-
公开(公告)号：US20180364200A1
公开(公告)日：2018-12-20
申请号：US16109437
申请日：2018-08-22
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston
Abstract: An ultrasound device, including a profile generator, an encoder configured to receive a profile signal from the profile generator, and an attenuator configured to receive a signal representing an output of an ultrasound sensor and coupled to the encoder to receive a control signal from the encoder, the attenuator including a plurality of attenuator stages, the attenuator configured to produce an output signal that is an attenuated version of the input signal.
-
公开(公告)号：US20170307739A1
公开(公告)日：2017-10-26
申请号：US15645771
申请日：2017-07-10
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston
IPC: G01S7/524 , H03K19/0175 , G01S7/521
CPC classification number: G01S7/524 , A61B8/4483 , A61B8/54 , G01S7/5202 , G01S7/5208 , G01S7/52096 , G01S7/521 , H03K19/017545
Abstract: Apparatus and methods are provided directed to a device, including at least one ultrasonic transducer, a multi-level pulser coupled to the at least one ultrasonic transducer; the multi-level pulser including a plurality of input terminals configured to receive respective input voltages, an output terminal configured to provide an output voltage, and a signal path between a first input terminal and the output terminal including a first transistor having a first conductivity type coupled to a first diode and, in parallel, a second transistor having a second conductivity type coupled to a second diode.
-
公开(公告)号：US20170285155A1
公开(公告)日：2017-10-05
申请号：US15087914
申请日：2016-03-31
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston , Keith G. Fife
CPC classification number: G01S7/52022 , A61B7/04 , G01S7/52017 , G01S7/5202 , G01S7/52047 , G01S7/5208 , G01S7/521 , G01S15/8915 , G01S15/8977
Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.
-
公开(公告)号：US20170285150A1
公开(公告)日：2017-10-05
申请号：US15087943
申请日：2016-03-31
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston , Keith G. Fife
IPC: G01S7/521 , H03K17/687
CPC classification number: G01S7/521 , G01S7/52017 , G01S7/5202 , G01S7/52047 , G01S7/5208 , G01S15/8915 , H03K17/6874
Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.
-
公开(公告)号：US20170160388A1
公开(公告)日：2017-06-08
申请号：US14957051
申请日：2015-12-02
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Keith G. Fife , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
IPC: G01S7/527
CPC classification number: G01S7/5273 , B06B1/0292 , G01S7/52026 , G01S7/5208 , G01S15/8959
Abstract: Methods and apparatus are described for implementing a coding scheme on ultrasound signals received by a plurality of ultrasonic transducers. The coding, and subsequent decoding, may allow for multiple ultrasonic transducers to be operated in a receive mode simultaneously while still differentiating the contribution of the individual ultrasonic transducers. Improved signal characteristics may result, including improved signal-to-noise ratio (SNR).
-
Patent Agency Ranking
公开(公告)号：US20170160387A1
公开(公告)日：2017-06-08
申请号：US15288324
申请日：2016-10-07
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston
IPC: G01S7/524 , G01S7/521 , H03K19/0175
CPC classification number: G01S7/524 , A61B8/4483 , A61B8/54 , G01S7/5202 , G01S7/5208 , G01S7/52096 , G01S7/521 , H03K19/017545
Abstract: Apparatus and methods are provided directed to a device, including at least one ultrasonic transducer, a multi-level pulser coupled to the at least one ultrasonic transducer; the multi-level pulser including a plurality of input terminals configured to receive respective input voltages, an output terminal configured to provide an output voltage, and a signal path between a first input terminal and the output terminal including a first transistor having a first conductivity type coupled to a first diode and, in parallel, a second transistor having a second conductivity type coupled to a second diode.
-
公开(公告)号：US20210313939A1
公开(公告)日：2021-10-07
申请号：US17200675
申请日：2021-03-12
Applicant: Butterfly Network, Inc.
Inventor： Amandeep Singh , Kailiang Chen , Tyler S. Ralston
IPC: H03F3/45 , H03M1/12 , B06B1/02 , G01S15/89 , G01N29/44 , G01S7/523 , G01H17/00 , G01S7/526 , G01N29/36 , G01N29/24 , H03F3/30 , G01S7/52
Abstract: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.
-
公开(公告)号：US20210183832A1
公开(公告)日：2021-06-17
申请号：US17124100
申请日：2020-12-16
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Nevada J. Sanchez , Jianwei Liu
Abstract: Aspects of the technology described herein related to an ultrasound device including a first integrated circuit substrate having first integrated ultrasound circuitry and a second integrated circuit substrate having second integrated ultrasound circuitry. The first and second integrated circuit substrates are arranged in a vertical stack. A first conductive pillar is electrically coupled, through a first redistribution layer, to the first integrated circuit substrate, and a second conductive pillar is electrically coupled, through the first and second redistribution layers, to the second integrated circuit substrate.
-
公开(公告)号：US10972842B2
公开(公告)日：2021-04-06
申请号：US16016359
申请日：2018-06-22
Applicant: Butterfly Network, Inc.
Inventor： Joseph Lutsky , Nevada J. Sanchez , Kailiang Chen , Keith G. Fife , Tyler S. Ralston
Abstract: Aspects of the technology described herein relate to ultrasound circuits that employ a differential ultrasonic transducer element, such as a differential micromachined ultrasonic transducer (MUT) element. The differential ultrasonic transducer element may be coupled to an integrated circuit that is configured to operate the differential ultrasonic transducer element in one or more modes of operation, such as a differential receive mode, a differential transmit mode, a single-ended receive mode, and a single-ended transmit mode.
-
公开(公告)号：US20190282207A1
公开(公告)日：2019-09-19
申请号：US16432901
申请日：2019-06-05
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Nevada J. Sanchez , Christopher Thomas McNulty
Abstract: An exemplary system includes a first ultrasonic transducer assembly configured to deliver high intensity focused ultrasonic (HIFU) energy to a point of interest within a subject, and a second ultrasonic transducer assembly configured to perform imaging of the subject. In another embodiment, a housing is configured to receive an ultrasound probe. The housing may include a cooling circuit and power supply for the ultrasound probe.
-
-
-
-
-
-
-
-
-
Search Results
64
records
(took 0.016 seconds)
