知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

10 条记录 (耗时 0.024 秒)

    Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating
    1.
    发明授权
    Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating 有权
    化学镀用预处理剂，使用其的化学镀方法和化学镀的产物

    公开(公告)号：US07713340B2

    公开(公告)日：2010-05-11

    申请号：US10586379

    申请日：2004-11-11

    申请人： Toshifumi Kawamura ,  Jun Suzuki ,  Toru Imori

    发明人： Toshifumi Kawamura ,  Jun Suzuki ,  Toru Imori

    IPC分类号： C23C18/28

    CPC分类号： C23C18/31 ,  C23C18/1651 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/2066 ,  C23C18/30

    摘要： The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plated is pre-treated using a pretreating agent for electroless plating comprising a noble metal soap of naphthenic acid or a fatty acid having 5 to 25 carbon atoms or preferably using a pretreating agent for electroless plating additionally comprising an imidazole silane coupling agent or other silane coupling agent having metal capturing ability, and then electroless plated. The noble metal soap is preferably a palladium soap.

    摘要翻译： 本发明的目的是提供一种稳定且可溶于有机溶剂的化学镀的预处理剂，使用它的具有优异粘合性的无电电镀方法和无电镀产品。 使用包含环烷酸的贵金属皂或碳原子数5〜25的脂肪酸的贵金属皂进行化学镀的预处理剂进行预镀处理，优选使用还含有咪唑硅烷偶联剂的化学镀的预处理剂 或具有金属捕获能力的其它硅烷偶联剂，然后进行无电镀。 贵金属皂优选为钯皂。

    Inkjet ink composition
    2.
    发明申请
    Inkjet ink composition 审中-公开
    喷墨油墨组合物

    公开(公告)号：US20070120880A1

    公开(公告)日：2007-05-31

    申请号：US10576658

    申请日：2004-10-22

    申请人： Toshifumi Kawamura ,  Toru Imori

    发明人： Toshifumi Kawamura ,  Toru Imori

    IPC分类号： B41J2/01 ,  C09D11/00

    CPC分类号： C09D11/38 ,  H05K1/097 ,  H05K3/125 ,  H05K3/182 ,  H05K2201/0239 ,  H05K2203/013 ,  H05K2203/124

    摘要： An object is to provide an inkjet ink composition to uniformly form a wiring pattern having excellent adhesion on a substrate, and to provide a method to form a wiring pattern by using this ink composition. This ink composition is an inkjet ink composition for drawing a wiring pattern on a substrate, the ink composition comprising an azole-based silane coupling agent as coupling agent for an activator.

    摘要翻译： 目的是提供一种喷墨油墨组合物以均匀地形成在基材上具有优异粘合性的布线图案，并提供通过使用该油墨组合物形成布线图案的方法。 该油墨组合物是用于在基材上拉伸布线图案的喷墨油墨组合物，该油墨组合物包含作为活化剂偶联剂的唑类硅烷偶联剂。

    Process for producing activated carbon fiber molding and activated carbon fiber molding
    3.
    发明授权
    Process for producing activated carbon fiber molding and activated carbon fiber molding 失效
    生产活性炭纤维成型和活性炭纤维成型工艺

    公开(公告)号：US5888928A

    公开(公告)日：1999-03-30

    申请号：US808439

    申请日：1997-02-28

    申请人： Tomiji Hosotsubo ,  Toshifumi Kawamura ,  Kouichi Miura ,  Hiroyuki Nakagawa

    发明人： Tomiji Hosotsubo ,  Toshifumi Kawamura ,  Kouichi Miura ,  Hiroyuki Nakagawa

    IPC分类号： C01B31/08 ,  C04B35/622 ,  D01F9/145 ,  B01J20/02

    CPC分类号： C04B35/62272 ,  D01F9/145

    摘要： A process for producing an activated carbon fiber molding is disclosed which comprises spinning an isotropic pitch to thereby obtain pitch fibers, infusibilizing the pitch fibers to thereby obtain infusibilized fibers, heating the infusibilized fibers under a mechanical load to thereby obtain a molding and activating the molding. In this process, the infusibilized fibers and/or infusibilized fibers molding may be heated in an inert atmosphere so as to effect a light carbonization thereof and thereafter subjected to the subsequent step of the process. The pitch-based porous activated carbon fiber molding obtained by this process has a strikingly high bulk density and can sufficiently exhibit the specific properties of the activated carbon fiber, e.g. a large specific surface area, to thereby have a high adsorption efficiency.

