公开(公告)号：US20080023669A1

公开(公告)日：2008-01-31

申请号：US11629948

申请日：2005-06-15

申请人： Toru Imori ,  Jun Suzuki ,  Kazunori Iida

发明人： Toru Imori ,  Jun Suzuki ,  Kazunori Iida

IPC分类号： C09K3/00 ,  C08K3/08

CPC分类号： D07B1/0666 ,  C08K5/16 ,  C09D4/00 ,  C09D7/63 ,  C09D183/08 ,  C23C2222/20 ,  C08G77/26

摘要： A surface treatment agent for metal is provided which is capable of improving the strength of adhesion between metal and rubber. A metal surface treatment agent for promoting adhesion between the metal and rubber comprising a cobalt or other metal compound and a silane coupling agent having a metal-capturing functional group in the molecule, and a metal surface treatment agent for promoting adhesion between the metal and rubber comprising a silane coupling agent having in the molecule a metal-capturing functional group with a captured metal such as a cobalt. The metal-capturing functional group is preferably an amino, amide or azole group.

摘要翻译： 提供了一种能够提高金属与橡胶之间的粘合强度的金属表面处理剂。 一种金属表面处理剂，用于促进包含钴或其它金属化合物的金属和橡胶之间的粘合性和在分子中具有金属捕获官能团的硅烷偶联剂，以及金属表面处理剂，用于促进金属和橡胶之间的粘合 包括在分子中具有捕获金属如钴的金属捕获官能团的硅烷偶联剂。 金属捕获官能团优选为氨基，酰胺或唑基。

公开(公告)号：US20060135584A1

公开(公告)日：2006-06-22

申请号：US10515708

申请日：2003-07-16

申请人： Toru Imori ,  Atsushi Yabe ,  Junnosuke Sekiguchi

发明人： Toru Imori ,  Atsushi Yabe ,  Junnosuke Sekiguchi

IPC分类号： C07D233/54 ,  A61K31/4164

CPC分类号： C23F11/149 ,  C07D231/12 ,  C07D233/54 ,  C07D233/56 ,  C07D249/08 ,  Y10T428/31678

摘要： It is an object of the present invention to provide a novel imidazole alcohol compound that adheres strongly to metal surfaces in metal products, especially copper, aluminum and steel products, and that has a superior rust-preventive effect even in a thin film, and a surface-treating agent using the same. The novel imidazole alcohol compound is expressed by the following general formula (1) show a rust-preventive effect. (In general formula (1), R1, R2 and R3 are each hydrogen, a vinyl group or an alkyl group with 1 to 20 carbon atoms, an aromatic ring may be formed by R2 and R3, X indicates hydrogen, an alkyl group with 1 to 6 carbon atoms, or a substituent group which may contain N or O, m indicates an integer from 0 to 20, and n and 1 indicate integers from 1 to 3.) The above-mentioned imidazole alcohol compound can be produced by reacting an imidazole compound and an epoxy alcohol compound.

摘要翻译： 本发明的目的是提供一种新颖的咪唑醇化合物，其在金属制品，特别是铜，铝和钢制品中的金属表面强烈粘附，并且即使在薄膜中也具有优异的防锈效果， 使用其的表面处理剂。 新型咪唑醇化合物由以下通式（1）表示，具有防锈作用。 （通式（1）中，R 1，R 2，R 3和R 3各自为氢，乙烯基或具有1个 至20个碳原子，芳环可以通过R 2和R 3 3，X表示氢，具有1至6个碳原子的烷基或取代基组成 其可以含有N或O，m表示0至20的整数，n和1表示1至3的整数。）上述咪唑醇化合物可以通过使咪唑化合物和环氧醇化合物反应来制备。

公开(公告)号：US20050271540A1

公开(公告)日：2005-12-08

申请号：US10526295

申请日：2003-09-01

申请人： Masataka Yahagi ,  Toru Imori ,  Atsushi Nakamura

发明人： Masataka Yahagi ,  Toru Imori ,  Atsushi Nakamura

IPC分类号： B22F3/10 ,  B32B15/01 ,  C22C33/02

CPC分类号： C22C33/0264 ,  B22F3/1007 ,  B22F2999/00 ,  B32B15/013 ,  C22C33/02 ,  Y10T428/12014 ,  Y10T428/12479 ,  Y10T428/12951 ,  Y10T428/12993 ,  B22F2201/40

摘要： Provided is an iron-based sintered body with a rustproof function comprising a layer containing 0.01 to 5 at % of indium on the surface of the iron-based sintered body, or an iron-based sintered body with a rustproof function containing 0.01 to 5 at % of indium throughout the sintered body, and the iron-based sintered body having iron as its principal component is manufactured by performing sintering in a gas atmosphere containing indium vapor or indium. Thereby obtained is an iron-based sintered body, as well as the manufacturing method thereof, capable of easily improving the rustproof effect without having to hardly change the conventional process.

