METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE
    2.
    发明申请
    METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE 有权
    制造氮化物半导体器件的方法

    公开(公告)号:US20110129953A1

    公开(公告)日:2011-06-02

    申请号:US12955222

    申请日:2010-11-29

    Abstract: A method of manufacturing a nitride semiconductor device is disclosed. The method includes forming a gallium nitride (GaN) epitaxial layer on a first support substrate, forming a second support substrate on the GaN epitaxial layer, forming a passivation layer on a surface of the other region except for the first support substrate, etching the first support substrate by using the passivation layer as a mask, and removing the passivation layer and thereby exposing the second support substrate and the GaN epitaxial layer.

    Abstract translation: 公开了一种制造氮化物半导体器件的方法。 该方法包括在第一支撑衬底上形成氮化镓(GaN)外延层,在GaN外延层上形成第二支撑衬底,在除第一支撑衬底之外的另一个区域的表面上形成钝化层,蚀刻第一衬底 通过使用钝化层作为掩模来支撑衬底,以及去除钝化层,从而暴露第二支撑衬底和GaN外延层。

    Nitride semiconductor substrate having a base substrate with parallel trenches
    3.
    发明授权
    Nitride semiconductor substrate having a base substrate with parallel trenches 有权
    氮化物半导体衬底具有平行沟槽的基底衬底

    公开(公告)号:US07915698B2

    公开(公告)日:2011-03-29

    申请号:US12002338

    申请日:2007-12-14

    Abstract: The present invention relates to a nitride semiconductor substrate such as gallium nitride substrate and a method for manufacturing the same. The present invention forms a plurality of trenches on a lower surface of a base substrate that are configured to absorb or reduce stresses on the base substrate that become larger from a central portion of the base substrate towards a peripheral portion when growing a nitride semiconductor film. That is, the present invention forms the trenches on the lower surface of the base substrate such that pitches get smaller or widths or depths get larger from the central portion of the base substrate towards the peripheral portion.

    Abstract translation: 氮化镓半导体衬底及其制造方法技术领域本发明涉及氮化镓衬底等氮化物半导体衬底及其制造方法。 本发明在基底基板的下表面上形成多个沟槽,其构造成在生长氮化物半导体膜时吸收或减小从基底基板的中心部分朝向周边部分变大的基底基板上的应力。 也就是说,本发明在基底基板的下表面上形成沟槽,使得间距变得较小,或者宽度或深度从基底基板的中心部朝向周边部分变大。

    METHOD FOR PREPARING SUBSTRATE FOR GROWING GALLIUM NITRIDE AND METHOD FOR PREPARING GALLIUM NITRIDE SUBSTRATE
    4.
    发明申请
    METHOD FOR PREPARING SUBSTRATE FOR GROWING GALLIUM NITRIDE AND METHOD FOR PREPARING GALLIUM NITRIDE SUBSTRATE 有权
    用于制备用于生长氮化镓的衬底的方法和用于制备氮化镓衬底的方法

    公开(公告)号:US20090068822A1

    公开(公告)日:2009-03-12

    申请号:US12177490

    申请日:2008-07-22

    CPC classification number: C30B29/406 C30B25/02 C30B25/18

    Abstract: Provided is a method for preparing a substrate for growing gallium nitride and a gallium nitride substrate. The method includes performing thermal cleaning on a surface of a silicon substrate, forming a silicon nitride (Si3N4) micro-mask on the surface of the silicon substrate in an in situ manner, and growing a gallium nitride layer through epitaxial lateral overgrowth (ELO) using an opening in the micro-mask. According to the method, by improving the typical ELO, it is possible to simplify the method for preparing the substrate for growing gallium nitride and the gallium nitride substrate and reduce process cost.

    Abstract translation: 提供一种制备用于生长氮化镓和氮化镓衬底的衬底的方法。 该方法包括在硅衬底的表面上进行热清洗,以原位方式在硅衬底的表面上形成氮化硅(Si 3 N 4)微掩模,并通过外延横向过度生长(ELO)生长氮化镓层, 在微面罩中使用开口。 根据该方法,通过改善典型的ELO,可以简化制备用于生长氮化镓和氮化镓衬底的衬底的方法,并降低工艺成本。

    Nitride semiconductor substrate and manufacturing method thereof
    5.
    发明申请
    Nitride semiconductor substrate and manufacturing method thereof 有权
    氮化物半导体衬底及其制造方法

    公开(公告)号:US20080142846A1

    公开(公告)日:2008-06-19

    申请号:US12002338

    申请日:2007-12-14

    Abstract: The present invention relates to a nitride semiconductor substrate such as gallium nitride substrate and a method for manufacturing the same. The present invention forms a plurality of trenches on a lower surface of a base substrate that are configured to absorb or reduce stresses applied larger when growing a nitride semiconductor film on the base substrate from a central portion of the base substrate towards a peripheral portion. That is, the present invention forms the trenches on the lower surface of the base substrate such that pitches get smaller or widths or depths get larger from the central portion of the base substrate towards the peripheral portion.

