01L21/76874 ,  H01L23/53238 ,  H01L2221/1089 ,  H01L2924/0002 ,  Y10T428/12493 ,  Y10T428/12507 ,  Y10T428/12514 ,  Y10T428/24917 ,  H01L2924/00

摘要： The present invention provides a plated article that has a thin seed layer having a uniform thickness, formed by electroless plating and allowing formation of ultrafine wiring, and that avoids the complicated formation of a bilayer of a barrier layer and a catalytic metal layer prior to forming the seed layer. The present invention also provides a method for manufacturing the plated article. The plated article has an alloy thin film formed on a substrate and containing a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5at% to 40at% of the metal (A). The metal thin film formed by electroless displacement and reduction plating is a metal thin film having a thickness no greater than 10 nm and a resistivity no greater than 10 μΩ·cm. Preferably, the metal (B) has a barrier function with respect to a metal of the metal thin film.

摘要翻译： 本发明提供一种电镀制品，其具有通过无电镀形成的具有均匀厚度的薄种子层，并且允许形成超细布线，并且避免在形成之前形成阻挡层和催化金属层的双层 种子层。 本发明还提供一种制造电镀制品的方法。 电镀制品具有在基板上形成的含有用于无电镀的催化活性金属（A）和能够用化学镀溶液中含有的金属离子进行置换镀覆的金属（B）的合金薄膜，以及金属薄膜 通过无电位移和还原电镀在合金薄膜上形成薄膜。 催化活性金属（A）的合金薄膜和能够移位镀的金属（B）具有包含金属（A）的5原子％至40原子％的组成。 通过无电解位移和还原电镀形成的金属薄膜是厚度不大于10nm，电阻率不大于10μΩ·cm·cm的金属薄膜。 优选地，金属（B）相对于金属薄膜的金属具有阻挡功能。

公开(公告)号：US07968150B2

公开(公告)日：2011-06-28

申请号：US12290328

申请日：2008-10-29

申请人： Toru Imori ,  Atsushi Yabe ,  Junnosuke Sekiguchi

发明人： Toru Imori ,  Atsushi Yabe ,  Junnosuke Sekiguchi

IPC分类号： B05D3/02 ,  B32B15/04

CPC分类号： C23F11/149 ,  C07D231/12 ,  C07D233/54 ,  C07D233/56 ,  C07D249/08 ,  Y10T428/31678

摘要： It is an object of the present invention to provide a novel imidazole alcohol compound that adheres strongly to metal surfaces in metal products, especially copper, aluminum and steel products, and that has a superior rust-preventive effect even in a thin film, and a surface-treating agent using the same. The novel imidazole alcohol compound is expressed by the following general formula (1) show a rust-preventive effect. (In general formula (1), R1, R2 and R3 are each hydrogen, a vinyl group or an alkyl group with 1 to 20 carbon atoms, an aromatic ring may be formed by R2 and R3, X indicates hydrogen, an alkyl group with 1 to 6 carbon atoms, or a substituent group which may contain N or O, m indicates an integer from 0 to 20, and n and l indicate integers from 1 to 3.) The above-mentioned imidazole alcohol compound can be produced by reacting an imidazole compound and an epoxy alcohol compound.

摘要翻译： 本发明的目的是提供一种新颖的咪唑醇化合物，其在金属制品，特别是铜，铝和钢制品中的金属表面强烈粘附，并且即使在薄膜中也具有优异的防锈效果， 使用其的表面处理剂。 新型咪唑醇化合物由以下通式（1）表示，具有防锈作用。 （通式（1）中，R 1，R 2和R 3各自为氢，乙烯基或碳原子数1〜20的烷基，芳环可以由R 2，R 3，X表示氢，烷基， 1〜6个碳原子的取代基或可含有N或O的取代基，m表示0〜20的整数，n和l表示1〜3的整数。）上述咪唑醇化合物可以通过使 咪唑化合物和环氧醇化合物。

