公开(公告)号：US09671537B2

公开(公告)日：2017-06-06

申请号：US14920126

申请日：2015-10-22

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Yin Qian ,  Chen-Wei Lu ,  Jin Li

IPC: H04N5/225 ,  G02B5/20

CPC classification number: G02B5/208 ,  G02B5/201 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14649 ,  H04N5/2254 ,  H04N5/33 ,  H04N5/332 ,  H04N9/045

Abstract: Embodiments are described of a color filter array including a plurality of tiled minimal repeating units. Each minimal repeating unit includes an invisible-wavelength filter layer including a plurality of filters and a visible-wavelength filter layer positioned on the invisible-wavelength filter layer and having a plurality of filters such that each filter from the visible-wavelength layer is optically coupled to a corresponding filter in the invisible-wavelength layer.

公开(公告)号：US20170142360A1

公开(公告)日：2017-05-18

申请号：US14941254

申请日：2015-11-13

Applicant: OmniVision Technologies, Inc.

Inventor： Takayuki Goto ,  Yin Qian ,  Chen-wei Lu

IPC: H04N5/369 ,  G06F3/01 ,  H01L27/146 ,  G02B27/00 ,  G02F1/1337 ,  H04N5/33 ,  G02B27/01

CPC classification number: H04N5/3696 ,  G02B27/0093 ,  G02B27/0172 ,  G02B2027/0138 ,  G02F1/13318 ,  G02F1/133723 ,  G02F1/133784 ,  G02F1/136277 ,  G02F2001/13312 ,  G02F2203/11 ,  G06F3/013 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14649 ,  H01L27/14685 ,  H04N5/33

Abstract: A novel head mounted display includes a display/image sensor. In a particular embodiment the display/image sensor is formed on a single silicon die, which includes display pixels and light sensor pixels. The display pixels and light sensor pixels are each arranged in rows and columns, and the arrays of light sensor pixels and display pixels are interlaced. The center of each light sensor pixel is located between adjacent rows and adjacent columns of display pixels.

公开(公告)号：US20150271377A1

公开(公告)日：2015-09-24

申请号：US14222901

申请日：2014-03-24

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Jin Li ,  Yin Qian ,  Gang Chen ,  Dyson H. Tai

IPC: H04N5/232 ,  H04N5/372

CPC classification number: H04N9/045 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14645 ,  H01L27/14649

Abstract: An image sensor includes a pixel array with a plurality of pixels arranged in a semiconductor layer. A color filter array including a plurality of groupings of filters is disposed over the pixel array. Each filter is optically coupled to a corresponding one of the plurality pixels. Each one of the plurality of groupings of filters includes a first, a second, a third, and a fourth filter having a first, a second, the second, and a third color, respectively. A metal layer is disposed over the pixel array and is patterned to include a metal mesh having mesh openings with a size and pitch to block incident light having a fourth color from reaching the corresponding pixel. The metal layer is patterned to include openings without the metal mesh to allow the incident light to reach the other pixels.

Abstract translation: 图像传感器包括具有布置在半导体层中的多个像素的像素阵列。 包括多个滤光器组的滤色器阵列设置在像素阵列上。 每个滤光器光耦合到多个像素中的对应的一个。 多个分组滤波器中的每一个分别包括具有第一，第二，第二和第三颜色的第一，第二，第三和第四滤波器。 金属层设置在像素阵列上方并且被图案化以包括具有尺寸和间距的网孔的金属网，以阻挡具有第四颜色的入射光到达相应的像素。 金属层被图案化以包括没有金属网的开口，以允许入射光到达其它像素。

公开(公告)号：US20150270302A1

公开(公告)日：2015-09-24

申请号：US14222833

申请日：2014-03-24

Applicant: Omnivision Technologies, Inc.

