Abstract:
A method of calculating a thickness of a layer may include forming the layer on a substrate in a chamber, measuring optical emission spectrum data from the chamber, and calculating the thickness of the layer from the optical emission spectrum data. A method of forming a layer may include depositing the layer on a substrate in a chamber, measuring optical emission spectrum data from the chamber, calculating a thickness of the layer using the optical emission spectrum data, and ending the depositing of the layer when the calculated thickness of the layer is within a target thickness range.
Abstract:
The present invention relates to a method for manufacturing a gallium nitride single crystalline substrate, including (a) growing a gallium nitride film on a flat base substrate made of a material having a smaller coefficient of thermal expansion than gallium nitride and cooling the gallium nitride film to bend convex upwards the base substrate and the gallium nitride film and create cracks in the gallium nitride film; (b) growing a gallium nitride single crystalline layer on the crack-created gallium nitride film located on the convex upward base substrate; and (c) cooling a resultant product having the grown gallium nitride single crystalline layer to make the convex upward resultant product flat or bend convex downwards the convex upward resultant product and at the same time to self-split the base substrate and the gallium nitride single crystalline layer from each other at the crack-created gallium nitride film interposed therebetween.
Abstract:
A method and device for receiving a digital multimedia broadcasting (DMB) signal in a wireless terminal where an external antenna is detachable from the wireless terminal, an internal antenna is embedded in the wireless terminal, a switch connects one of the external antenna and the internal antenna to a DMB receiver. The DMB receiver receives a DMB signal through one of the external antenna and the internal antenna. A controller controls the switch to connect the internal antenna and transmit the DMB signal to the DMB receiver when the external antenna is detached from the wireless terminal and controls the switch to connect the external antenna to the DMB receiver and transmit the DMB signal to the DMB receiver, when the external antenna is attached to the wireless terminal.
Abstract:
A gray-scale representation method for a plasma display panel, which method includes arranging, in time sequence, a plurality of subfields each having a brightness weight and achieving gray-scale representation by a combination of the subfields, each subfield including an address period and a sustain period. In the gray-scale representation method, the number of sustain pulses for each subfield is determined so that a light generated from the difference of the number of sustain pulses between two adjacent gray scales can be greater than a light discharged in the address period, when the number of subfields for the higher one of the two adjacent gray scales is less than that for the lower one. The reversion of gray scales that occurs when the address light is increased as high as the sustain light can be eliminated to achieve correct gray-scale representation. A smoother gray-scale representation can be achieved with reduced power consumption by adjusting the difference of the number of sustain pulses between the two adjacent gray scales in consideration of the address light.
Abstract:
An etching end point of a plasma etch is determined by defining an etch-stop condition. A layer formed on a substrate is etched using a plasma. A luminous intensity of the plasma is measured to determine a first luminous intensity. The luminous intensity is measured again after a predetermined time to determine a second luminous intensity. A determination is made whether a disturbance occurs. Compensation is applied to the measured luminous intensity if the disturbance occurs. A determination is made whether the measured luminous intensity or the compensated luminous intensity satisfies the etch stop condition.
Abstract:
A compound semiconductor device and method of manufacturing the same. The method includes coating a plurality of spherical balls on a substrate and selectively growing a compound semiconductor thin film on the substrate on which the spherical balls are coated. The entire process can be simplified and a high-quality compound semiconductor thin film can be grown in a short amount of time in comparison to an epitaxial lateral overgrowth (ELO) method.
Abstract:
A planar antenna manufactured by patterning a substrate consisting of a dielectric layer, and first and second conductive layers applied, respectively, to both opposite surfaces of the dielectric layer. A first slot is formed in the first conductive layer for radiating electric waves. A second slot is formed in the first conductive layer for intercepting a particular frequency of the electric waves radiated by the first slot. A power supply portion is formed with the first conductive layer for supplying electric current to the first slot. A radiating element formed with the second conductive layer, which is excited by the electric waves radiated by the first slot, and radiates the electric waves.
Abstract:
A loop antenna for a mobile terminal capable of reducing SAR. The loop antenna has three lines. The first line generates and transmits predetermined electric waves upon receiving current from an oscillator for oscillating power and has a connection point to connect an external line thereto. The second line includes a first end connected to a printed circuit board to ground current supplied to the first line and a second end having an opened structure. The third line has a first end connected to one side of the first line through the connection point and a second end connected to one side of the second line coupled to the printed circuit board in order to receive current from the first line through the connection point and transmit current into the second line.
Abstract:
An etching end point of a plasma etch is determined by defining an etch-stop condition. A layer formed on a substrate is etched using a plasma. A luminous intensity of the plasma is measured to determine a first luminous intensity. The luminous intensity is measured again after a predetermined time to determine a second luminous intensity. A determination is made whether a disturbance occurs. Compensation is applied to the measured luminous intensity if the disturbance occurs. A determination is made whether the measured luminous intensity or the compensated luminous intensity satisfies the etch stop condition.
Abstract:
The present invention provides a susceptor power-interface assembly which is used for a chamber process module that includes a power supply, a process chamber and a susceptor, wherein the susceptor includes a susceptor shaft penetrating a bottom of the process chamber and a susceptor base on which a wafer is disposed for the process. The susceptor power-interface assembly electrically connects the power supply to the susceptor base. For the electrical-connection between the power supply to the suceptor base, the susceptor power-interface assembly includes a first flange at the end of the susceptor shaft, the first flange bent outside from the susceptor shaft; a second flange having a circular shape, the second flange coupled with the first flange using screws; a plurality of connectors penetrating the second flange, wherein one part of each connector is disposed on the inner surface of the second flange and electrically connected to the susceptor base, wherein the other part of each connector is disposed on the outer surface of the second flange; and a plurality of power boots each having a hole so as to cap each connector disposed on the outer surface of the second flange, wherein each connector slide into the hole of each power boot to be coupled with the power boot. The susceptor power-interface assembly further includes an O-ring packing that is interposed between the first and second flanges and made of Teflon.