公开(公告)号：US10095287B2

公开(公告)日：2018-10-09

申请号：US14815278

申请日：2015-07-31

Applicant: Apple Inc.

Inventor： Scott A. Myers ,  Ihtesham H. Chowdhury ,  Richard Hung Minh Dinh ,  Benjamin J. Pope ,  Matthew D. Hill ,  Dhaval N. Shah ,  Martin J. Auclair

IPC: H04M1/00 ,  G06F1/20 ,  H04M1/02 ,  H04M1/725 ,  G06F1/16 ,  G06F1/18

Abstract: An electronic device is configured to detect the presence or absence of a case that is positioned over at least one surface of the electronic device. When a case is present, the electronic device is configured to determine one or more characteristics of the case and adjust one or more operations of the electronic device based on at least one characteristic of the case.

公开(公告)号：US20180069060A1

公开(公告)日：2018-03-08

申请号：US15812884

申请日：2017-11-14

Applicant: Apple Inc.

Inventor： Benjamin M. Rappoport ,  Jeremy C. Franklin ,  Fletcher R. Rothkopf ,  Scott A. Myers ,  Richard P. Howarth ,  Julian Hoenig ,  Christopher J. Stringer ,  John P. Ternus ,  Stephen Brian Lynch

IPC: H01L27/32 ,  G02B27/01 ,  G06F1/16 ,  H01L51/00 ,  G02B5/20 ,  G06F3/042 ,  G06F3/044

CPC classification number: H01L27/3227 ,  G02B5/208 ,  G02B27/01 ,  G02B2027/0138 ,  G02B2027/014 ,  G06F1/1626 ,  G06F1/1637 ,  G06F1/1641 ,  G06F1/1686 ,  G06F1/1688 ,  G06F1/169 ,  G06F1/1698 ,  G06F3/011 ,  G06F3/042 ,  G06F3/044 ,  G06F2203/04101 ,  G06F2203/04108 ,  G09G3/3208 ,  G09G2320/0626 ,  G09G2360/144 ,  H01L27/323 ,  H01L51/0097 ,  H04R1/028 ,  H04R2499/15

Abstract: An electronic device may have a display. The display may have an active region in which display pixels are used to display images. The display may have one or more openings and may be mounted in a housing associated with the electronic device. An electronic component may be mounted in alignment with the openings in the display. The electronic component may include a camera, a light sensor, a light-based proximity sensor, status indicator lights, a light-based touch sensor array, a secondary display that has display pixels that may be viewed through the openings, antenna structures, a speaker, a microphone, or other acoustic, electromagnetic, or light-based component. One or more openings in the display may form a window through which a user of the device may view an external object. Display pixels in the window region may be used in forming a heads-up display.

公开(公告)号：US20180052540A1

公开(公告)日：2018-02-22

申请号：US15783272

申请日：2017-10-13

Applicant: Apple Inc.

Inventor： Scott A. Myers ,  Stephen Brian Lynch ,  Anthony S. Montevirgen

IPC: G06F3/041 ,  G06F3/044 ,  G06F3/0481 ,  G06F3/0488 ,  H04M1/02 ,  G06F1/16 ,  H04M1/23

CPC classification number: G06F3/041 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/044 ,  G06F3/04817 ,  G06F3/0488 ,  G06F3/04886 ,  G06F2203/04102 ,  G06F2203/04112 ,  H04M1/0268 ,  H04M1/0283 ,  H04M1/236 ,  H04M2250/16 ,  H04M2250/22

Abstract: Electronic devices may be provided that contain flexible displays that are bent to form displays on multiple surfaces of the devices. Bent flexible displays may be bent to form front side displays and edge displays. Edge displays may be separated from front side displays or from other edge displays using patterned housing members, printed or painted masks, or by selectively activating and inactivating display pixels associated with the flexible display. Edge displays may alternately function as virtual buttons, virtual switches, or informational displays that are supplemental to front side displays. Virtual buttons may include transparent button members, lenses, haptic feedback components, audio feedback components, or other components for providing feedback to a user when virtual buttons are activated.