Inventor： Jin Li ,  Yin Qian ,  Gang Chen ,  Dyson H. Tai ,  Dajiang Yang

IPC: H01L27/146 ,  G02B13/00

CPC classification number: H01L27/14627 ,  G02B13/0015 ,  H01L27/14643

Abstract: An image sensor includes a plurality of photosensitive devices arranged in a semiconductor substrate. A planar layer is disposed over the plurality of photosensitive devices in the semiconductor substrate. A plurality of first microlenses comprised of a lens material is arranged in first lens regions on the planar layer. A plurality of lens barriers comprised of the lens material is arranged on the planar layer to provide boundaries that define second lens regions on the planar layer. A plurality of second microlenses comprised of the lens material is formed within the boundaries provided by the plurality of lens barriers that define the second lens regions on the planar layer. The plurality of lens barriers are integrated with respective second microlenses after a reflow process of the plurality of second microlenses.

Abstract translation: 图像传感器包括布置在半导体衬底中的多个感光器件。 平面层设置在半导体衬底中的多个光敏器件上。 由透镜材料构成的多个第一微透镜布置在平面层上的第一透镜区域中。 由透镜材料构成的多个透镜屏障布置在平面层上以提供在平面层上限定第二透镜区域的边界。 由透镜材料构成的多个第二微透镜形成在由平面层上限定第二透镜区域的多个透镜屏障提供的边界内。 在多个第二微透镜的回流处理之后，多个透镜屏障与相应的第二微透镜集成。

公开(公告)号：US20140239351A1

公开(公告)日：2014-08-28

申请号：US13777197

申请日：2013-02-26

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Gang Chen ,  Duli Mao ,  Hsin-Chih Tai ,  Vincent Venezia ,  Yin Qian ,  Howard E. Rhodes

IPC: H01L27/146

CPC classification number: H01L27/14689 ,  H01L27/1461 ,  H01L27/1463 ,  H01L27/14643

Abstract: Embodiments of a process including depositing a sacrificial layer on the surface of a substrate over a photosensitive region, over the top surface of a transfer gate, and over at least the sidewall of the transfer gate closest to the photosensitive region, the sacrificial layer having a selected thickness. A layer of photoresist is deposited over the sacrificial layer, which is patterned and etched to expose the surface of the substrate over the photosensitive region and at least part of the transfer gate top surface, leaving a sacrificial spacer on the sidewall of the transfer gate closest to the photosensitive region. The substrate is plasma doped to form a pinning layer between the photosensitive region and the surface of the substrate. The spacing between the pinning layer and the sidewall of the transfer gate substantially corresponds to a thickness of the sacrificial spacer. Other embodiments are disclosed and claimed.

Abstract translation: 一种方法的实施方案包括在光敏区域上方的基底表面上沉积牺牲层，在转移栅极的顶表面上，以及至少最靠近光敏区域的转移栅极的侧壁上，牺牲层具有 选择厚度。 在牺牲层上沉积一层光致抗蚀剂，其被图案化和蚀刻以在基片的表面上在感光区域和至少部分传输栅极顶表面上露出基底表面，在传输门的侧壁上留下牺牲隔离物 到感光区域。 衬底是等离子体掺杂的，以在光敏区域和衬底的表面之间形成钉扎层。 钉扎层和转移门的侧壁之间的间隔基本上对应于牺牲间隔物的厚度。 公开和要求保护其他实施例。

公开(公告)号：US08817142B2

公开(公告)日：2014-08-26

申请号：US13686776

申请日：2012-11-27

Applicant: OmniVision Technologies, Inc.

Inventor： Hsin-Chih Tai ,  Yin Qian ,  Duli Mao ,  Vincent Venezia

IPC: H04N3/14 ,  H04N5/335 ,  H04N9/04 ,  H04N9/083 ,  H01L27/146

CPC classification number: H04N9/045 ,  H01L27/14621 ,  H01L27/14643

Abstract: A color image sensor includes a pixel array including CFA overlaying an array of photo-sensors for acquiring color image data. The CFA includes first color filter elements of a first color overlaying a first group of the photo-sensors and second color filter elements of a second color overlaying a second group of the photo-sensors. The first group of photo-sensors generate first color signals of a first color channel and the second group of photo-sensors generate second color signals of a second color channel. The color image sensor further includes a color signal combiner circuit (“CSCC”) coupled to receive the first and second color signals output from the pixel array. The CSCC includes a combiner coupled to combine the first and second colors signals to generate third color signals of a third color channel. An output port is coupled to the CSCC to output the color image data.