公开(公告)号：US20110006427A1

公开(公告)日：2011-01-13

申请号：US12449162

申请日：2009-02-19

申请人： Junnosuke Sekiguchi ,  Toru Imori

发明人： Junnosuke Sekiguchi ,  Toru Imori

IPC分类号： H01L23/532

CPC分类号： H01L23/53238 ,  C23C14/185 ,  C25D7/123 ,  H01L21/2855 ,  H01L21/76843 ,  H01L21/76873 ,  H01L2924/0002 ,  H01L2924/00

摘要： It is an object of the present invention to provide a technology for forming an ULSI fine copper wiring by a simpler method. An electronic component in which a thin alloy film of tungsten and a noble metal used as a barrier-seed layer for an ULSI fine copper wiring is formed on a base material, wherein the thin alloy film has a composition comprising tungsten at a ratio equal to or greater than 50 at. % and the noble metal at a ratio of equal to or greater than 5 at. % and equal to or less than 50 at. %. The noble metal is preferably one or more kinds of metals selected from the group consisting of ruthenium, rhodium, and iridium.

摘要翻译： 本发明的目的是提供一种通过更简单的方法形成ULSI细铜布线的技术。 在基材上形成有钨和贵金属的合金薄膜用作ULSI细铜布线的阻挡种子层的电子部件，其中，所述薄合金膜的组成包含钨的比例等于 或大于50。 ％，贵金属的比例等于或大于5at。 ％且等于或小于50英寸。 ％。 贵金属优选为选自钌，铑和铱的一种或多种金属。

公开(公告)号：US20100244259A1

公开(公告)日：2010-09-30

申请号：US12734590

申请日：2008-11-26

申请人： Junichi Ito ,  Atsushi Yabe ,  Junnosuke Sekiguchi ,  Toru Imori

发明人： Junichi Ito ,  Atsushi Yabe ,  Junnosuke Sekiguchi ,  Toru Imori

IPC分类号： H01L23/48 ,  H05K1/09 ,  C23C14/34

CPC分类号： H01L21/2855 ,  C23C18/1637 ,  C23C18/165 ,  C23C18/1653 ,  C23C18/40 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76874 ,  H01L23/53238 ,  H01L2221/1089 ,  H01L2924/0002 ,  H01L2924/00

摘要： It is an object of the present invention to provide a substrate having a barrier film for preventing copper diffusion having both a barrier function and a catalytic function, wherein the barrier properties during high-temperature heating is excellent.A substrate having, on a base material, a barrier film for preventing copper diffusion comprising one or more metal elements selected from tungsten, molybdenum and niobium, a metal element having a catalytic function in electroless plating such as ruthenium, rhodium, and iridium, and nitrogen contained in the form of a nitride of the aforementioned one or more metal elements selected from tungsten, molybdenum and niobium. The said barrier film for preventing copper diffusion is manufactured by sputtering in a nitrogen atmosphere using a target containing one or more metal elements selected from tungsten, molybdenum and niobium and the aforementioned metal element having a catalytic function in electroless plating.

摘要翻译： 本发明的一个目的是提供一种具有防止具有阻隔功能和催化功能的铜扩散的阻挡膜的基板，其中高温加热时的阻挡性能优异。 在基材上具有用于防止铜扩散的阻挡膜的基板，其包含选自钨，钼和铌中的一种或多种金属元素，在化学镀如钌，铑和铱中具有催化功能的金属元素，以及 氮以上述一种或多种选自钨，钼和铌的金属元素的氮化物的形式存在。 所述用于防止铜扩散的阻挡膜通过使用包含一种或多种选自钨，钼和铌的金属元素的靶和在化学镀中具有催化功能的上述金属元素在氮气气氛中溅射来制造。

公开(公告)号：US07713340B2

公开(公告)日：2010-05-11

申请号：US10586379

申请日：2004-11-11

申请人： Toshifumi Kawamura ,  Jun Suzuki ,  Toru Imori

发明人： Toshifumi Kawamura ,  Jun Suzuki ,  Toru Imori

IPC分类号： C23C18/28

CPC分类号： C23C18/31 ,  C23C18/1651 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/2066 ,  C23C18/30

摘要： The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plated is pre-treated using a pretreating agent for electroless plating comprising a noble metal soap of naphthenic acid or a fatty acid having 5 to 25 carbon atoms or preferably using a pretreating agent for electroless plating additionally comprising an imidazole silane coupling agent or other silane coupling agent having metal capturing ability, and then electroless plated. The noble metal soap is preferably a palladium soap.

