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    Methods and apparatuses for positioning nano-objects with aspect ratios
    32.
    发明授权
    Methods and apparatuses for positioning nano-objects with aspect ratios 有权
    用于定位具有纵横比的纳米物体的方法和装置

    公开(公告)号：US09121108B2

    公开(公告)日：2015-09-01

    申请号：US13871148

    申请日：2013-04-26

    Applicant: International Business Machines Corporation

    Inventor： Urs T Duerig ,  Felix Holzner ,  Armin W Knoll ,  Walter H Riess

    IPC: C25D13/04 ,  C25D13/02 ,  C25D13/22

    CPC classification number: C25D13/04 ,  C25D13/02 ,  C25D13/22

    Abstract: A method for positioning nano-objects on a surface and an apparatus for implementing the method. The method includes: providing a first surface and a second surface in a position facing each other, where one or more of the surfaces exhibits one or more position structures having dimensions on the nanoscale; providing an ionic liquid suspension of the nano-objects between the two surfaces, where the suspension comprises two electrical double layers each formed at an interface with a respective one of the two surfaces, and the surfaces have electrical charges of the same sign; enabling the nano-objects in the suspension to position according to a potential energy resulting from the electrical charge of the two surfaces; and depositing one or more of the nano-objects on the first surface according to the positioning structures by shifting the minima of the potential energy towards the first surface.

    Abstract translation: 一种用于将纳米物体定位在表面上的方法和用于实现该方法的装置。 该方法包括：在彼此面对的位置提供第一表面和第二表面，其中一个或多个表面呈现出具有纳米级尺寸的一个或多个位置结构; 在所述两个表面之间提供所述纳米物体的离子液体悬浮液，其中所述悬浮液包含两个双电层，每个电双层形成在与所述两个表面中的相应一个表面的界面处，并且所述表面具有相同符号的电荷; 使得悬架中的纳米物体能够根据由两个表面的电荷产生的势能来定位; 以及通过将所述势能的最小值向所述第一表面移动，根据所述定位结构将所述纳米物体中的一个或多个纳入所述第一表面。

    Tilting multiplier
    33.
    发明授权
    Tilting multiplier 有权
    倾斜乘数

    公开(公告)号：US09016464B2

    公开(公告)日：2015-04-28

    申请号：US13829446

    申请日：2013-03-14

    Applicant: SST Systems, Inc.

    Inventor： Brad Martin Andreae ,  Chad Martin Andreae

    IPC: B65G17/20 ,  B66C19/00 ,  B66C13/08 ,  C25D17/06 ,  C25D13/22 ,  B65G49/04

    CPC classification number: B65G49/0459 ,  B05B13/0221 ,  B05C3/02 ,  B05D1/02 ,  B05D1/18 ,  B65G17/20 ,  B66C13/08 ,  B66C19/00 ,  C25D5/00 ,  C25D7/00 ,  C25D13/22 ,  C25D17/06

    Abstract: A tilting carrier assembly for a finishing process includes a load bar configured to convey a work piece relative to a work station. A skid is configured to receive the work piece. Each of a pair of links is pivotally coupled to the load bar at a first end and pivotally coupled to the skid at an opposite second end. A horizontal span between the first ends of the pair of links is substantially greater than a horizontal span between the second ends of the pair of links.

    Abstract translation: 用于精加工过程的倾斜托架组件包括构造成相对于工作台传送工件的承载杆。 滑块配置为接收工件。 一对连杆中的每一个在第一端处枢转地联接到负载杆，并且在相对的第二端处枢转地联接到滑动件。 一对链节的第一端之间的水平跨度基本上大于该对链节的第二端之间的水平间距。

    CAB FRAME FOR CONSTRUCTION MACHINERY AND PAINTING METHOD THEREFOR
    34.
    发明申请
    CAB FRAME FOR CONSTRUCTION MACHINERY AND PAINTING METHOD THEREFOR 有权
    用于建筑机械的CAB框架及其绘画方法