Abstract translation: 彩色图像传感器包括像素阵列，其包括覆盖用于获取彩色图像数据的光电传感器阵列的CFA。 CFA包括覆盖第一组光传感器的第一颜色的第一滤色器元件和覆盖第二组光传感器的第二颜色的第二滤色器元件。 第一组光电传感器产生第一颜色通道的第一颜色信号，第二组光电传感器产生第二颜色通道的第二颜色信号。 彩色图像传感器还包括耦合以接收从像素阵列输出的第一和第二颜色信号的颜色信号组合器电路（“CSCC”）。 CSCC包括组合器，其被耦合以组合第一和第二颜色信号以产生第三颜色通道的第三颜色信号。 输出端口耦合到CSCC以输出彩色图像数据。

公开(公告)号：US20140124889A1

公开(公告)日：2014-05-08

申请号：US13669107

申请日：2012-11-05

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Yin Qian ,  Hsin-Chih Tai ,  Tiejun Dai ,  Duli Mao ,  Cunyu Yang ,  Howard E. Rhodes

IPC: H01L27/146 ,  H01L21/30 ,  H01L31/18 ,  H01L23/52

CPC classification number: H01L27/1469 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/585 ,  H01L24/05 ,  H01L24/08 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14689 ,  H01L2224/04042 ,  H01L2224/05567 ,  H01L2224/08145 ,  H01L2224/80896 ,  H01L2224/9202 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12043 ,  H01L2924/1434 ,  H01L2924/37001 ,  H01L2224/80 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2224/80001 ,  H01L2224/82

Abstract: An integrated circuit system includes a first device wafer bonded to a second device wafer at a bonding interface of dielectrics. Each wafer includes a plurality of dies, where each die includes a device, a metal stack, and a seal ring that is formed at an edge region of the die. Seal rings included in dies of the second device wafer each include a first conductive path provided with metal formed in a first opening that extends from a backside of the second device wafer, through the second device wafer, and through the bonding interface to the seal ring of a corresponding die in the first device wafer.

Abstract translation: 集成电路系统包括在电介质的接合界面处结合到第二器件晶片的第一器件晶片。 每个晶片包括多个模具，其中每个模具包括形成在模具的边缘区域处的装置，金属堆叠和密封环。 包括在第二器件晶片的管芯中的密封圈各自包括设置有金属的第一导电路径，所述第一导电路径形成在从第二器件晶片的背面延伸穿过第二器件晶片的第一开口中，并且通过接合界面到达密封环 在第一器件晶片中的相应管芯。

公开(公告)号：US20130122637A1

公开(公告)日：2013-05-16

申请号：US13735787

申请日：2013-01-07

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Hsin-Chih Tai ,  Vincent Venezia ,  Yin Qian ,  Duli Mao ,  Keh-Chiang Ku

IPC: H01L27/146

CPC classification number: H01L27/14643 ,  H01L27/14636 ,  H01L27/1464

Abstract: A backside illuminated imaging sensor with a seal ring support includes an epitaxial layer having an imaging array formed in a front side of the epitaxial layer. A metal stack is coupled to the front side of the epitaxial layer, wherein the metal stack includes a seal ring formed in an edge region of the imaging sensor. An opening is included that extends from the back side of the epitaxial layer to a metal pad of the seal ring to expose the metal pad. The seal ring support is disposed on the metal pad and within the opening to structurally support the seal ring.