摘要翻译： 本发明的目的是提供一种稳定且可溶于有机溶剂的化学镀的预处理剂，使用它的具有优异粘合性的无电电镀方法和无电镀产品。 使用包含环烷酸的贵金属皂或碳原子数5〜25的脂肪酸的贵金属皂进行化学镀的预处理剂进行预镀处理，优选使用还含有咪唑硅烷偶联剂的化学镀的预处理剂 或具有金属捕获能力的其它硅烷偶联剂，然后进行无电镀。 贵金属皂优选为钯皂。

公开(公告)号：US20100003539A1

公开(公告)日：2010-01-07

申请号：US12311208

申请日：2008-07-18

申请人： Atsushi Yabe ,  Junichi Ito ,  Yoshiyuki Hisumi ,  Junnosuke Sekiguchi ,  Toru Imori

发明人： Atsushi Yabe ,  Junichi Ito ,  Yoshiyuki Hisumi ,  Junnosuke Sekiguchi ,  Toru Imori

IPC分类号： B32B15/20 ,  B32B15/04 ,  B32B15/00 ,  C23C14/34 ,  B05D3/10 ,  H05K3/10

CPC分类号： H01L21/76843 ,  C23C14/165 ,  C23C14/584 ,  C23C18/31 ,  C23C18/54 ,  C25D5/02 ,  H01L21/288 ,  H01L21/76873 ,  H01L21/76874 ,  H01L23/53238 ,  H01L2924/0002 ,  Y10T428/12639 ,  Y10T428/12806 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12875 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12986 ,  Y10T428/265 ,  H01L2924/00

摘要： The present invention provides a plated article that has a thin seed layer having uniform thickness, formed by electroless plating and allowing formation of ultrafine wiring, and that avoids the complicated formation of a bilayer of a barrier layer and a catalytic metal layer prior to forming the seed layer. The present invention also provides a method for manufacturing the plated article. The plated article has an alloy thin film formed on a substrate and having a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5 at % to 40 at % of the metal (A). The metal thin film formed by electroless displacement and reduction plating is a metal thin film having a thickness no greater than 10 nm and a resistivity no greater than 10 μΩ·cm. Preferably, the metal (B) has a barrier function with respect to a metal of the metal thin film.

摘要翻译： 本发明提供了具有均匀厚度的薄种子层的电镀制品，其通过无电镀形成，并且允许形成超细布线，并且避免了在形成之前形成阻挡层和催化金属层的双层的复杂形成 种子层。 本发明还提供一种制造电镀制品的方法。 电镀制品具有在基板上形成的合金薄膜，具有用于无电镀的催化活性金属（A）和能够在化学镀溶液中含有金属离子进行置换镀覆的金属（B），金属薄膜 通过无电位移和还原电镀在合金薄膜上形成薄膜。 催化活性金属（A）和能够移位镀金属（B）的合金薄膜具有包含金属（A）的5at％至40at％的组成。 通过无电位移和还原电镀形成的金属薄膜是厚度不大于10nm，电阻率不大于10μΩa.cm的金属薄膜。 优选地，金属（B）相对于金属薄膜的金属具有阻挡功能。

公开(公告)号：US20090042021A1

公开(公告)日：2009-02-12

申请号：US12224684

申请日：2006-10-31

申请人： Jun-ichi Kikuchi ,  Yoshihiro Sasaki ,  Mineo Hashizume ,  Toru Imori

发明人： Jun-ichi Kikuchi ,  Yoshihiro Sasaki ,  Mineo Hashizume ,  Toru Imori

IPC分类号： B32B5/16 ,  B32B1/00 ,  B05D1/00

CPC分类号： C07D233/61 ,  C07F9/10 ,  C23C18/1635 ,  C23C18/1639 ,  C23C18/1893 ,  C23C18/31 ,  Y10T428/256 ,  Y10T428/2982 ,  Y10T428/2984 ,  Y10T428/2991

