公开(公告)号：US10748833B2

公开(公告)日：2020-08-18

申请号：US16282642

申请日：2019-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seong Chan Park ,  Sang Hyun Kwon ,  Han Kim ,  Hye Lee Kim ,  Seung On Kang

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/522 ,  H01L23/367 ,  H01L23/31

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.