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    Semiconductor package and board for mounting the same
    38.
    发明授权
    Semiconductor package and board for mounting the same 有权

    公开(公告)号：US10790239B2

    公开(公告)日：2020-09-29

    申请号：US16207053

    申请日：2018-11-30

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jae Hyun Lim ,  Chul Kyu Kim ,  Kyung Moon Jung ,  Han Kim ,  Yoon Seok Seo

    IPC: H01L23/552 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

    Abstract: A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.

    Semiconductor package
    39.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US10756023B2

    公开(公告)日：2020-08-25

    申请号：US15905046

    申请日：2018-02-26

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Han Kim ,  Hyung Joon Kim

    IPC: H01L23/552 ,  H01L23/13 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L23/58 ,  H01L23/538 ,  H01L23/367

    Abstract: A semiconductor package includes a connection member and a supporting member. The connection member has first and second surfaces opposing each other and a redistribution layer. The supporting member is disposed on the first surface of the connection member, has a first through-hole and a second through-hole spaced apart from each other, and has a blocking layer disposed on at least an inner surface of the second through-hole. A semiconductor chip is disposed in the first through-hole and has connection pads connected to the redistribution layer. At least one passive component is disposed in the second through-hole and has connection terminals connected to the redistribution layer. An encapsulant encapsulates the semiconductor chip and the at least one passive component in the first and second through-holes, respectively. An electromagnetic band-gap (EBG) structure is embedded in the supporting member.

    Semiconductor package for reducing stress to redistribution via
    40.
    发明授权
    Semiconductor package for reducing stress to redistribution via 有权

    公开(公告)号：US10734342B2

    公开(公告)日：2020-08-04

    申请号：US15965590

    申请日：2018-04-27

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seok Hwan Kim ,  Han Kim ,  Kyung Ho Lee ,  Kyung Moon Jung

    IPC: H01L23/00 ,  H01L23/28 ,  H01L23/498 ,  H01L23/538 ,  H01L23/16 ,  H01L23/31

    Abstract: A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.

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