公开(公告)号：US20180047334A1

公开(公告)日：2018-02-15

申请号：US15796675

申请日：2017-10-27

Applicant: Apple Inc.

Inventor： Derek Wright ,  Fletcher R. Rothkopf ,  Scott A. Myers

IPC: H05K1/11 ,  H01L27/32 ,  H01L51/52

CPC classification number: G09G3/3208 ,  G09G2300/0426 ,  H01L27/3276 ,  H01L51/52 ,  H05K1/115

Abstract: An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer by laser drilling. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. Components such as flexible printed circuits, integrated circuits, connectors, and other circuitry may be mounted to the contacts on the rear surface of the display.

公开(公告)号：US09871897B1

公开(公告)日：2018-01-16

申请号：US14480115

申请日：2014-09-08

Applicant: Apple Inc.

Inventor： Benjamin B. Lyon ,  Patrick E. O'Brien ,  Scott A. Myers

IPC: H01L21/00 ,  H04M1/02 ,  G06F1/16 ,  B32B38/00 ,  B32B37/24 ,  B32B37/12

CPC classification number: H04M1/0202 ,  B32B37/1207 ,  B32B37/24 ,  B32B38/0012 ,  B32B2037/246 ,  B32B2307/20 ,  B32B2457/16 ,  G06F1/1626 ,  G06F1/1684

Abstract: Apparatuses and methods for creating a sensor stack or element for use in an electronic device. In one example, a method may include providing a substrate made of sapphire; affixing, by physical vapor deposition, a decorative feature on the substrate; providing a silicon layer including a capacitive sensor; and bonding the sensor to the substrate. In one example, the affixing operation may include an icon, logo, symbol or other graphic as the decorative feature. The method may also include reducing the substrate or silicon layer from an initial thickness to a second thickness, the second thickness being thinner that the initiation thickness. The sensor stack may be used or configured as an input button for the electronic device such as a mobile phone, tablet computer, or other computing device.

公开(公告)号：US09853671B2

公开(公告)日：2017-12-26

申请号：US14618568

申请日：2015-02-10

Applicant: Apple Inc.

Inventor： Scott A. Myers ,  Erik L. Wang ,  Jason S. Sloey

IPC: H04B1/3818 ,  H04M1/02 ,  G06K13/08 ,  H04B1/3816 ,  H05K5/02

CPC classification number: H04B1/3818 ,  G06K13/08 ,  G06K13/0831 ,  H04B1/3816 ,  H04M1/0235 ,  H04M1/026 ,  H04M1/0274 ,  H04M1/0283 ,  H04M2250/14 ,  H05K5/0295

Abstract: Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.

公开(公告)号：US20170279943A1

公开(公告)日：2017-09-28

申请号：US15449797

申请日：2017-03-03

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Derek C. Krass ,  Benjamin Shane Bustle ,  Lucy Elizabeth Browning ,  Michael Benjamin Wittenberg ,  James B. Smith ,  Ashutosh Y. Shukla ,  Scott A. Myers

IPC: H04M1/02

CPC classification number: H04M1/0249

Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

公开(公告)号：US09674986B2

公开(公告)日：2017-06-06

申请号：US14816122

申请日：2015-08-03

Applicant: Apple Inc.

Inventor： Benjamin J. Pope ,  Scott A. Myers ,  Ihtesham H. Chowdhury

IPC: H05K7/20 ,  H01L23/34 ,  H01L23/473

CPC classification number: H05K7/205 ,  H01L23/34 ,  H01L23/373 ,  H01L23/3735

Abstract: A heat spreader including multiple layers of anisotropic material to conduct thermal energy. Multiple graphite sheet layers may be laminated and each sheet may be thermally connected to one or more thermal energy sources in a portable electronic device. Methods for making a heat spreader are also disclosed.

