IMAGE SENSORS INTEGRATED WITH INFRARED SENSORS AND ELECTRONIC DEVICES INCLUDING THE SAME

    公开(公告)号:US20210375977A1

    公开(公告)日:2021-12-02

    申请号:US17313464

    申请日:2021-05-06

    Abstract: An image sensor includes a visible light sensor portion and an infrared sensor portion arranged on the visible light sensor portion. The visible light sensor portion includes a first sensor layer and a first signal wiring layer, wherein a plurality of visible light sensing elements are arrayed in the first sensor layer and the first signal wiring layer is configured to process a signal output from the first sensor layer. The infrared sensor portion includes a second sensor layer in which a plurality of infrared sensing elements are arrayed, and a second signal wiring layer configured to process a signal output from the second sensor layer. The infrared sensor portion and the visible light sensor portion form a single monolithic structure which is effective in obtaining high resolution.

    SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL SEMICONDUCTOR MATERIAL

    公开(公告)号:US20250126886A1

    公开(公告)日:2025-04-17

    申请号:US18917227

    申请日:2024-10-16

    Abstract: Provided is a semiconductor device including a two-dimensional (2D) material. The semiconductor device may include a first channel including a first 2D material layer, a second channel apart from the first channel in a first direction and including a second 2D material layer, a common gate electrode between the first channel and the second channel, a first electrode and a second electrode apart from each other and respectively in contact with the first channel and the second channel, and a common electrode apart from the first electrode and the second electrode in a second direction intersecting the first direction and in contact with the first channel and the second channel. One of the first channel and the second channel may be an n-type channel and the other one may be a p-type channel.

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