    公开(公告)号：US20140354010A1

    公开(公告)日：2014-12-04

    申请号：US14364049

    申请日：2012-09-14

    Applicant: Nobuyuki Ohta ,  Shinjirou Ohki

    Inventor： Nobuyuki Ohta ,  Shinjirou Ohki

    IPC: E02F9/16

    CPC classification number: E02F9/163 ,  B62D21/186 ,  C25D13/12 ,  C25D13/20 ,  C25D13/22 ,  E02F9/0841

    Abstract: A cab frame includes: a main structure having an opening on a part of an outer surface thereof; a rear structure separably connected to the main structure to cover the opening while projecting from the main structure; and first and second connectors provided to the main structure and the rear structure, respectively, the first and second connectors connected to each other in an abutted manner when the main structure and the rear structure are connected to each other. When the rear structure is connected to the main structure after being turned back to front relative to the main structure, the rear structure is temporarily fixable to the main structure via the first and second connectors. When the rear structure is turned back to front and connected to the main structure, the rear structure is housed in the main structure.

    Abstract translation: 驾驶室框架包括：主结构，其外表面的一部分具有开口; 后部结构，其分离地连接到所述主结构以在从所述主结构突出的同时覆盖所述开口; 以及当主结构和后结构彼此连接时，分别设置到主结构和后结构的第一和第二连接器以相对的方式彼此连接。 当后结构相对于主结构转回到主结构后连接到主结构时，后结构经由第一和第二连接器暂时固定到主结构。 当后部结构被转回到前部并且连接到主结构时，后部结构容纳在主结构中。

    ELECTRODEPOSITABLE FILM-FORMING COMPOSITIONS CAPABLE OF FORMING STRATIFIED FILMS, AND THEIR USE IN COMPACT PROCESSES
    36.
    发明申请
    ELECTRODEPOSITABLE FILM-FORMING COMPOSITIONS CAPABLE OF FORMING STRATIFIED FILMS, AND THEIR USE IN COMPACT PROCESSES 审中-公开
    形成分层薄膜的电沉积成膜组合物及其在紧凑过程中的应用

    公开(公告)号：US20140255702A1

    公开(公告)日：2014-09-11

    申请号：US13784858

    申请日：2013-03-05

    Applicant: PPG INDUSTRIES OHIO, INC.

    Inventor： Ellor James Van Buskirk ,  Craig A. Wilson ,  Richard F. Karabin

    IPC: C09D5/44 ,  C25D13/04

    CPC classification number: C09D5/4473 ,  C09D133/00 ,  C09D163/00 ,  C25D13/22 ,  Y10T428/31529 ,  C08L33/08 ,  C08F212/08 ,  C08F220/20 ,  C08F2220/325 ,  C08F2220/1858

    Abstract: An electrodepositable film-forming composition is provided, comprising a resinous phase dispersed in an aqueous medium. The resinous phase comprises: (1) an ungelled active hydrogen-containing, cationic resin derived from a polyepoxide; (2) a cationic acrylic resin containing urethane functional groups; and (3) an at least partially blocked polyisocyanate curing agent. Also provided is a coated metal substrate comprising: A) a metal substrate having at least one coatable surface, and B) a cured coating layer deposited on at least one surface of the substrate and having a coating/air interface and a coating/substrate interface, wherein the cured coating layer is deposited from the electrodepositable film-forming composition described above. Further provided is a process for coating an electroconductive substrate, comprising electrophoretically depositing on the substrate the curable, electrodepositable coating composition described above.