公开(公告)号：US20170139532A1

公开(公告)日：2017-05-18

申请号：US15419730

申请日：2017-01-30

Applicant: Apple Inc.

Inventor： Jeremy C. Franklin ,  Scott A. Myers ,  Benjamin M. Rappoport ,  Stephen Brian Lynch ,  John P. Ternus ,  Justin R. Wodrich

IPC: G06F3/041 ,  H01L51/00 ,  H01L27/32 ,  G06F3/044 ,  G06F1/16

CPC classification number: G06F3/0416 ,  G06F1/1626 ,  G06F1/163 ,  G06F1/1652 ,  G06F1/1677 ,  G06F1/3265 ,  G06F3/0412 ,  G06F3/044 ,  G06F2203/04101 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04105 ,  G09G3/20 ,  G09G3/2092 ,  G09G3/3208 ,  G09G2330/027 ,  G09G2380/02 ,  H01L27/323 ,  H01L51/0097 ,  H01L2251/5338 ,  H01M2/1022 ,  H01M2/16 ,  H01M2/18 ,  H01M10/0436 ,  H01M2002/0205 ,  H01M2220/30 ,  H04M1/0216 ,  H04M1/0262 ,  H04M1/0268

Abstract: Flexible electronic devices may be provided. A flexible electronic device may include a flexible display, a flexible housing and one or more flexible internal components configured to allow the flexible electronic device to be deformed. Flexible displays may include flexible display layers, flexible touch-sensitive layers, and flexible display cover layers. The flexible housing may be a multi-stable flexible housing having one or more stable positions. The flexible housing may include a configurable support structure that, when engaged, provides a rigid support structure for the flexible housing. The flexible internal components may include flexible batteries, flexible printed circuits or other flexible components. A flexible battery may include flexible and rigid portions or may include a lubricious separator layer that provides flexibility for the flexible battery. A flexible printed circuit may include flexible and rigid portions or openings that allow some rigid portions to flex with respect to other rigid portions.

公开(公告)号：US09583445B2

公开(公告)日：2017-02-28

申请号：US14218384

申请日：2014-03-18

Applicant: Apple Inc.

Inventor： Richard H. Dinh ,  Ashutosh Y. Shukla ,  Scott A. Myers

IPC: H01L23/552 ,  H01L27/146 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H01L23/13 ,  H01L23/15 ,  H01L23/00 ,  H05K3/00 ,  H05K3/36

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L27/14618 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/81801 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K1/0218 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/363 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09145 ,  H05K2201/09354 ,  H05K2201/09509 ,  H05K2201/09618 ,  H05K2201/10378 ,  H05K2201/2018 ,  H01L2924/014 ,  H01L2924/00

Abstract: An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The electrical component may be soldered to the contacts on the upper surface. The contacts on the lower surface may be used to solder the substrate to a printed circuit. During manufacturing, it may be desirable to use metal traces on a ceramic panel to make connections to contacts on the substrate. Following singulation of the ceramic panel to form the ceramic substrate, some of the metal traces may run to the edge of the ceramic substrate. A folded tab of the printed circuit may form a shield that covers these exposed traces. A divided metal-coated groove or a row of divided metal-coated vias running along each edge of the substrate may also provide shielding.

Abstract translation: 电气部件可以安装在诸如陶瓷基板的基板上。 可以在基板的上表面和下表面上形成接触。 电气部件可以焊接到上表面上的触点。 下表面上的触点可用于将基板焊接到印刷电路。 在制造过程中，可能需要在陶瓷板上使用金属迹线来连接到基板上的触点。 在陶瓷面板分层以形成陶瓷衬底之后，一些金属迹线可以流到陶瓷衬底的边缘。 印刷电路的折叠片可以形成覆盖这些暴露痕迹的屏蔽。 沿着衬底的每个边缘延伸的划分的金属涂覆的凹槽或一排划分的金属涂覆的通孔也可以提供屏蔽。