摘要翻译： 本发明提供一种具有防锈功能的铁基烧结体，该铁基烧结体包括在铁基烧结体的表面上含有0.01〜5原子％的铟的层或具有防锈功能的铁基烧结体，其含有0.01〜5at 通过在含有铟蒸气或铟的气体气氛中进行烧结来制造以铁为主要成分的铁基烧结体， 由此得到的铁基烧结体及其制造方法能够容易地提高防锈效果，而不需要改变常规工艺。

公开(公告)号：US20050166709A1

公开(公告)日：2005-08-04

申请号：US10514274

申请日：2003-09-01

申请人： Masataka Yahagi ,  Toru Imori ,  Atsushi Nakamura ,  Yasushi Narusawa ,  Seiji Masuda

发明人： Masataka Yahagi ,  Toru Imori ,  Atsushi Nakamura ,  Yasushi Narusawa ,  Seiji Masuda

IPC分类号： B22F3/02 ,  B22F1/00 ,  C22C33/02 ,  C22C38/00 ,  C22C38/04 ,  C22C38/08 ,  C22C38/10 ,  C22C38/16 ,  C22C1/04

CPC分类号： C22C33/0264 ,  B22F1/0059 ,  B22F1/007 ,  B22F2998/00 ,  C22C33/02 ,  C22C38/002 ,  C22C38/04 ,  C22C38/08 ,  C22C38/10 ,  C22C38/16

摘要： Provided is metallic powder for powder metallurgy having iron as its principal component and containing indium soap, or metallic powder for powder metallurgy further comprising at least one type selected among bismuth soap, nickel soap, cobalt soap, copper soap, manganese soap and aluminum soap in such indium soap. Thereby obtained is metallic powder for powder metallurgy capable of easily improving the rustproof effect without having to hardly change the conventional process.

摘要翻译： 本发明提供以铁为主要成分并含有铟皂的粉末冶金用金属粉末，或粉末冶金用金属粉末，还含有选自铋皂，镍皂，钴皂，铜皂，锰皂，铝皂中的至少一种 这样的铟皂。 由此得到的粉末冶金用金属粉末能够容易地提高防锈效果，而不需要改变常规方法。

公开(公告)号：US5488091A

公开(公告)日：1996-01-30

申请号：US265447

申请日：1994-06-24

申请人： T. Don Tilley ,  Toru Imori

发明人： T. Don Tilley ,  Toru Imori

IPC分类号： C08G79/12 ,  C09K9/02 ,  C09K11/06 ,  H01B1/12 ,  C08G79/00

CPC分类号： H01B1/12 ,  C08G79/12 ,  C09K11/06 ,  C09K9/02

摘要： A method for coupling tin-containing molecules via a Sn--Sn bond is described. The invention employs dehydrocondensation to link the Sn atoms of two molecules to form tin dimers as well as novel high molecular weight organotin polymers. In a preferred embodiment, catenated tin polymers are formed from hydrostannane precursors in the presence of a suitable metal catalyst. A particularly preferred method involves coupling dialkylstannane monomers in the presence of a metallocene catalyst to form polystannanes. Preferred catalysts include electropositive metals, such as Zr and Hf. The polystannanes are photolabile, decomposing readily under room light conditions.

