公开(公告)号：US20120247800A1

公开(公告)日：2012-10-04

申请号：US13447081

申请日：2012-04-13

申请人： Tushar K. Shah ,  John J. Morber

发明人： Tushar K. Shah ,  John J. Morber

IPC分类号： G02B5/22 ,  H05K9/00 ,  B82Y30/00

CPC分类号： H01B3/004 ,  H01B1/24 ,  H05K9/009

摘要： A shielded wire includes a carbon nanostructure (CNS)-shielding layer including a CNS material in a matrix material, the CNS-shielding layer being monolithic and disposed about a dielectric layer and a conducting wire, wherein the dielectric layer is disposed between the CNS-shielding layer and the conducting wire. An extruded thermoplastic jacket includes a CNS material, the extruded thermoplastic jacket being configured to protect at least one wire. A thermoplastic article includes a CNS-infused fiber material and a flexible thermoplastic.

摘要翻译： 屏蔽线包括在基体材料中包含CNS材料的碳纳米结构（CNS） - 屏蔽层，所述CNS屏蔽层是单片的并且设置在电介质层和导线周围，其中介电层设置在CNS- 屏蔽层和导线。 挤出的热塑性护套包括CNS材料，挤出的热塑性护套被配置为保护至少一根线。 热塑性制品包括CNS注入的纤维材料和柔性热塑性塑料。

公开(公告)号：US20120142836A1

公开(公告)日：2012-06-07

申请号：US13386201

申请日：2010-07-09

申请人： Takahiro Matsumoto ,  Hirotaka Tsuruya ,  Hajime Ban ,  Reiki Akita

发明人： Takahiro Matsumoto ,  Hirotaka Tsuruya ,  Hajime Ban ,  Reiki Akita

IPC分类号： C08K5/56 ,  H01B1/04 ,  B82Y30/00

CPC分类号： C09C1/56 ,  B82Y30/00 ,  C01B32/05 ,  C01P2004/03 ,  C01P2004/16 ,  C01P2004/32 ,  C01P2004/64 ,  C01P2006/40 ,  C08K7/04 ,  C08K9/04 ,  H01B3/004 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/0323 ,  Y10T428/2982

摘要： Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.

摘要翻译： 提供一种通过将液体金属醇盐加入到其中分散有包含碳材料的导电超细粉末并进一步加入水的含甲醇的有机溶剂中获得的绝缘超微粉及其制备方法。 此外，提供了通过将液体金属醇盐添加到其中分散有包含碳材料的导电性超微粉末的含甲醇的有机溶剂中而进一步添加具有醇盐基团的偶联剂然后向其中加入水而获得的绝缘超细粉末， 其制造方法 此外，提供了通过将本发明的绝缘超细粉末与体积比（绝缘超细粉末/树脂）的树脂混合在5/95至50/50的范围内而获得的高介电常数树脂复合材料。

公开(公告)号：US20120012362A1

公开(公告)日：2012-01-19

申请号：US12886972

申请日：2010-09-21

申请人： Yoon-Jin KIM ,  Jin-Ho Nam ,  Ho-Souk Cho ,  Young-Ho Park ,  Son Tung Ha

发明人： Yoon-Jin KIM ,  Jin-Ho Nam ,  Ho-Souk Cho ,  Young-Ho Park ,  Son Tung Ha

IPC分类号： H01B7/00

CPC分类号： H01B3/004 ,  H01B3/441 ,  H01B9/027

摘要： Provided is a DC power cable including a conductor, an inner semiconductive layer, an insulation and an outer semiconductive layer. In particular, the inner semiconductive layer or the outer semiconductive layer may be formed from a semiconductive composition containing a polypropylene base resin or a low-density polyethylene base resin and carbon nano tubes; and the insulation may be formed from an insulation composition containing a polypropylene base resin or a low-density polyethylene base resin and inorganic nano particles. The resulting power cable may have improved properties such as volume resistivity, hot set, and so on, and excellent space charge reducing effect.

摘要翻译： 提供一种包括导体，内部半导体层，绝缘体和外部半导体层的DC电力电缆。 特别地，内部半导体层或外部半导体层可以由含有聚丙烯基础树脂或低密度聚乙烯基础树脂和碳纳米管的半导体组合物形成; 并且绝缘体可以由包含聚丙烯基础树脂或低密度聚乙烯基础树脂和无机纳米颗粒的绝缘组合物形成。 所得到的电力电缆可能具有改进的性能，例如体积电阻率，热定型等，并且具有优异的空间电荷减少效果。

公开(公告)号：US08029694B2

公开(公告)日：2011-10-04

申请号：US12148906

申请日：2008-04-23

申请人： Yuji Saga

发明人： Yuji Saga

IPC分类号： C09K19/00 ,  C09K19/06 ,  C09K19/52 ,  G02F1/13

CPC分类号： C08K3/08 ,  C08K7/06 ,  C09K19/3809 ,  H01B3/004

摘要： A thermally conductive polymer composition comprising liquid crystalline polymer; metal alloy having a melting point of between about 200° C. and about 500° C.; and thermally conductive filler other than the metal alloy. The composition has a volume resistivity of at least about 1×1013 Ω·cm and a thermal conductivity of at least about 0.7 W/m·K.

