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公开(公告)号：USD1032589S1
公开(公告)日：2024-06-25
申请号：US29884367
申请日：2023-02-10
设计人： Han Kim
摘要： FIG. 1 is a front perspective view of a case for electronic device showing my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The broken lines in the figures illustrate portions of the case for electronic device that form no part of the claimed design.-
公开(公告)号：USD1031712S1
公开(公告)日：2024-06-18
申请号：US29884352
申请日：2023-02-10
设计人： Han Kim
摘要： FIG. 1 is a front perspective view of a case for electronic device showing my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The broken lines in the figures illustrate portions of the case for electronic device that form no part of the claimed design.-
公开(公告)号：US11271604B2
公开(公告)日：2022-03-08
申请号：US16688494
申请日：2019-11-19
发明人： Han Kim , Minah Koh , Hyoungshin Park , Jiseung Song
IPC分类号： H04B1/3888 , H04B5/00 , G06F1/16 , H04M1/02
摘要： A cover accessory capable of operating a light emitting device without a separate power source and an electronic device including the cover accessory are provided. A cover accessory includes a cover that is detachably combinable with an electronic device and formed to surround a rear plate and a lateral member of the electronic device. The cover includes a recess formed to correspond to the rear plate of the electronic device. The cover accessory includes a circuit board disposed in the recess such that a surface thereof faces the recess, a light source layer including a plurality of light emitting devices disposed on the surface of the circuit board, a wireless power receiving module disposed on one of the surface or an opposite surface of the circuit board, and a cover processor disposed on one of the surface or the opposite surface of the circuit board and electrically connected to the wireless power receiving module and the plurality of light emitting devices of the light source layer.
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4.发明申请公开(公告)号：US20220037276A1
公开(公告)日：2022-02-03
申请号：US17504613
申请日：2021-10-19
发明人： Yun Tae Lee , Jung Ho Shim , Han Kim
IPC分类号： H01L23/00
摘要： The present disclosure relates to a semiconductor package including a first semiconductor chip having a first surface on which first connection pads are disposed, and a second surface on which second connection pads are disposed, and including through-vias connected to the second connection pads; a connection structure disposed on the first surface and including a first redistribution layer; a first redistribution disposed on the second surface; and a second semiconductor chip disposed on the connection structure. The first connection pads are connected to a signal pattern of the first redistribution layer, and the second connection pads are connected to at least one of a power pattern and a ground pattern of the second redistribution layer.
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公开(公告)号：USD928767S1
公开(公告)日：2021-08-24
申请号：US29729138
申请日：2020-03-24
设计人： Han Kim , Hyun-Keun Son , Bum-Soo Park
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公开(公告)号：US11048304B2
公开(公告)日：2021-06-29
申请号：US16612892
申请日：2018-05-21
发明人： Nam-Hyun Kang , Han Kim , Ik-Sang Kim , Seon-Keun Park , Ji-Su Hwang
摘要： Various embodiments relating to an electronic device comprising an accessory are described. An electronic device according to one embodiment comprises: a first electronic device forming a first curved surface on at least one side and including at least one first magnet on the first curved surface; a second electronic device forming a second curved surface on at least one side and including at least one second magnet on the second curved surface; and an accessory structure including third and fourth curved surfaces facing the first and second curved surfaces, and including at least one third and fourth magnets on the third and fourth curved surfaces, wherein the accessory structure may attach and detach the at least one first and second magnets and the at least one third and fourth magnets by magnetic force, may rotate the first and second curved surfaces along the third and fourth curved surfaces, and may be bent during rotation so as to mount the first electronic device at various angles. Other various embodiments are also possible.
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公开(公告)号：US10770989B2
公开(公告)日：2020-09-08
申请号：US15584125
申请日：2017-05-02
发明人： Hyeonjin Shin , Jeongho Cho , Hyungseok Kang , Han Kim , Sangwoo Kim , Seongsu Kim , Siuk Cheon
IPC分类号： H02N1/04
摘要： Example embodiments relate to an electrode structure, a triboelectric generator including the electrode structure, and a method of manufacturing the electrode structure. The electrode structure includes a flexible layer configured to be bendable by an external force and an electrode, at least some regions thereof being embedded in the flexible layer.
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公开(公告)号：US10748833B2
公开(公告)日：2020-08-18
申请号：US16282642
申请日：2019-02-22
发明人： Seong Chan Park , Sang Hyun Kwon , Han Kim , Hye Lee Kim , Seung On Kang
IPC分类号： H01L23/373 , H01L23/00 , H01L23/522 , H01L23/367 , H01L23/31
摘要： A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.
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公开(公告)号：US10600679B2
公开(公告)日：2020-03-24
申请号：US15668121
申请日：2017-08-03
发明人： Han Kim , Mi Ja Han , Dae Hyun Park
IPC分类号： H01L21/768 , H01L21/48 , H01L21/56 , H01L21/02 , H01L23/00 , H01L23/538 , H01L21/683 , H01L23/498 , H01L23/31
摘要： A fan-out semiconductor package includes a first connection member having a through-hole, first and second semiconductor chips disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member, the first semiconductor chip, and the second semiconductor chip, and a second connection member disposed on the first connection member and on active surfaces of the first semiconductor chip and the second semiconductor chip. A redistribution layer of the second connection member is respectively connected to both the first and second connection pads through first and second conductors, and the second conductor has a height greater than that of the first conductor.
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公开(公告)号：USD1043648S1
公开(公告)日：2024-09-24
申请号：US29884354
申请日：2023-02-10
设计人： Han Kim
摘要： FIG. 1 is a front perspective view of a case for electronic device showing my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The broken lines in the figures illustrate portions of the case for electronic device that form no part of the claimed design.
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