公开(公告)号：US09911751B2

公开(公告)日：2018-03-06

申请号：US15155937

申请日：2016-05-16

申请人： SK hynix Inc.

发明人： Woo June Kwon ,  Jong Hoon Kim ,  Chan Sun Hyun

IPC分类号： H01L21/336 ,  H01L27/11582 ,  H01L27/11565 ,  H01L27/11568 ,  H01L23/528 ,  H01L23/522 ,  H01L21/768

CPC分类号： H01L27/11582 ,  H01L21/31116 ,  H01L21/76816 ,  H01L21/76829 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/544 ,  H01L27/11565 ,  H01L27/11568 ,  H01L2223/54426 ,  H01L2223/54453

摘要： A manufacturing method for a semiconductor device includes forming a first stacked structure, forming a first hole penetrating the first stacked structure, forming a reflective metal pattern in the first hole, filling an etch stop layer in the first hole and over the reflective metal pattern, forming a second stacked structure over the first stacked structure, and forming a second hole penetrating the second stacked structure to expose the etch stop layer.

公开(公告)号：US09906312B2

公开(公告)日：2018-02-27

申请号：US14704174

申请日：2015-05-05

申请人： SK hynix Inc.

发明人： Jong Hoon Kim

IPC分类号： H04B10/40 ,  H04B10/80

CPC分类号： H04B10/803 ,  H01L2224/16225 ,  H01L2924/15311 ,  H04B10/40

摘要： A semiconductor package includes a first transceiver disposed on a top surface of a substrate; and a second transceiver disposed on a bottom surface of the substrate. The first and second transceivers optically communicate with each other through optical signals that permeate the substrate.

公开(公告)号：US09847322B2

公开(公告)日：2017-12-19

申请号：US15400341

申请日：2017-01-06

申请人： SK hynix Inc.

发明人： Ki Jun Sung ,  Jong Hoon Kim ,  Yeon Seung Jung ,  Hyeong Seok Choi

IPC分类号： H01L23/495 ,  H01L25/065 ,  H01L23/498 ,  H01L23/367

CPC分类号： H01L25/0657 ,  H01L23/367 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2924/15311

摘要： There is provided a structure and a method of manufacturing a semiconductor package. The method includes disposing a first semiconductor device and through mold ball connectors (TMBCs) on a first surface of an interconnection structure layer, recessing a molding layer on the first surface of the interconnection structure layer to expose a portion of each of the TMBCs, attaching outer connectors to the exposed portions of the TMBCs, and mounting a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer.

公开(公告)号：US20170064832A1

公开(公告)日：2017-03-02

申请号：US14989921

申请日：2016-01-07

申请人： SK hynix Inc.

发明人： Seung Yeop Lee ,  Joo Hyun Kang ,  Jong Hoon Kim ,  Han Jun Bae

IPC分类号： H05K1/18 ,  H05K1/02

CPC分类号： H05K1/028 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/97 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/14 ,  H05K1/147 ,  H05K2201/0385 ,  H05K2201/05 ,  H05K2201/058 ,  H01L2924/00012

摘要： A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.

摘要翻译： 柔性器件包括第一导电图案，第二导电图案和介电层。 第一导电图案包括第一滑动接触部分和第一延伸部分。 第二导电图案包括与第一滑动接触部分重叠的第二滑动接触部分，并且第二导电图案包括第二延伸部分。 第二滑动接触部分与第一滑动接触部分接触并可在第一滑动接触部分上移动以进行滑动。 第一和第二导电图案嵌入在介电层中。

公开(公告)号：US09543251B2

公开(公告)日：2017-01-10

申请号：US14339029

申请日：2014-07-23

申请人： SK hynix Inc.

发明人： Tae Min Kang ,  Dae Woong Lee ,  Jong Hoon Kim

IPC分类号： H01L23/00 ,  H01L23/58 ,  H01L25/065 ,  H01L23/31 ,  H01L21/78 ,  H01L21/304

CPC分类号： H01L23/562 ,  H01L21/304 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/585 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/13009 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48111 ,  H01L2224/49176 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81903 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2924/00012

摘要： A semiconductor chip includes a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, and a girder beam disposed outside of the circuit unit and within the semiconductor substrate.

摘要翻译： 半导体芯片包括具有前表面的半导体衬底，形成在半导体衬底内并从前表面延伸到半导体衬底中的电路单元，以及与前表面相对的后表面，以及设置在电路单元外侧的大梁 并在半导体衬底内。

公开(公告)号：US09390997B2

公开(公告)日：2016-07-12

申请号：US14139249

申请日：2013-12-23

申请人： SK hynix Inc. ,  Seoul National University R&DB Foundation

发明人： Jong Hoon Kim ,  Jae Hyun Son ,  Byoung Do Lee ,  Kuk Jin Chun ,  Woong Kyu Choi

IPC分类号： H01L23/528 ,  H01L23/373 ,  H01L25/065 ,  H01L23/367 ,  H01L23/498 ,  H01L23/50 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/373 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06136 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/014

摘要： The disclosure relates to a semiconductor chip and a stacked type semiconductor package having the same. The semiconductor chip includes: a semiconductor chip body having a first surface formed with a plurality of bonding pads and a second surface which is opposite to the first surface, a plurality of first and second through electrodes that pass through the semiconductor chip body and one ends thereof are electrically connected to the bonding pads, an insulating layer formed over the second surface of the semiconductor chip body such that the other ends of the first and second through electrodes are not covered by the insulating layer, and a first heat spreading layer formed over the insulating layer.

摘要翻译： 本公开涉及一种半导体芯片和具有该半导体芯片的堆叠型半导体封装。 半导体芯片包括：具有形成有多个接合焊盘的第一表面和与第一表面相对的第二表面的半导体芯片本体，穿过半导体芯片主体的多个第一和第二贯通电极， 电连接到所述接合焊盘，绝缘层，形成在所述半导体芯片主体的所述第二表面上，使得所述第一和第二贯通电极的另一端不被所述绝缘层覆盖，并且形成在所述绝缘层上的第一散热层 绝缘层。