公开(公告)号：US20170237228A1

公开(公告)日：2017-08-17

申请号：US15272481

申请日：2016-09-22

Applicant: Innovative Micro Technology

Inventor： Christopher S. GUDEMAN

IPC: H01S5/02 ,  H04J14/02 ,  H01S5/40 ,  H01S5/022 ,  H01S5/0683

CPC classification number: H01S5/02292 ,  H01S5/0064 ,  H01S5/02216 ,  H01S5/02248 ,  H01S5/02288 ,  H01S5/02296 ,  H01S5/4025 ,  H01S5/4087 ,  H04B10/40

Abstract: A microfabricated optical apparatus that includes a light source driven by a waveform, a turning mirror, and a beam shaping element, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. The electrical signal may be communicated to external devices by at least one additional through silicon via.

公开(公告)号：US20170146793A1

公开(公告)日：2017-05-25

申请号：US15355461

申请日：2016-11-18

Applicant: Innovative Micro Technology

Inventor： Christopher S. GUDEMAN ,  Sangwoo Kim ,  Stuart Hutchinson ,  Marin SIGURDSON

IPC: G02B26/08 ,  G03F7/26 ,  G02B1/11 ,  G03F7/20 ,  B81B3/00 ,  B81C1/00

CPC classification number: G03F7/26 ,  B81B7/0067 ,  B81B2201/042 ,  B81B2201/047 ,  B81C2203/0109 ,  G02B1/11 ,  G02B27/0983 ,  G03F7/2004 ,  G03F7/2008 ,  G03F7/201

Abstract: A microfabricated optical apparatus that includes a light source or light detector in combination with an integrated turning surface to form a microfabricated optical subassembly. The integrated turning surface may be formed directly in the substrate material using gray scale lithography.

公开(公告)号：US20170062159A1

公开(公告)日：2017-03-02

申请号：US15237120

申请日：2016-08-15

Applicant: Innovative Micro Technology

Inventor： Benedikt ZEYEN

IPC: H01H36/00

CPC classification number: H01H36/0013 ,  H01H2036/0093

Abstract: A MEMS device, having two flexible, permeable members which are manufactured to have sub-millimeter dimensions using MEMS fabrication procedures. The flexible, permeable members may form a reed switch, which closes an electrical connection in the presence of a magnetic field, and opens the connection otherwise. The MEMS reed switch device may be made using a three-wafer architecture of a lid wafer, a device wafer, and a lower, supporting wafer.

Abstract translation: MEMS器件具有两个柔性的可渗透构件，其制造成具有使用MEMS制造程序的亚毫米尺寸。 柔性的可渗透构件可以形成簧片开关，其在存在磁场的情况下闭合电连接，否则打开连接。 可以使用盖晶片，器件晶片和下支撑晶片的三晶片架构来制造MEMS簧片开关器件。

公开(公告)号：US09533877B2

公开(公告)日：2017-01-03

申请号：US15098353

申请日：2016-04-14

Applicant: Innovative Micro Technology

Inventor： Benedikt Zeyen

IPC: H01L33/18 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0067 ,  B81B2201/0264 ,  B81B2201/047 ,  B81B2207/115 ,  B81C1/00317 ,  B81C3/001 ,  B81C2201/013 ,  B81C2201/0197 ,  B81C2203/031 ,  H01L24/00 ,  H04R19/02

Abstract: A first ion rich dielectric substrate with a patterned dielectric barrier and a oxidizable metal layer is anodically bonded to a second ion rich dielectric substrate. To bond the substrates, the oxidizable metal layer is oxidized. The dielectric barrier may inhibit the migration of these ions to the bondline, which might otherwise poison the bond strength. Accordingly, when joining the two substrates, a strong bond is maintained between the wafers.

Abstract translation: 具有图案化电介质阻挡层和可氧化金属层的第一富离子电介质基片阳极结合到第二富离子电介质基片上。 为了结合基板，可氧化的金属层被氧化。 电介质阻挡层可以抑制这些离子迁移到粘结线，否则可能会损害粘结强度。 因此，当接合两个基板时，在晶片之间保持牢固的结合。

公开(公告)号：US20160343684A1

公开(公告)日：2016-11-24

申请号：US15149217

申请日：2016-05-09

Applicant: Innovative Micro Technology

Inventor： Christopher S. GUDEMAN ,  Paul J. RUBEL

IPC: H01L23/00

CPC classification number: B81C1/00269 ,  B81C2203/0118 ,  B81C2203/037

Abstract: A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.

