Abstract:
A semiconductor device includes: a semiconductor layer; at least one electrode formed on a semiconductor layer to be in contact with the semiconductor layer; and a passivation film covering the semiconductor layer and at least part of the top surface of the electrode to protect the semiconductor layer and formed of a plurality of sub-films. The passivation film includes a first sub-film made of aluminum nitride.
Abstract:
A bidirectional switch includes a field-effect transistor having a first ohmic electrode, a second ohmic electrode and a gate electrode, and a control circuit for controlling between a conduction state and a cut-off state by applying a bias voltage to the gate electrode. The control circuit applies the bias voltage from the first ohmic electrode as a reference when a potential of the second ohmic electrode is higher than the potential of the first ohmic electrode, and applies the bias voltage from the second ohmic electrode as a reference when the potential of the second electrode is lower than the potential of the first ohmic electrode.
Abstract:
A field effect transistor includes a first semiconductor layer made of a first group III-V nitride; a second semiconductor layer formed on the first semiconductor layer, made of a second group III-V nitride and having a gate recess portion for exposing the first semiconductor layer therein; and a gate electrode formed on the first semiconductor layer in the gate recess portion. A product of stress applied by the second semiconductor layer to the first semiconductor layer and the thickness of the second semiconductor layer is 0.1 N/cm or less.
Abstract:
A switching semiconductor device includes a first compound layer formed on a single crystal substrate which includes silicon carbide or sapphire, and including a general formula InxGa1-xN, where 0≦x≦1; a second compound layer formed on the first compound layer, and including a general formula InyALzGa1-y-zN, where 0≦y≦1 and 0
Abstract translation:开关半导体器件包括形成在包括碳化硅或蓝宝石的单晶衬底上的第一复合层,并且包括通式为N 1 Ga 1-x N,其中 0 <= x <= 1; 形成在第一化合物层上的第二化合物层,并且包含通式为Y 1,Y z,Ga 1-y z N,其中0 < = y <= 1,0
Abstract:
The invention has an object to provide a method of making an optical fiber array in which bare fibers obtained by removing a coating of an optical fiber ribbon can be certainly arrayed on a V-groove substrate. A first feature of the invention is to use a positioning guide, and the positioning guide is provided with a recess portion having inclined wall surfaces, and its bottom portion is made to have a width equal to the whole width of the bare fibers in an arrayed state. By using this positioning guide, the optical fiber array can be made in a process as follows. In a state where bare fibers exposed by removing part of coating of tip portions of two fiber ribbons are alternately arranged, the positioning guide is raised from below. The bare fibers with irregular gaps are moved by the positioning guide and are arranged. In this state, the bare fibers are pressed by a fiber pressing member from above, and the V-groove substrate is raised, so that they are put on V grooves and are fixed by an adhesive.
Abstract:
An optical connector for connecting optical fibers, comprises: a guide-groove substrate having grooves for positioning optical fibers and guide pins; an upper plate having groove portions each for covering the guide pins positioned in the guide grooves of the guide-groove substrate; elastic guide-pin pressing members each provided in the groove portions of the upper plate above portions where the guide pin grooves are in contact with the guide pins. In such a arrangement, it is preferable to form an oxide film on said V-grooves of the guide-groove substrate at least in the vicinity of contact points between the guide pins and the V-grooves. The optical connector further includes a resin molding portion for surrounding the substrate and the upper plate, the resin molding portion including a pair of opposite opened portions at a front and back surfaces thereof.
Abstract:
A sleeve for an optical connector into which a ferrule arranged to hold an optical fiber is to be inserted, and by which an optical connector in which the sleeve is to be housed can be reduced in size in a direction that the optical connector is fitted into a counterpart optical connector. A sleeve for an optical connector includes a portion having a tube shape, into which a ferrule is to be inserted, and a hook portion at one end of the sleeve, the hook portion protruding in a diameter direction of the tube-shaped portion.
Abstract:
A method for generating electric power with use of a solar cell includes steps of: (a) preparing the solar cell including a condensing lens and a solar cell element, wherein the following inequation set (I) is satisfied: d2
Abstract:
A sleeve for an optical connector into which a ferrule arranged to hold an optical fiber is to be inserted, and by which an optical connector in which the sleeve is to be housed can be reduced in size in a direction that the optical connector is fitted into a counterpart optical connector. A sleeve for an optical connector includes a portion having a tube shape, into which a ferrule is to be inserted, and a hook portion at one end of the sleeve, the hook portion protruding in a diameter direction of the tube-shaped portion.
Abstract:
The present invention has an object to provide an FET and a method of manufacturing the FET that are capable of increasing the threshold voltage as well as decreasing the on-resistance. The FET of the present invention includes a first undoped GaN layer; a first undoped AlGaN layer formed on the first undoped GaN layer, having a band gap energy greater than that of the first undoped GaN layer; a second undoped GaN layer formed on the first undoped AlGaN layer; a second undoped AlGaN layer formed on the second undoped GaN layer, having a band gap energy greater than that of the second undoped GaN layer; a p-type GaN layer formed in the recess of the second undoped AlGaN layer; a gate electrode formed on the p-type GaN layer; and a source electrode and a drain electrode which are formed in both lateral regions of the gate electrode, wherein a channel is formed at the heterojunction interface between the first undoped GaN layer and the first undoped AlGaN layer.