摘要翻译： 包含液晶聚合物的导热聚合物组合物; 金属合金，其熔点在约200℃至约500℃之间; 和不同于金属合金的导热填料。 该组合物的体积电阻率为至少约1×10 13Ω·cm·cm，导热率为至少约0.7W / m·K。

公开(公告)号：US20110198544A1

公开(公告)日：2011-08-18

申请号：US13031071

申请日：2011-02-18

申请人： Lex Kosowsky ,  Robert Fleming ,  Junjun Wu ,  Thangamani Ranganathan

发明人： Lex Kosowsky ,  Robert Fleming ,  Junjun Wu ,  Thangamani Ranganathan

IPC分类号： H01B1/12 ,  H01B3/00 ,  H01B1/02 ,  B82Y99/00

CPC分类号： H01B3/004 ,  B82Y30/00 ,  H05K1/0254 ,  H05K2201/0738

摘要： Various embodiments of the invention disclosed herein provide for adjusting the electrical response of a voltage switchable dielectric material by incorporating one or more nanophase materials. Various aspects provide for a VSDM having improved electrical and/or physical properties. In some cases, a VSDM may have improved (e.g., lower) leakage current at a given voltage. A VSDM may have improved resistance to ESD events, and may have improved resistance to degradation associated with protecting against an ESD event.

摘要翻译： 本文公开的本发明的各种实施例提供了通过并入一种或多种纳米相材料来调节可切换电介质材料的电响应。 各种方面提供具有改进的电和/或物理性质的VSDM。 在一些情况下，VSDM可以在给定电压下具有改善的（例如较低）的漏电流。 VSDM可以具有改善的对ESD事件的抵抗力，并且可以改善与防​​止ESD事件相关的降解抗性。

公开(公告)号：US20100243303A1

公开(公告)日：2010-09-30

申请号：US12438485

申请日：2007-08-20

申请人： Motohiro Arifuku ,  Nichiomi Mochizuki ,  Kouji Kobayashi ,  Takashi Nakazawa ,  Takashi Tatsuzawa ,  Katsuyuki Masuda ,  Takako Ejiri

发明人： Motohiro Arifuku ,  Nichiomi Mochizuki ,  Kouji Kobayashi ,  Takashi Nakazawa ,  Takashi Tatsuzawa ,  Katsuyuki Masuda ,  Takako Ejiri

IPC分类号： H05K1/00 ,  H05K1/11 ,  H01R43/00 ,  H01B1/12

CPC分类号： H05K3/323 ,  C08G73/1039 ,  C08K9/02 ,  C08L2666/28 ,  C09J9/02 ,  C09J11/08 ,  C09J163/00 ,  C09J179/08 ,  H01B1/22 ,  H01B1/24 ,  H01B3/004 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/015 ,  H05K2203/122 ,  Y10T29/49117 ,  H01L2924/00

摘要： The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component.

摘要翻译： 本发明提供一种电路连接材料，用于电连接具有形成在第一电路基板的主表面上的第一电路电极的第一电路部件和形成在第二电路的主表面上的第二电路电极的第二电路部件 基板，其中第一和第二电路电极彼此相对，包括含有有机化合物的粘合剂组分，其中粘合剂组分含有含硅化合物的0.10质量％以硅原子计 ，基于粘合剂组分的总量。

公开(公告)号：US20090091418A1

公开(公告)日：2009-04-09

申请号：US12236879

申请日：2008-09-24

申请人： Matsvei ZINKEVICH

发明人： Matsvei ZINKEVICH

IPC分类号： H01C1/012 ,  H01C17/28

CPC分类号： H01C7/00 ,  G01K7/183 ,  H01B1/02 ,  H01B3/004 ,  Y10T29/49098

摘要： A coated wire is solderable with soft solder while maintaining separate phases of the core and the coating. A 100 μm to 400 μm thick nickel wire may be coated galvanically with silver. For a film resistor with coated wires as connection wires, including a platinum measurement resistor on an electrically insulating substrate and connection wires connected to the measurement resistor, the connection wires have a coated nickel core. The coating may be made of silver or glass or ceramic or a mixture of these materials, or on its outside may be made of glass or ceramic or a mixture of these materials. For producing film resistors a thin metal or glass component is deposited on a connection wire connected to a track conductor arranged on an electrically insulating substrate, and a thick glass paste is deposited and fired on this metal or glass component. For mass production of film, several film resistors encased together in glass may be partitioned by fracturing.

