公开(公告)号：US11675227B2

公开(公告)日：2023-06-13

申请号：US17260911

申请日：2020-03-20

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu Li

IPC: G02F1/1335 ,  G02F1/1347

CPC classification number: G02F1/133548 ,  G02F1/1347 ,  G02F1/133514

Abstract: The embodiments of the present disclosure relate to the field of display technologies, in particular to a metal wire grid polarizer and a manufacturing method thereof, and a display device. The metal wire grid polarizer includes a base substrate and a plurality of metal wire grids. The base substrate has a plurality of binding areas and a plurality of binding contraposition areas. The metal wire grids are disposed on the base substrate and arranged parallel to each other, and orthographic projections of the metal wire grids on the base substrate do not overlap with the binding areas or the binding contraposition areas, to avoid the metal wire grids from shielding light in the binding process, ensure the alignment process to proceed smoothly, and realize the binding accuracy.

公开(公告)号：US11239298B2

公开(公告)日：2022-02-01

申请号：US16641560

申请日：2019-08-26

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Muxin Di ,  Yingwei Liu ,  Zhiwei Liang ,  Haixu Li ,  Zhanfeng Cao

IPC: G09G3/3225 ,  H01L27/32 ,  H01L51/56

Abstract: An Organic Light-emitting Diode (OLED) display substrate, a method of forming the same and a display device are provided. The OLED display substrate includes: a driving thin film transistor located on a base substrate and configured to drive an OLED light-emitting unit to emit light; and a photosensitive thin film transistor located on the base substrate and configured to be capable of detecting light emitted by the OLED light-emitting unit and generating an electrical signal, at least a part of film layers of the photosensitive thin film transistor and at least a part of film layers of the driving thin film transistor are disposed at a same layer and made of a same material.

公开(公告)号：US11239257B2

公开(公告)日：2022-02-01

申请号：US16468240

申请日：2019-01-09

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei Liang ,  Yingwei Liu ,  Haixu Li ,  Muxin Di ,  Qingzhao Liu

IPC: H01L27/12 ,  H01L29/786

Abstract: The present disclosure provides a display backplane and a method for manufacturing the same, a display panel and a display device, and relates to the field of display technology. The display backplane includes a first backplane and a second backplane. The first backplane includes a first substrate, and a first thin film transistor, on the first substrate, configured to drive a light emitting unit. The second backplane, which is attached to a surface of the first substrate facing away from the first thin film transistor, includes a second substrate and at least one second thin film transistor located between the second substrate and the first substrate.

公开(公告)号：US20210407976A1

公开(公告)日：2021-12-30

申请号：US16765530

申请日：2019-05-31

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei Liang ,  Wenqian Luo ,  Yingwei Liu ,  Ke Wang ,  Qi Yao ,  Huijuan Wang ,  Haixu Li ,  Zhanfeng Cao ,  Guangcai Yuan ,  Xue Dong ,  Guoqiang Wang ,  Zhijun Lv

IPC: H01L25/16 ,  H01L27/12 ,  H01L23/00

Abstract: Provided is a display backplate includes including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

公开(公告)号：US11177327B2

公开(公告)日：2021-11-16

申请号：US16643082

申请日：2019-07-24

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Guangcai Yuan ,  Haixu Li

IPC: H01L27/32 ,  H01L31/075 ,  H01L51/56

Abstract: A display panel and manufacturing method thereof, a display device. The display panel includes a base substrate, light-emitting element and a photoelectric conversion structure: the light-emitting element is disposed on the base substrate; the photoelectric conversion structure is disposed on the base substrate and configured to receive a part of light emitted by the light-emitting element, convert energy of light received by the photoelectric conversion structure into electric energy, and supply the electric energy to the light-emitting element.