    Abstract translation: 提供一种电沉积成膜组合物，其包含分散在水性介质中的树脂相。 树脂相包括：（1）衍生自聚环氧化物的未凝胶的含活性氢的阳离子树脂; （2）含有氨基甲酸酯官能团的阳离子丙烯酸树脂; 和（3）至少部分封闭的多异氰酸酯固化剂。 还提供了一种涂覆的金属基材，其包括：A）具有至少一个可涂覆表面的金属基材，和B）沉积在基材的至少一个表面上并具有涂层/空气界面和涂层/基材界面的固化涂层 其中固化涂层由上述可电沉积成膜组合物沉积。 还提供了一种用于涂覆导电基材的方法，包括在基材上电泳沉积上述可固化的可电沉积的涂料组合物。

    Electrodepositable Composition
    37.
    发明申请
    Electrodepositable Composition 审中-公开
    电沉积组合物

    公开(公告)号：US20140151233A1

    公开(公告)日：2014-06-05

    申请号：US13693575

    申请日：2012-12-04

    Applicant: E I DU PONT DE NEMOURS AND COMPANY

    Inventor： Allisa Gam

    IPC: C25D3/02

    CPC classification number: C25D13/22 ,  C09D5/4411

    Abstract: The present disclosure relates to a coating composition that can be applied to a conductive substrate via an anodic electrodeposition process, substrates coated with the coating composition and a process for applying the coating to a substrate. The electrodepositable coating composition is an aqueous dispersion comprising of an at least partially neutralized copolymer comprising α-olefin and unsaturated carboxylic acid and a curing agent. After a layer of the coating composition has been applied to the substrate, it can be heated to cure the coating and form a crosslinked network that provides a durable chip and corrosion resistant finish.

    Abstract translation: 本公开内容涉及可以通过阳极电沉积方法施加到导电基底上的涂料组合物，涂覆有涂料组合物的基材和将涂料施涂到基材上的方法。 电沉积涂料组合物是包含至少部分中和的包含α-烯烃和不饱和羧酸的共聚物和固化剂的水分散体。 在将涂层组合物层施加到基材上之后，可以加热固化涂层并形成交联网络，从而提供耐用的芯片和耐腐蚀的表面。

    METAL MEMBER AND METHOD OF MANUFACTURING SAME
    39.
    发明申请
    METAL MEMBER AND METHOD OF MANUFACTURING SAME 审中-公开
    金属构件及其制造方法

    公开(公告)号：US20140008232A1

    公开(公告)日：2014-01-09

    申请号：US14006885

    申请日：2012-03-07

    Applicant: Osamu Mizuno ,  Masatada Numano ,  Kohji Inokuchi

    Inventor： Osamu Mizuno ,  Masatada Numano ,  Kohji Inokuchi

    IPC: C25D5/02

    CPC classification number: C25D5/02 ,  C09D5/44 ,  C25D5/022 ,  C25D5/42 ,  C25D5/44 ,  C25D13/12 ,  C25D13/22 ,  C25D15/00

    Abstract: Provided is a metal member including a metal substrate and a covering layer disposed on a surface of the metal substrate, where the covering layer includes a region containing an insulating layer made of an insulating material, and a region containing an electrodeposited layer having a different texture from the insulating layer and formed by electrodeposition coating or electroplating. The metal member is manufactured by an insulating-layer-forming step of forming an insulating layer made of an insulating material on the entire surface of a region of the metal substrate in which the covering layer is to be formed, a removing step of removing a portion of the insulating layer to form an exposed portion of the metal substrate, and an electrodeposited-layer-forming step of applying a paint having a different texture from the insulating layer to the exposed portion by electrodeposition coating or electroplating to form an electrodeposited layer.

    Abstract translation: 提供一种金属构件，其包括金属基板和设置在金属基板的表面上的覆盖层，其中覆盖层包括包含由绝缘材料制成的绝缘层的区域和包含具有不同纹理的电沉积层的区域 由绝缘层形成并通过电沉积涂覆或电镀形成。 金属构件通过绝缘层形成步骤制造，该绝缘层形成步骤在要形成覆盖层的金属基底的区域的整个表面上形成由绝缘材料制成的绝缘层，去除步骤 绝缘层的一部分以形成金属基板的暴露部分，以及电沉积层形成步骤，通过电沉积涂覆或电镀将具有不同质构的涂料从绝缘层施加到暴露部分以形成电沉积层。

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