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    Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces
    32.
    发明授权
    Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces 有权
    可拉伸的印刷电子薄片以电连接不均匀的二维和三维表面

    公开(公告)号：US09398705B2

    公开(公告)日：2016-07-19

    申请号：US14558357

    申请日：2014-12-02

    Applicant: FLEXTRONICS AP, LLC

    Inventor： Anwar Mohammed ,  Weifeng Liu ,  Murad Kurwa

    IPC: H01L21/20 ,  H05K3/46 ,  H05K3/12 ,  H05K1/02

    CPC classification number: H05K1/0283 ,  B29C65/72 ,  B29L2031/3425 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/0296 ,  H05K1/092 ,  H05K3/0058 ,  H05K3/125 ,  H05K3/20 ,  H05K2201/0133 ,  H05K2201/0323

    Abstract: A method and apparatus for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface is described. An amount of conductive material needed to form a conductor between two points on a surface of an object is determined. The determined amount of conductive material is deposited on a substrate. The substrate with the deposited conductive material is applied to the object to form a conductor between the two points on the surface of the object. The conductive material and substrate may be stretchable. The conductive material may be deposited by an inkjet printer or an embedded 3-D printer. The substrate with the deposited conductive material may be applied to the object by laminating the substrate with the deposited conductive material to the object.

    Abstract translation: 描述了在不均匀的二维（2-D）或三维（3-D）表面上形成导体的方法和装置。 确定在物体表面上的两个点之间形成导体所需的导电材料的量。 将确定量的导电材料沉积在基底上。 将具有沉积的导电材料的基板施加到物体上以在物体的表面上的两个点之间形成导体。 导电材料和基底可以是可拉伸的。 导电材料可以由喷墨打印机或嵌入式三维打印机进行沉积。 具有沉积的导电材料的衬底可以通过将衬底与沉积的导电材料层压到物体上而被施加到物体。

    Method of making RFID devices on fabrics by stitching metal wires
    34.
    发明授权
    Method of making RFID devices on fabrics by stitching metal wires 有权
    通过拼接金属线在织物上制作RFID​​设备的方法

    公开(公告)号：US09336476B1

    公开(公告)日：2016-05-10

    申请号：US14483002

    申请日：2014-09-10

    Applicant: Flextronics AP, LLC

    Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng ,  Murad Kurwa

    IPC: G06K19/077

    CPC classification number: G06K19/07754 ,  G06K19/027

    Abstract: An RFID device assembly is fabricated by stitching an electrically conductive wire into a fabric as a pattern that forms an antenna. The two ends of the electrically conductive wire are positioned for coupling to antenna contact pads on an RFID device. The RFID device is attached to the fabric either before or after the electrically conductive wire is stitched to the fabric.

    Abstract translation: 通过将导电线缝合成织物作为形成天线的图案来制造RFID器件组件。 导电线的两端被定位成耦合到RFID设备上的天线接触焊盘。 在将导电线缝合到织物之前或之后，将RFID装置附接到织物上。

    Printed RFID circuit
    35.
    发明授权
    Printed RFID circuit 有权
    打印RFID电路

    公开(公告)号：US09053405B1

    公开(公告)日：2015-06-09

    申请号：US14162483

    申请日：2014-01-23

    Applicant: Flextronics AP, LLC

    Inventor： Weifeng Liu ,  Anwar Mohammed ,  Murad Kurwa

    IPC: G06K19/07 ,  G06K19/077 ,  H01M6/40

    CPC classification number: H05K3/244 ,  G06K19/07754 ,  H01L23/5386 ,  H01L24/65 ,  H01L25/00 ,  H01L2924/38 ,  H01M6/40 ,  H04B1/3816 ,  H05K1/097 ,  H05K1/111 ,  H05K3/30 ,  H05K3/40

    Abstract: A printed circuit including a non-conductive substrate, a first conductive layer printed on the non-conductive substrate and one or more additional layers printed on the substrate. The first conductive layer is able to have one or more antennas each forming a predetermined pattern, a first conductive sheet and one or more conductive traces. The one or more additional layers include a first electrode printed on the top of the first conductive sheet, a buffer printed on top of the first electrode, a second electrode printed on top of the buffer and a second conductive sheet printed on top of the second electrode. The printed circuit is further able to include an RFID chip electrically coupled with the antennas and at least one of the first and second conductive sheets via the conductive traces, wherein the first and second conductive sheets, the buffer and the first and second electrodes form a power source that provides electrical power to the RFID chip.

    Abstract translation: 一种印刷电路，包括非导电衬底，印刷在非导电衬底上的第一导电层和印刷在衬底上的一个或多个附加层。 第一导电层能够具有各自形成预定图案的一个或多个天线，第一导电片和一个或多个导电迹线。 所述一个或多个附加层包括印刷在第一导电片的顶部上的第一电极，印刷在第一电极顶部上的缓冲器，印刷在缓冲器顶部的第二电极和印刷在第二导电片的第二个顶部上的第二导电片 电极。 印刷电路还能够包括通过导电迹线与天线以及第一和第二导电片中的至少一个电耦合的RFID芯片，其中第一和第二导电片，缓冲器和第一和第二电极形成 向RFID芯片提供电力的电源。

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