公开(公告)号：US10790239B2

公开(公告)日：2020-09-29

申请号：US16207053

申请日：2018-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun Lim ,  Chul Kyu Kim ,  Kyung Moon Jung ,  Han Kim ,  Yoon Seok Seo

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.