摘要： A metal-coated material comprising a metal-coated lipid bilayer vesicle and a preparation method thereof are provided. A metal-coated material comprising a metal-coated lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si) on its surface. a method for preparing the metal-coated lipid bilayer vesicle comprising the following steps: (1) rendering the functional group(s) having the ability of carrying the metal catalyst to the surface of lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si bonding) on its surface, at or after the formation, by self-organization, of the lipid bilayer vesicle; (2) immobilizing the metal catalyst on the surface of the lipid bilayer vesicle; (3) optionally, reducing the metal catalyst; and (4) performing electroless plating.

摘要翻译： 提供了包含金属涂覆的脂质双层囊泡的金属包覆材料及其制备方法。 一种金属涂覆的材料，其包含其表面具有硅氧烷键（Si-O-Si）网络的金属涂覆的脂质双层囊泡。 一种制备金属包覆的脂质双层囊泡的方法，包括以下步骤：（1）使具有携带金属催化剂的能力的官能团具有具有硅氧烷键合网络（Si- O-Si键合），在形成时或之后，通过自组织进行脂质双层囊泡; （2）将金属催化剂固定在脂质双层囊泡的表面上; （3）任选地还原金属催化剂; 和（4）进行化学镀。

公开(公告)号：US20080138642A1

公开(公告)日：2008-06-12

申请号：US12024232

申请日：2008-02-01

申请人： Masataka Yahagi ,  Toru Imori ,  Atsushi Nakamura

发明人： Masataka Yahagi ,  Toru Imori ,  Atsushi Nakamura

IPC分类号： B32B15/00

CPC分类号： C22C33/0264 ,  B22F3/1007 ,  B22F2999/00 ,  B32B15/013 ,  C22C33/02 ,  Y10T428/12014 ,  Y10T428/12479 ,  Y10T428/12951 ,  Y10T428/12993 ,  B22F2201/40

摘要： An iron-based sintered body with a rustproof function comprises a layer containing 0.01 to 5 at % of indium on the surface of the iron-based sintered body, or an iron-based sintered body with a rustproof function contains 0.01 to 5 at % of indium throughout the sintered body, and the iron-based sintered body having iron as its principal component is manufactured by performing sintering in a gas atmosphere containing indium vapor or indium. Thereby obtained is an iron-based sintered body, as well as the manufacturing method thereof, capable of easily improving the rustproof effect without having to hardly change the conventional process.

摘要翻译： 具有防锈功能的铁基烧结体包括在铁基烧结体的表面上含有0.01〜5原子％的铟的层或具有防锈功能的铁系烧结体，其含有0.01〜5原子％的 通过在含有铟蒸汽或铟的气氛气氛中进行烧结来制造以铁为主要成分的铁基烧结体。 由此得到的铁基烧结体及其制造方法能够容易地提高防锈效果，而不需要改变常规工艺。

公开(公告)号：US20070120880A1

公开(公告)日：2007-05-31

申请号：US10576658

申请日：2004-10-22

申请人： Toshifumi Kawamura ,  Toru Imori

发明人： Toshifumi Kawamura ,  Toru Imori

IPC分类号： B41J2/01 ,  C09D11/00

CPC分类号： C09D11/38 ,  H05K1/097 ,  H05K3/125 ,  H05K3/182 ,  H05K2201/0239 ,  H05K2203/013 ,  H05K2203/124

摘要： An object is to provide an inkjet ink composition to uniformly form a wiring pattern having excellent adhesion on a substrate, and to provide a method to form a wiring pattern by using this ink composition. This ink composition is an inkjet ink composition for drawing a wiring pattern on a substrate, the ink composition comprising an azole-based silane coupling agent as coupling agent for an activator.

摘要翻译： 目的是提供一种喷墨油墨组合物以均匀地形成在基材上具有优异粘合性的布线图案，并提供通过使用该油墨组合物形成布线图案的方法。 该油墨组合物是用于在基材上拉伸布线图案的喷墨油墨组合物，该油墨组合物包含作为活化剂偶联剂的唑类硅烷偶联剂。