    摘要翻译： 公开了一种活性炭纤维成形体的制造方法，其特征在于，将各向同性沥青进行纺丝，得到沥青纤维，使沥青纤维熔融，得到不熔化的纤维，在机械载荷下加热不熔化的纤维，从而得到成型并活化成型 。 在该方法中，不熔化纤维和/或不熔化纤维成型可以在惰性气氛中加热，以便进行轻质碳化，然后进行该方法的后续步骤。 通过该方法获得的基于沥青的多孔活性炭纤维模制物具有非常高的堆积密度，并且可以充分显示活性炭纤维的具体性能，例如， 比表面积大，吸附效果高。

    Nozzle for spinning pitch-based carbon fibers
    4.
    发明授权
    Nozzle for spinning pitch-based carbon fibers 失效
    用于纺丝沥青基碳纤维的喷嘴

    公开(公告)号：US5547363A

    公开(公告)日：1996-08-20

    申请号：US462544

    申请日：1995-06-05

    申请人： Yasuyuki Takai ,  Tetsuo Yamada ,  Toshifumi Kawamura ,  Susumu Shimizu ,  Haruki Yamasaki

    发明人： Yasuyuki Takai ,  Tetsuo Yamada ,  Toshifumi Kawamura ,  Susumu Shimizu ,  Haruki Yamasaki

    IPC分类号： D01D4/00 ,  D01D4/02 ,  D01F9/14 ,  D01F9/32

    CPC分类号： D01F9/322 ,  D01D4/02

    摘要： Disclosed herein is a spinning nozzle having one or more discharge openings and one or more introduction openings located upstream the discharge openings for producing pitch-based carbon fibers characterized by the presence of one or more spiral members in each introduction openings. According to the nozzle of the present invention, part of the pitch which is introduced to the introduction opening flows down along the spiral member while the flow of the pitch is affected by the spiral member. The remaining pitch flows into the discharge opening without being in contact with the spiral member, and then both are spun after being mixed through the discharge opening to prepare carbon fibers having a random structure. Especially, the carbon fibers of higher performances can be prepared when a spiral having uneven outer diameters is employed.

    摘要翻译： 本文公开了一种纺丝喷嘴，其具有一个或多个排出口和位于排出口上游侧的一个或多个引入开口，用于生产沥青基碳纤维，其特征在于在每个导入开口中存在一个或多个螺旋构件。 根据本发明的喷嘴，引入到引入口的间距的一部分沿着螺旋构件向下流动，而螺距的流动受螺旋构件的影响。 剩余的沥青不与螺旋构件接触而流入排放口，然后在通过排出口混合后将其两者旋转以制备具有随机结构的碳纤维。 特别地，当采用具有不均匀外径的螺旋时，可以制备更高性能的碳纤维。

    Pretreating Agent For Electroless Plating, Method Of Electroless Plating Using The Same And Product Of Electroless Plating
    5.
    发明申请
    Pretreating Agent For Electroless Plating, Method Of Electroless Plating Using The Same And Product Of Electroless Plating 有权
    化学镀预处理剂，使用该化学镀的无电镀方法和无电解电镀产品

    公开(公告)号：US20080014362A1

    公开(公告)日：2008-01-17

    申请号：US10586379

    申请日：2004-11-11

    申请人： Toshifumi Kawamura ,  Jun Suzuki ,  Toru Imori

    发明人： Toshifumi Kawamura ,  Jun Suzuki ,  Toru Imori

    IPC分类号： C23C18/18

    CPC分类号： C23C18/31 ,  C23C18/1651 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/2066 ,  C23C18/30

    摘要： The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plated is pre-treated using a pretreating agent for electroless plating comprising a noble metal soap of a fatty acid having 5 to 25 carbon atoms or preferably using a pretreating agent for electroless plating additionally comprising an imidazole silane coupling agent or other silane coupling agent having metal capturing ability, and then electroless plated. The noble metal soap is preferably a palladium soap.

    摘要翻译： 本发明的目的是提供一种稳定且可溶于有机溶剂的化学镀的预处理剂，使用它的具有优异粘合性的无电电镀方法和无电镀产品。 使用包含具有5〜25个碳原子的脂肪酸的贵金属皂或优选使用还含有咪唑硅烷偶联剂或其它硅烷的化学镀的预处理剂的化学镀预处理剂进行预镀处理 具有金属捕获能力的偶联剂，然后进行无电镀。 贵金属皂优选为钯皂。

    Process for producing pitch-based carbon fiber
    6.
    发明授权
    Process for producing pitch-based carbon fiber 失效
    制备沥青基碳纤维的方法

    公开(公告)号：US5308599A

    公开(公告)日：1994-05-03

    申请号：US912850

    申请日：1992-07-13

    申请人： Toshifumi Kawamura ,  Takashi Maeda

    发明人： Toshifumi Kawamura ,  Takashi Maeda

    IPC分类号： D01F9/145 ,  D01F9/12

    CPC分类号： D01F9/145

    摘要： There is disclosed a process for producing pitch-based carbon fiber which comprises melt spinning an optically isotropic pitch or a mesophase pitch to form pitch fiber; subjecting the pitch fiber to liquid-phase oxidative polymerization in a solvent in the presence of an acid catalyst and a crosslinking agent to form infusibilized fiber; and carbonizing the infusiblized fiber. The above process enables low temperature and short time infusibilizing treatment of optically isotropic pitch fiber having a low softening point which has heretofore been difficult because of failure to preserve the original fibrous shape during infusibilization, and also efficient production of mesophase pitch-based carbon fibers as well as optically isotropic pitch-based carbon fibers each being improved in physical properties.