摘要翻译： 涂层线材可焊接软焊料，同时保持芯部和涂层的分离相。 100毫米至400毫米厚的镍线可以镀银电镀。 对于具有涂覆线作为连接线的薄膜电阻器，包括在电绝缘基板上的铂测量电阻器和连接到测量电阻器的连接线，连接线具有涂覆的镍芯。 涂层可以由银或玻璃或陶瓷或这些材料的混合物制成，或者在其外部可以由玻璃或陶瓷或这些材料的混合物制成。 为了制造薄膜电阻器，在连接到布置在电绝缘基板上的轨道导体的连接线上沉积薄金属或玻璃部件，并且在该金属或玻璃部件上沉积并烧制厚玻璃浆料。 为了大量生产膜，可以将几个封装在玻璃中的薄膜电阻器通过压裂分隔。

公开(公告)号：US20080265202A1

公开(公告)日：2008-10-30

申请号：US12148906

申请日：2008-04-23

申请人： Yuji Saga

发明人： Yuji Saga

IPC分类号： C09K5/00

CPC分类号： C08K3/08 ,  C08K7/06 ,  C09K19/3809 ,  H01B3/004

摘要： A thermally conductive polymer composition comprising liquid crystalline polymer; metal alloy having a melting point of between about 200° C. and about 500° C.; and thermally conductive filler other than the metal alloy. The composition has a volume resistivity of at least about 1×1013 Ω·cm and a thermal conductivity of at least about 0.7 W/m·K.

摘要翻译： 包含液晶聚合物的导热聚合物组合物; 金属合金，其熔点在约200℃至约500℃之间; 和不同于金属合金的导热填料。 组合物具有至少约1×10 3Ω·cm的体积电阻率和至少约0.7W / m·K的热导率。

公开(公告)号：US20080050580A1

公开(公告)日：2008-02-28

申请号：US11860635

申请日：2007-09-25

申请人： Gary Stevens ,  James Smith ,  John Wood ,  Andreas Lutz

发明人： Gary Stevens ,  James Smith ,  John Wood ,  Andreas Lutz

IPC分类号： B32B5/16 ,  C09J5/02

CPC分类号： H01B19/02 ,  B32B5/16 ,  B32B5/24 ,  B32B5/30 ,  B32B27/20 ,  B32B29/02 ,  B32B2255/04 ,  B32B2255/24 ,  B32B2260/021 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2581/00 ,  B32B2605/00 ,  H01B3/004 ,  H01B3/04 ,  Y10T428/25 ,  Y10T428/254

摘要： The impregnation of a composite tape (56) having a porous matrix with HTC particles provides for permeating a fabric substrate layer (51) of the composite tape with HTC particles and impregnating an impregnating resin into the composite tape (51). The HTC particles in the fabric (51) layer are comprised of a meso-micro mixture, which is between 1:4 to 4:1 meso sized particles to micro sized particles. Other smaller particles may also be included at lesser concentrations. The impregnating resin itself may also contain HTC particles.

摘要翻译： 用具有HTC颗粒的多孔基体的复合带（56）的浸渍提供用HTC颗粒渗透复合带的织物基底层（51）并将浸渍树脂浸渍到复合带（51）中。 织物（51）层中的HTC颗粒由中等微观混合物组成，介于1:4至4:1的中尺寸颗粒与微尺寸颗粒之间。 其他较小的颗粒也可以以较低浓度包含。 浸渍树脂本身也可以含有HTC颗粒。

公开(公告)号：US07238296B2

公开(公告)日：2007-07-03

申请号：US10646805

申请日：2003-08-25

申请人： Satoshi Moriya

发明人： Satoshi Moriya

IPC分类号： H01C7/00 ,  H01C3/00 ,  C22C9/05

CPC分类号： H01B3/004 ,  H01B1/02 ,  H01C7/06 ,  H01C17/06553

摘要： When the entire amount of conductive metal mixed powder made of copper, manganese, and germanium is 100 parts by weight, the metal mixed powder is formed by mixing 4.0 to 13.0 parts manganese by weight, 0.2 to 1.4 parts germanium by weight, and 85.6 to 95.8 parts copper by weight, and 0 to 10 parts glass powder by weight and 0 to 10 parts copper-oxide powder by weight are mixed relative to the entire amount (100 parts by weight) of these metal components. The obtained resistive paste is then baked, and the resistive composition having the low resistance value and low TCR may be obtained. In addition, a resistor is made by forming the resistive element upon a substrate.

摘要翻译： 当由铜，锰和锗制成的导电金属混合粉末的总量为100重量份时，通过将4.0〜13.0重量％的锰，0.2〜1.4重量％的锗和85.6重量％ 相对于这些金属成分的总量（100重量份），将95.8重量份的铜和0-10重量份的玻璃粉末和0-10重量份的氧化铜粉末进行混合。 然后将获得的电阻浆料烘烤，并且可以获得具有低电阻值和低TCR的电阻组合物。 此外，通过在基板上形成电阻元件来制造电阻器。