    Abstract translation: 氮化镓半导体衬底及其制造方法技术领域本发明涉及氮化镓衬底等氮化物半导体衬底及其制造方法。 本发明在基底基板的下表面上形成多个沟槽,该多个沟槽被配置为当从基底基板的中心部分向周边部分生长氮化物半导体膜时,吸收或减小施加更大的应力。 也就是说,本发明在基底基板的下表面上形成沟槽,使得间距变得较小,或者宽度或深度从基底基板的中心部朝向周边部分变大。

    Compound semiconductor substrate grown on metal layer, method for manufacturing the same, and compound semiconductor device using the same
    6.
    发明申请
    Compound semiconductor substrate grown on metal layer, method for manufacturing the same, and compound semiconductor device using the same 有权
    在金属层上生长的化合物半导体衬底,其制造方法以及使用其的化合物半导体器件

    公开(公告)号:US20080105881A1

    公开(公告)日:2008-05-08

    申请号:US11982716

    申请日:2007-11-02

    Abstract: The present invention relates to a compound semiconductor substrate and a method for manufacturing the same. The present invention provides the manufacturing method which coats spherical balls on a substrate, forms a metal layer between the spherical balls, removes the spherical balls to form openings, and grows a compound semiconductor layer from the openings. According to the present invention, the manufacturing method can be simplified and grow a high quality compound semiconductor layer rapidly, simply and inexpensively, as compared with a conventional ELO (Epitaxial Lateral Overgrowth) method or a method for forming a compound semiconductor layer on a metal layer. And, the metal layer serves as one electrode of a light emitting device and a light reflecting film to provide a light emitting device having reduced power consumption and high light emitting efficiency.

    Abstract translation: 化合物半导体基板及其制造方法技术领域本发明涉及化合物半导体基板及其制造方法。 本发明提供一种制造方法,其在基板上涂布球形球,在球形球之间形成金属层,去除球形球以形成开口,并从开口生长化合物半导体层。 根据本发明,与传统的ELO(外延横向生长)方法或在金属上形成化合物半导体层的方法相比,可以简化和简单且廉价地生产高质量的化合物半导体层 层。 并且,金属层用作发光器件和光反射膜的一个电极,以提供具有降低的功率消耗和高发光效率的发光器件。

    WINDMILL-SHAPED LOOP ANTENNA HAVING PARASITIC LOOP ANTENNA
    7.
    发明申请
    WINDMILL-SHAPED LOOP ANTENNA HAVING PARASITIC LOOP ANTENNA 失效
    具有PARASITIC LOOP ANTENNA的WINDMILL型环路天线

    公开(公告)号:US20070241986A1

    公开(公告)日:2007-10-18

    申请号:US11735169

    申请日:2007-04-13

    CPC classification number: H01Q1/38 H01Q7/00

    Abstract: There is provided a windmill-shaped loop antenna including: a dielectric substrate; a first radiation unit disposed on a top surface of the dielectric substrate and including a metal pattern having loop pieces; a second radiation unit disposed at a bottom surface of the dielectric substrate and including a metal pattern having loop pieces arranged not to face the loop pieces of the first radiation unit; and a plurality of identical transmission line from a center of the top and bottom surfaces of the dielectric substrate to the first and second radiation units, which form windmill-shaped metal pattern with the first and second radiation unit.

    Abstract translation: 提供了一种风车形环形天线,包括:电介质基板; 第一辐射单元,设置在电介质基板的顶表面上并且包括具有环形件的金属图案; 第二辐射单元,设置在所述电介质基板的底表面处,并且包括金属图案,所述金属图案具有被布置成不面对所述第一辐射单元的环形片的环片; 以及从电介质基板的顶表面和底表面的中心到第一和第二辐射单元的多条相同的传输线,其与第一和第二辐射单元形成风车形金属图案。

    SEMICONDUCTOR DEVICE, LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    9.
    发明申请
    SEMICONDUCTOR DEVICE, LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体器件,发光器件及其制造方法

    公开(公告)号:US20110272703A1

    公开(公告)日:2011-11-10

    申请号:US13145790

    申请日:2009-12-09

    CPC classification number: H01L33/007 H01L33/0075 H01L33/10 H01L33/22

    Abstract: Disclosed are a semiconductor device, a light emitting device and a method for manufacturing the same. The semiconductor device includes a substrate, a plurality of rods disposed on the substrate, a plurality of particles disposed between the rods and on the substrate, and a first semiconductor layer disposed on the rods. The method for manufacturing the semiconductor device includes preparing a substrate, disposing a plurality of first particles on the substrate, and forming a plurality of rods by etching a portion of the substrate by using the first particles as an etch mask. The semiconductor device effectively reflects in an upward direction light by the above particles, so that light efficiency is improved. The rods are easily formed by using the first particles.

    Abstract translation: 公开了一种半导体器件,发光器件及其制造方法。 半导体器件包括衬底,设置在衬底上的多个棒,设置在杆之间和衬底上的多个颗粒以及设置在杆上的第一半导体层。 半导体器件的制造方法包括:准备基板,在基板上配置多个第一粒子,通过使用第一粒子作为蚀刻掩模,蚀刻基板的一部分来形成多个棒。 半导体器件通过上述粒子有效地向上方向反射光,从而提高光效率。 通过使用第一颗粒容易地形成棒。

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