摘要:
Laminates for printed wiring boards for the making of laminates for printed wiring boards having an impregnant including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.
摘要:
In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed.
摘要:
An object of the present invention is to provide a coating composition capable of forming a cured coating film with excellent scratch resistance, acid resistance, stain resistance, and finished appearance.The present invention provides coating composition comprising (A) carboxy-containing polymer, (B) epoxy-containing acrylic resin, and (C) carboxy-containing reaction product with an acid value of 50 to 200 mg KOH/g and a number average molecular weight of 600 to 5,000 obtained by a half-esterification reaction of an acid anhydride with a polycarbonate polyol having three or more hydroxyl groups per molecule.
摘要:
The present invention relates to curable compositions comprising a thermolatent amidine base and an organic material which is polymerisable or crosslinkable with a basic or nucleophilic catalyst. In particular, the invention relates to curable coating compositions, especially powder coating compositions, and curable adhesive compositions, as well as to the use a thermo-latent amidine base as a curing catalyst for thermally induced base- catalyzed polymerisation or crosslinking reactions.
摘要:
The invention relates to heat-curing powder-lacquer compositions exhibiting a matte surface after curing of the coating, as well as to a simple method for production of the same.
摘要:
A composition useful as an impregnant for the making of laminates for printed wiring boards comprises a FR4 epoxy resin which is a bisphenol A epoxy resin advanced with tetrabromobisphenol A, a crosslinking agent of a strene-maleic anhydride copolymer and a co-crosslinking agent is an optionally brominated bisphenol A and/or an optionally brominated bisphenol A diglycidyl ether.
摘要:
A powder clear coating composition with a resin solids content comprising at least one epoxy-functional (meth)acrylic copolymer (A) having an epoxy equivalent weight of 250 to 600 and a carboxyl-functional curing component (B) of dodecanedioic acid (B1) and at least one carboxyl-functional urethane component (B2) having a carboxyl number of 80 to 350 mg of KOH/g, wherein the epoxy groups of the epoxy-functional (meth)acrylic copolymer (A) are in a molar ratio to the carboxyl groups of the carboxyl-functional curing component (B) of 2.5:1 to 0.8:1 and wherein 30 to 75% of the carboxyl groups provided by the carboxyl-functional curing component (B) are provided by the dodecanedioic acid (B1) and the remainder to make the total up to 100% by the at least one carboxyl-functional urethane component (B2).
摘要:
A thermosetting composition comprising a co-reactable solid, particulate mixture of (a) polycarboxylic acid functional polymer, and (b) epoxy functional polymer, is described. The polycarboxylic acid functional polymer and epoxy functional polymer are each prepared by atom transfer radical polymerization and have well defined polymer chain architecture and polydispersity index of less than 2.5. The thermosetting compositions of the present invention have utility as powder coatings compositions.
摘要:
New amidine/isocyanate adducts are particularly useful as catalysts for hardening epoxy resins, in particular pulverulent coating compositions based on epoxy resins. New bicyclic amidines are excellent starting materials for manufacturing these amidine/isocyanate adducts.
摘要:
New amidine/isocyanate adducts are particularly useful as catalysts for hardening epoxy resins, in particular pulverulent coating compositions based on epoxy resins. New bicyclic amidines are excellent starting materials for manufacturing these amidine/isocyanate adducts.