摘要翻译： 描述了通过Sn-Sn键偶联含锡分子的方法。 本发明采用脱氢缩合连接两个分子的Sn原子以形成锡二聚体以及新的高分子量有机锡聚合物。 在优选的实施方案中，在合适的金属催化剂存在下，由氢化烷烃前体形成连接的锡聚合物。 特别优选的方法包括在茂金属催化剂存在下偶合二烷基锡烷单体以形成聚锡兰烷。 优选的催化剂包括正电性金属，例如Zr和Hf。 聚锡兰是光不稳定的，在室内光照条件下容易分解。

公开(公告)号：US08318313B2

公开(公告)日：2012-11-27

申请号：US12678509

申请日：2008-09-18

申请人： Toru Imori ,  Yoshiyuki Hisumi ,  Junichi Ito ,  Tsukasa Torimoto ,  Kenichi Okazaki ,  Susumu Kuwabata

发明人： Toru Imori ,  Yoshiyuki Hisumi ,  Junichi Ito ,  Tsukasa Torimoto ,  Kenichi Okazaki ,  Susumu Kuwabata

IPC分类号： B32B15/02 ,  B05D1/36 ,  B05D5/00

CPC分类号： B22F1/0018 ,  B82Y30/00 ,  H01L21/288 ,  Y10T428/24917 ,  Y10T428/31663 ,  Y10T428/31667

摘要： A metal nano particle can be supported and immobilized on a substrate uniformly. Thus, disclosed is a method for supporting a nano metal particle, which comprises applying a silane coupling agent having at least one functional group capable of capturing a metal (e.g., an imidazole group, an amino group, a diamino group, a mercapto group, and a vinyl group) in its molecule on a substrate, and then contacting the silane coupling agent with a nano particle of a metal (e.g., gold, platinum, silver, copper, palladium, nickel, cobalt), wherein the silane coupling agent may be produced by the reaction between an azole compound with an epoxysilane compound, and wherein the metal nano particle to be contacted with the silane coupling agent is preferably coated with an ionic fluid. Also disclosed is a substrate having a metal nano particle supported thereon, which is produced by the method.

摘要翻译： 金属纳米颗粒可以均匀地负载并固定在基材上。 因此，公开了一种支撑纳米金属粒子的方法，其包括：将具有至少一个能够捕获金属的官能团的硅烷偶联剂（例如，咪唑基，氨基，二氨基，巯基， 和乙烯基），然后使硅烷偶联剂与金属（例如金，铂，银，铜，钯，镍，钴）的纳米颗粒接触，其中硅烷偶联剂可以 可以通过唑类化合物与环氧硅烷化合物的反应来制造，其中与硅烷偶联剂接触的金属纳米颗粒优选用离子液体包覆。 还公开了通过该方法制造的具有负载在其上的金属纳米粒子的基板。

公开(公告)号：US08283051B2

公开(公告)日：2012-10-09

申请号：US12737399

申请日：2009-07-13

申请人： Junichi Ito ,  Atsushi Yabe ,  Junnosuke Sekiguchi ,  Toru Imori ,  Yasuhiro Yamakoshi ,  Shinichiro Senda

发明人： Junichi Ito ,  Atsushi Yabe ,  Junnosuke Sekiguchi ,  Toru Imori ,  Yasuhiro Yamakoshi ,  Shinichiro Senda

IPC分类号： B32B15/08

CPC分类号： C23C18/54 ,  C23C18/1637 ,  C23C18/165 ,  C25D3/38 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76873 ,  H01L21/76874 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12854 ,  Y10T428/12903

摘要： A plated product made of a substrate having formed thereon an alloy barrier thin film for preventing copper diffusion contains metal B, which has barrier properties in relation to copper and enables displacement plating with the copper ions contained in an electroless copper plating solution, and metal A, which tends to have less ionization than metal B in an electroless copper plating solution at a pH of 10 or higher; the alloy barrier thin film for preventing copper diffusion has a composition wherein metal A constitutes between 15 and 35 at % of the atoms; and a copper thin film is formed on the alloy barrier thin film by electroless plating using an electroless copper plating solution at a pH of 10 or higher.

摘要翻译： 由其上形成有用于防止铜扩散的合金阻挡薄膜的基板制成的电镀产品包含金属B，该金属B具有与铜相关的阻挡性能，并且能够与无电镀铜溶液中包含的铜离子进行置换镀覆，并且金属A 在pH为10以上的化学镀铜溶液中倾向于具有比金属B更少的离子化; 用于防止铜扩散的合金阻挡薄膜具有其中金属A构成原子的15至35原子％的组成; 并且通过使用pH为10以上的化学镀铜溶液进行化学镀，在合金阻挡薄膜上形成铜薄膜。