Abstract translation: 具有密封环支撑件的背面照明成像传感器包括具有形成在外延层的前侧的成像阵列的外延层。 金属叠层耦合到外延层的前侧，其中金属堆叠包括形成在成像传感器的边缘区域中的密封环。 包括从外延层的背面延伸到密封环的金属焊盘以露出金属焊盘的开口。 密封环支撑件设置在金属垫上并且在开口内，以在结构上支撑密封环。

公开(公告)号：US20130083224A1

公开(公告)日：2013-04-04

申请号：US13686788

申请日：2012-11-27

Applicant: Omnivision Technologies, Inc.

Inventor： Hsin-Chih Tai ,  Yin Qian ,  Duli Mao ,  Vincent Venezia

IPC: H04N9/04

CPC classification number: H04N9/045 ,  H01L27/14621 ,  H01L27/14643

Abstract: A color image sensor includes a pixel array including a CFA overlaying an array of photo-sensors for acquiring a color image. The CFA includes first color filter elements of a first color overlaying a first group of the photo-sensors, second color filter elements of a second color overlaying a second group of the photo-sensors, and a plurality of filter stacks overlaying a third group of the photo-sensors. The first group generates first color signals of a first color channel and the second group generates second color signals of a second color channel. Each of the filter stacks includes a first stacked filter of the first color and a second stacked filter of the second color. A sensitivity of the filter stacks equals a product of sensitivities of the first and the second stacked filters and the filter stacks generate a third color channel.

Abstract translation: 彩色图像传感器包括像素阵列，其包括重叠用于获取彩色图像的光电传感器阵列的CFA。 CFA包括覆盖第一组光传感器的第一颜色的第一滤色器元件，覆盖第二组光传感器的第二颜色的第二滤色器元件和覆盖第三组光电传感器的多个滤光片堆叠 光电传感器。 第一组产生第一颜色通道的第一颜色信号，第二组产生第二颜色通道的第二颜色信号。 每个过滤器堆叠包括第一颜色的第一堆叠过滤器和第二颜色的第二堆叠过滤器。 滤波器堆叠的灵敏度等于第一和第二堆叠滤波器的灵敏度的乘积，并且滤波器堆叠产生第三颜色通道。

公开(公告)号：US20130083223A1

公开(公告)日：2013-04-04

申请号：US13686776

申请日：2012-11-27

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Hsin-Chih Tai ,  Yin Qian ,  Duli Mao ,  Vincent Venezia

IPC: H04N9/04

CPC classification number: H04N9/045 ,  H01L27/14621 ,  H01L27/14643

Abstract: A color image sensor includes a pixel array including CFA overlaying an array of photo-sensors for acquiring color image data. The CFA includes first color filter elements of a first color overlaying a first group of the photo-sensors and second color filter elements of a second color overlaying a second group of the photo-sensors. The first group of photo-sensors generate first color signals of a first color channel and the second group of photo-sensors generate second color signals of a second color channel. The color image sensor further includes a color signal combiner circuit (“CSCC”) coupled to receive the first and second color signals output from the pixel array. The CSCC includes a combiner coupled to combine the first and second colors signals to generate third color signals of a third color channel. An output port is coupled to the CSCC to output the color image data.

Abstract translation: 彩色图像传感器包括像素阵列，其包括覆盖用于获取彩色图像数据的光电传感器阵列的CFA。 CFA包括覆盖第一组光传感器的第一颜色的第一滤色器元件和覆盖第二组光传感器的第二颜色的第二滤色器元件。 第一组光电传感器产生第一颜色通道的第一颜色信号，第二组光电传感器产生第二颜色通道的第二颜色信号。 彩色图像传感器还包括耦合以接收从像素阵列输出的第一和第二颜色信号的颜色信号组合器电路（CSCC）。 CSCC包括组合器，其被耦合以组合第一和第二颜色信号以产生第三颜色通道的第三颜色信号。 输出端口耦合到CSCC以输出彩色图像数据。