Abstract translation: 描述了用于接合两个基板的方法，包括提供第一和第二硅基板，在第一和第二硅基板中的至少一个上提供凸起特征，在第一和第二硅基板上形成金层， 并且将第一基板压靠在第二基板上，以在凸起特征周围形成热压接。 由相对表面上的凸起特征引起的高初始压力提供密封接合而不破坏凸起特征，而将凸起特征完全嵌入到相对表面中允许两个结合面接触。 这种大的接触面积提供高强度。

公开(公告)号：US09156679B1

公开(公告)日：2015-10-13

申请号：US14326406

申请日：2014-07-08

Applicant: Innovative Micro Technology

Inventor： Benedikt Zeyen ,  Jeffery F. Summers

IPC: H01L31/00 ,  H01L21/00 ,  B81B7/00 ,  B81C1/00 ,  H01L23/04 ,  H01L31/0203 ,  H01L33/48 ,  H01L31/18

CPC classification number: H01L31/18 ,  B81B2201/047 ,  B81B2207/093 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/031 ,  H01L31/0203 ,  H01L33/0079 ,  H02S40/44

Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a Second bond, for example a metal alloy, solder, eutectic and polymer bond. The two bonds may be used for the same or a different purpose, and may be selected for the following attributes: hermeticity, electrical conductivity, low RF loss, high adhesive strength, leak resistance, thermal conductivity. The attributes for each bonding technology may be the same, or they may be different.

Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有第二键，例如金属合金，焊料，共晶和聚合物键。 两个键可以用于相同或不同的目的，并且可以选择以下属性：气密性，导电性，低RF损耗，高粘合强度，耐漏电性，导热性。 每种粘合技术的属性可能相同，或者它们可能不同。

公开(公告)号：US11502669B2

公开(公告)日：2022-11-15

申请号：US16888879

申请日：2020-06-01

Applicant: Innovative Micro Technology

Inventor： Christopher S. Gudeman

IPC: G01N22/00 ,  H03H9/64 ,  B82Y20/00

Abstract: A microfabricated spectrometer uses at least one filter to discriminate the frequency components of an incoming RF signal. The filter center frequencies are chosen to correspond to wavelengths of target species which may be present in the gas, and radiating at a characteristic frequency.

公开(公告)号：US11258425B2

公开(公告)日：2022-02-22

申请号：US16888878

申请日：2020-06-01

Applicant: Innovative Micro Technology

Inventor： Christopher S. Gudeman

IPC: H01P7/06 ,  H01P1/12 ,  H03H9/02 ,  H03H9/64 ,  H01P7/08 ,  H01P1/18 ,  H03H9/15

Abstract: A microfabricated RF filter uses a resonant cavity weakly coupled to a transmission line, to attenuate noise sources emitting interference into the RF radiation at the resonant frequency. Radiation at the resonant frequency is leaked into the resonant cavity and build up there, until it is dumped to ground by a switch.

公开(公告)号：US10955336B2

公开(公告)日：2021-03-23

申请号：US16105448

申请日：2018-08-20

Applicant: Innovative Micro Technology

Inventor： Christopher S. Gudeman ,  Jaquelin K. Spong

IPC: G01J3/26 ,  G01J3/42 ,  G01N21/3504 ,  G01N21/25 ,  G01N33/00 ,  G01N21/35 ,  G01N21/03 ,  G01J3/12

Abstract: Systems and methods for forming a compact gas sensor include a multilayer etalon as a wavelength discriminating element. The position of the etalon may be adjusted to tune its transmission profile. And embodiment directed to carbon dioxide detection is described.

公开(公告)号：US20210083625A1

公开(公告)日：2021-03-18

申请号：US17035896

申请日：2020-09-29

Applicant: Innovative Micro Technology

Inventor： Christopher S. GUDEMAN ,  Abbas Abbaspour Tamijani

IPC: H03B9/14 ,  H01L47/02 ,  H03B7/14 ,  G01H13/00 ,  H03B5/18 ,  H03B7/06 ,  G01N22/00

Abstract: Systems and methods for forming a mm wave resonant filter include a lithographically fabricated high Q resonant structure. The resonant structure may include a plurality of cavities, each cavity having a characteristic frequency that defines its passband. A filter may include a plurality of resonant structures, and each resonant structure may include a plurality of cavities. These cavities and filters may be fabricated lithographically.