公开(公告)号：US20200211938A1

公开(公告)日：2020-07-02

申请号：US16593300

申请日：2019-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongchan PARK ,  Sanghyun Kwon ,  Hyungkyu Kim ,  Han Kim ,  Choonkeun Lee ,  Seungon Kang

IPC: H01L23/495 ,  H01L23/433 ,  H01L23/31 ,  H01L23/498 ,  H01L23/373 ,  H01L23/367

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposite to the active surface, a heat-dissipating member, including graphite, which is disposed on the inactive surface of the semiconductor chip; an encapsulant sealing at least a portion of each of the semiconductor chip and the heat-dissipating member, and a connection structure, which includes a redistribution layer electrically connected to the connection pad, disposed on the active surface of the semiconductor chip, and at least a side surface of the heat-dissipating member is coplanar with a side surface of the semiconductor chip.

公开(公告)号：US11901269B2

公开(公告)日：2024-02-13

申请号：US17687072

申请日：2022-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongchan Park ,  Sanghyun Kwon ,  Hyungkyu Kim ,  Han Kim ,  Choonkeun Lee ,  Seungon Kang

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/433 ,  H01L23/31 ,  H01L23/498 ,  H01L23/373 ,  H01L23/367

CPC classification number: H01L23/49568 ,  H01L23/3178 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49805 ,  H01L23/49827 ,  H01L2224/02371

Abstract: A semiconductor package includes: a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface opposite to the active surface; a heat-dissipating member disposed on the inactive surface of the semiconductor chip and including graphite; an encapsulant sealing at least a portion of each of the semiconductor chip and the heat-dissipating member; a capping metal layer disposed directly between the heat-dissipating member and the encapsulant; and a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad, wherein the heat-dissipating member includes holes passing through at least a portion of the heat-dissipating member, and the holes overlap the inactive surface of the semiconductor chip.