公开(公告)号：US20210220826A1

公开(公告)日：2021-07-22

申请号：US16763838

申请日：2019-12-06

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiaoxin Song ,  Feng Zhang ,  Wenqu Liu ,  Zhijun Lv ,  Zhao Cui ,  Qi Yao

IPC: B01L3/00

Abstract: The present disclosure provides an electrode plate, a microfluidic chip, and a method of manufacturing the electrode plate. In one embodiment, an electrode plate includes: a substrate, an electrode and a surface contact layer stacked in sequence, and a droplet inlet hole passing through the substrate, the electrode and the surface contact layer. The surface contact layer comprises a super-hydrophobic region and a hydrophilic region, and the droplet inlet hole is disposed in the hydrophilic region. The microfluidic chip includes: a first electrode plate formed by the abovementioned electrode plate, and a second electrode plate provided on a side of the first electrode plate close to the surface contact layer. The first electrode plate is provided opposite to the second electrode plate and a liquid channel is formed between the first electrode plate and the second electrode plate.

公开(公告)号：US20210089739A1

公开(公告)日：2021-03-25

申请号：US16826196

申请日：2020-03-21

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wenqu LIU ,  Qi Yao ,  Feng Zhang ,  Zhijun Lv ,  Liwen Dong ,  Xiaoxin Song ,  Zhao Cui ,  Detian Meng ,  Libo Wang ,  Mingqi Chen ,  Changzheng Wang

IPC: G06K9/00 ,  H01L41/08 ,  H01L41/193 ,  H01L41/257 ,  H01L41/29 ,  H01L41/331 ,  H01L41/45 ,  B06B1/06

Abstract: Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.

公开(公告)号：US20200083481A1

公开(公告)日：2020-03-12

申请号：US16429531

申请日：2019-06-03

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wenqu Liu ,  Feng Zhang ,  Qi Yao ,  Zhijun Lv ,  Liwen Dong ,  Shizheng Zhang ,  Ning Dang ,  Xiaoxin Song ,  Zhao Cui

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56 ,  H01L27/32

Abstract: A display substrate, a manufacturing method thereof, and a display device are provided, in the field of display technology. The display substrate includes a base substrate, and a thin-film transistor, a light-emitting device, an encapsulation structure, and a conductive film layer sequentially disposed on the base substrate in a direction away from the base substrate. Since the display substrate includes a conductive film layer on a side of the encapsulation structure away from the base substrate, when the protective film layer on the side of the conductive film layer away from the base substrate is peeled off, static electricity generated by the separation of the film layer can be released to the conductive film layer, avoiding electron transition to the active layer of the thin-film transistor in the display substrate to cause offset of the threshold voltage of the thin-film transistor. The display brightness uniformity of the display substrate can be ensured.