公开(公告)号：US20120192758A1

公开(公告)日：2012-08-02

申请号：US13501139

申请日：2011-03-14

申请人： Toru Imori ,  Jun Suzuki ,  Ryu Murakami ,  Akihiro Aiba ,  Junichi Ito

发明人： Toru Imori ,  Jun Suzuki ,  Ryu Murakami ,  Akihiro Aiba ,  Junichi Ito

IPC分类号： C09D5/00 ,  B05D1/18 ,  B05D3/10

CPC分类号： C23C18/1608 ,  C23C18/1635 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/2066 ,  C23C18/30

摘要： It is an object of the present invention to provide an electroless plating pretreatment agent that can retain stably Pd(II) over a long period of time in an organic solvent, an electroless plating method using the same that is capable of forming an electroless plated film having excellent adhesion, and an electroless plated object. The object is achieved by an electroless plating pretreatment agent comprising an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, the coordination compound being selected from the group consisting of the imidazole analogs, polyethyleneamines, ethyleneimines and polyethyleneimines.

摘要翻译： 本发明的目的是提供一种能够在有机溶剂中长期保持Pd（II）的化学镀预处理剂，使用该化学镀处理能够形成无电镀膜的化学镀方法 具有优异的粘附性，以及无电镀物。 该目的是通过包含有机钯化合物和具有溶解在有机溶剂中的具有金属捕获能力的官能团的配位化合物的化学镀预处理剂来实现的，该配位化合物选自咪唑类似物，聚乙烯胺 ，乙烯亚胺和聚乙烯亚胺。

公开(公告)号：US20120174827A1

公开(公告)日：2012-07-12

申请号：US13497551

申请日：2011-02-09

申请人： Junnosuke Sekiguchi ,  Masaomi Murakami ,  Toru Imori

发明人： Junnosuke Sekiguchi ,  Masaomi Murakami ,  Toru Imori

IPC分类号： C08K5/56

CPC分类号： C25D3/38 ,  C01G3/00 ,  C01P2006/80

摘要： An object of the present invention is to provide a high-purity aqueous copper sulfonate solution and a simplified method of producing this solution.The aqueous copper sulfonate solution of the present invention is characterized in that the copper concentration therein is at least 90 g/L, the content of metal impurities is less than 10 mg/L as metal for each metal impurity, the content of chlorine is less than 10 mg/L, and the sulfonic acid is a sulfonic acid represented by the following general formula R—(SO3H)n (in the formula, R represents a lower alkyl group, lower alkylidene group, lower alkylene group, or hydroxyalkyl group and n represents 1 or 2).

摘要翻译： 本发明的目的是提供一种高纯度磺酸铜水溶液和制备该溶液的简化方法。 本发明的铜磺酸铜水溶液的特征在于其中铜浓度至少为90g / L，每种金属杂质的金属杂质含量小于10mg / L，氯含量较少 （SO 3 H）n表示的磺酸（式中，R表示低级烷基，低级亚烷基，低级亚烷基或羟烷基），和 n表示1或2）。

公开(公告)号：US08004082B2

公开(公告)日：2011-08-23

申请号：US12449128

申请日：2009-02-19

申请人： Junnosuke Sekiguchi ,  Toru Imori

发明人： Junnosuke Sekiguchi ,  Toru Imori

IPC分类号： H01L21/00

CPC分类号： C23C14/185 ,  C25D7/123 ,  H01L21/2855 ,  H01L21/2885 ,  H01L21/76843 ,  H01L21/76873 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： It is an object of the present invention to provide a technology for forming an ULSI fine copper wiring by a simpler method. An electronic component in which a thin alloy film of tungsten and a noble metal used as a barrier-seed layer for an ULSI fine copper wiring is formed on a base material, wherein the thin alloy film has a composition comprising tungsten at a ratio equal to or greater than 60 at. % and the noble metal at a ratio of equal to or greater than 5 at. % and equal to or less than 40 at. %. The noble metal is preferably one or more kinds of metals selected from the group consisting of platinum, gold, silver and palladium.

摘要翻译： 本发明的目的是提供一种通过更简单的方法形成ULSI细铜布线的技术。 在基材上形成有钨和贵金属的合金薄膜用作ULSI细铜布线的阻挡种子层的电子部件，其中，所述薄合金膜的组成包含钨的比例等于 或大于60。 ％，贵金属的比例等于或大于5at。 ％且等于或小于40at。 ％。 贵金属优选为选自铂，金，银和钯中的一种或多种金属。