    摘要翻译： 公开了一种制备沥青类碳纤维的方法，其包括使光学各向同性沥青熔融纺丝或中间相沥青以形成沥青纤维; 在酸催化剂和交联剂的存在下，使沥青纤维在溶剂中进行液相氧化聚合以形成不熔化的纤维; 并将不熔化的纤维碳化。 上述方法使得由于在不熔化期间不能保持原始纤维形状而具有低软化点的光学各向同性沥青纤维的低温和短时间渗透处理，并且还有效地生产中间相沥青基碳纤维作为 以及各种各向同性沥青基碳纤维的物理性质都得到改善。

    Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate
    7.
    发明申请
    Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate 审中-公开
    用于柔性基板的化学镀层预处理剂和铜包层压板

    公开(公告)号：US20070269680A1

    公开(公告)日：2007-11-22

    申请号：US11662046

    申请日：2005-08-22

    申请人： Toshifumi Kawamura ,  Toru Imori

    发明人： Toshifumi Kawamura ,  Toru Imori

    IPC分类号： C23C18/38 ,  C23C18/28

    CPC分类号： H05K3/389 ,  C23C18/1653 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/38 ,  H05K1/0393 ,  H05K3/181 ,  H05K3/387 ,  Y10T428/12903

    摘要： Provided are an electroless plating pretreatment liquid used in a copper-clad laminate for a flexible substrate whose initial adhesive force between the substrate material and copper plating layer in an ordinary state as well as the adhesive force in a peel test after aging (in the atmosphere at 150° C. for 168 hours) are at least 0.4 kgf/cm, and a copper-clad laminate for a flexible substrate produced using same. The electroless plating pretreatment agent used in a substrate material of a copper-clad laminate for a flexible substrate comprising a thermoset resin and a silane coupling agent having a metal capturing capability. The copper-clad laminate for a flexible substrate wherein a substrate material is treated with the electroless plating pretreatment agent, a copper plating layer is then formed by electroless plating, and a copper plating layer is formed thereon by electroplating.

    摘要翻译： 提供一种用于柔性基板的覆铜层压板中的化学镀预处理液体，其在通常状态下的基板材料和镀铜层之间的初始粘合力以及老化后的剥离试验中的粘合力（在大气中 在150℃下进行168小时）为至少0.4kgf / cm，以及使用其制造的用于柔性基板的覆铜层压板。 用于柔性基材的覆铜层压板的基板材料中的无电镀预处理剂，其包含热固性树脂和具有金属捕获能力的硅烷偶联剂。 用无电镀处理剂处理基板材料的柔性基板用覆铜层压板，然后通过无电解电镀形成铜镀层，通过电镀在其上形成镀铜层。

    Resin Substrate Material, Electronic Component Substrate Material Manufactured by Electroless Plating on the Same, and Method for Manufacturing Electronic Component Substrate Material
    9.
    发明申请
    Resin Substrate Material, Electronic Component Substrate Material Manufactured by Electroless Plating on the Same, and Method for Manufacturing Electronic Component Substrate Material 有权
    树脂基板材料，通过无电镀制造的电子部件基板材料及其制造电子部件基板材料的方法

    公开(公告)号：US20080138629A1

    公开(公告)日：2008-06-12

    申请号：US11795355

    申请日：2006-02-27

    申请人： Toshifumi Kawamura ,  Toru Imori

    发明人： Toshifumi Kawamura ,  Toru Imori

    IPC分类号： B32B15/08 ,  C23C18/31

    CPC分类号： C23C18/2066 ,  C23C18/30 ,  C23C18/31 ,  C23C18/40 ,  H05K3/181 ,  H05K3/389 ,  H05K3/4661 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31721

    摘要： There is provided a technology that can be applied as a substrate material to ordinary resin substrate materials and allows the adhesive strength between this substrate material and a plating metal layer to be increased; more specifically, there is provided an ordinary resin substrate material with an increased adhesive strength between the substrate material and a plating metal layer. The present invention relates to a resin substrate material such as an epoxy resin whose surface is swellable in a solution containing imidazolesilane and a palladium or other noble metal compound having a catalytic action in electroless plating and which has been surface-treated with the solution, and to an electronic component substrate material manufactured by performing electroless plating on this resin substrate material.

    摘要翻译： 提供了可用作普通树脂基板材料的基板材料的技术，并且允许该基板材料和电镀金属层之间的粘合强度增加; 更具体地，提供了在基板材料和电镀金属层之间具有增加的粘合强度的普通树脂基板材料。 本发明涉及一种树脂基板材料，例如环氧树脂，其表面在包含咪唑烷的溶液中可膨胀，并且具有在化学镀中具有催化作用的钯或其它贵金属化合物，并且已经用溶液进行了表面处理， 涉及通过在该树脂基板材料上进行无电解电镀制造的电子部件基板材料。