公开(公告)号：US20210308669A1

公开(公告)日：2021-10-07

申请号：US16761948

申请日：2019-10-22

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu Li

IPC: B01L3/00 ,  H01L27/20 ,  H01L41/04 ,  H01L41/047 ,  H01L41/053 ,  H01L41/09 ,  H01L41/23 ,  H01L41/29 ,  H01L31/105 ,  H01L31/18 ,  F04B43/04 ,  G01N29/02

Abstract: A microfluidic substrate and a manufacture method thereof, and a microfluidic panel are provided. The microfluidic substrate includes a base substrate, an acoustic wave generation device, and a first switching circuit. The acoustic wave generation device is on the base substrate and configured to emit an acoustic wave to drive a liquid droplet to move over the microfluidic substrates, the acoustic wave generation devices includes an acoustic wave driving electrode and an acoustic wave generation layer, the first switching circuit is on the base substrate, and the first switching circuit is electrically connected to the acoustic wave driving electrode and is configured to transmit an acoustic wave driving signal to the acoustic wave driving electrode, and the acoustic wave driving electrode is configured to drive the acoustic wave generation layer to generate the acoustic wave under control of the acoustic wave driving signal.

公开(公告)号：US20210265282A1

公开(公告)日：2021-08-26

申请号：US16973091

申请日：2020-03-27

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu Li

IPC: H01L23/00 ,  H01L27/12 ,  H01L25/16

Abstract: Provided is a drive backplane for a light-emitting diode, including a substrate and a drive structure on the substrate, the drive structure including a thin-film transistor and a stress relief structure; wherein the thin-film transistor includes an active layer on the substrate, a first insulation layer covering the active layer, and a first gate on the first insulation layer; and the stress relief structure is on the first insulation layer and includes a first metal strip on a first side of the first gate and a second metal strip on a second side of the first gate, wherein the first side is opposite to the second side. A method for preparing the light-emitting diode and a display device are further disclosed.

公开(公告)号：US10741661B2

公开(公告)日：2020-08-11

申请号：US15828768

申请日：2017-12-01

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu Li

IPC: H01L29/45 ,  H01L29/49 ,  H01L21/321 ,  H01L21/3213 ,  H01L29/786 ,  H01L29/66

Abstract: The present disclosure relates to a conductive layer, a thin film transistor and manufacturing methods therefor, an array substrate and a display device, in the field of displays. The conductive layer comprises: a metal layer and an organophosphorus-metal complex covering the metal layer. In the embodiments of the present disclosure, the organophosphorus-metal complex is manufactured on the surface of the metal layer to form the conductive layer. The conductive layer is adopted as an electrode material. In one aspect, the organophosphorus-metal complex has conductivity and can prevent the surface of metal from making contact with oxygen, thereby avoiding metal oxidation under the premise of not affecting the performances of the electrode when serving as a material of the electrode in a TFT. In the other aspect, the organophosphorus-metal complex can increase a binding force between the metal and photoresist and avoids stripping of the photoresist. Therefore, etching liquid is prevented from etching the metal in a position without the need of etching. The conductive layer provided by the present disclosure has the performances in the above two aspects. Therefore, the stability and electronic transmission performances of the electrode can be improved by adopting such a conductive layer to manufacture the electrode of the thin film transistor.

公开(公告)号：US20200242324A1

公开(公告)日：2020-07-30

申请号：US16607192

申请日：2019-05-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu Li ,  Zhanfeng Cao ,  Jianguo Wang

IPC: G06K9/00 ,  H01L27/32

Abstract: An array substrate, a method of manufacturing the array substrate, and a display apparatus are disclosed. The array substrate includes: a base substrate; a plurality of sensing elements disposed on a first side of the base substrate and each configured to convert at least one of a light signal and an acoustic wave signal into an electrical signal; and a plurality of switching devices disposed on a second side of the base substrate opposite to the first side. The plurality of switching devices include a plurality of first switching elements, and each of the plurality of first switching elements is electrically connected to a corresponding one of the plurality of sensing elements to transmit the electrical signal.

公开(公告)号：US10692952B2

公开(公告)日：2020-06-23

申请号：US16446067

申请日：2019-06-19

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Haixu Li ,  Zhanfeng Cao

IPC: H01L27/32 ,  H01L51/52

Abstract: The present disclosure provides an OLED substrate and a display device. The OLED substrate includes a base substrate, and a thin-film transistor, a first electrode, and a light-emitting layer arranged in sequence on the base substrate, in which the OLED substrate further includes a light-shielding layer arranged between an active layer of the thin-film transistor and the first electrode.