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公开(公告)号：US11843069B2
公开(公告)日：2023-12-12
申请号：US16703294
申请日：2019-12-04
IPC分类号： H01L31/115 , H01J37/244 , H01J37/28
CPC分类号： H01L31/115 , H01J37/244 , H01J37/28 , H01J2237/2441
摘要： The present disclosure describes a detector used in critical dimension scanning electron microscopes (CD-SEM) and review SEM systems. In one embodiment, the detector includes a semiconductor structure having a p-n junction and a hole through which a scanning beam is passed to a target. The detector also includes a top electrode for the p-n junction (e.g., anode or cathode) that provides an active area for detecting electrons or electromagnetic radiation (e.g., backscattering from the target). The top electrode has a doped layer and can also have a buried portion beneath the doped layer to reduce a series resistance of the top electrode without changing the active area. In another embodiment, an isolation structure can be formed in the semiconductor structure near sidewalls of the hole to electrically isolate the active area from the sidewalls. A method for forming the buried portion of the top electrode is also described.
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22.发明公开公开(公告)号：US20230378377A1
公开(公告)日：2023-11-23
申请号：US17749382
申请日：2022-05-20
发明人： Ya-Chin KING , Chrong Jung LIN , Burn Jeng LIN , Shi-Jiun WANG
IPC分类号： H01L31/02 , H01J37/244 , H01L31/18
CPC分类号： H01L31/02005 , H01J37/244 , H01L31/186
摘要： A device includes a detector, a sensing pad, a ring structure, a control circuit, a first transistor, and a second transistor. The sensing pad is electrically connected to the detector. The ring structure is over the sensing pad and includes an upper conductive ring and a lower conductive ring between the upper conductive ring and the sensing pad. The first transistor interconnects the upper conductive ring and the control circuit. The second transistor interconnects the lower conductive ring and the control circuit.
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23.发明公开公开(公告)号：US20230377831A1
公开(公告)日：2023-11-23
申请号：US18027903
申请日：2021-09-02
发明人： Oleg KRUPIN , Weiming REN , Xuerang HU , Xuedong LIU
IPC分类号： H01J37/147 , H01J37/244 , H01J37/21
CPC分类号： H01J37/1472 , H01J37/244 , H01J37/21 , H01J37/28
摘要： A method of operating a secondary imaging system of a charged particle beam apparatus may include using an anti-scanning mode. Excitation of a component of the secondary imaging system may be adjusted synchronously with a primary scanning deflection unit. Together with an anti-scanning deflection unit performing anti-scanning, a component of the secondary imaging system, such as a lens, may be adjusted in step. As scanning and anti-scanning is performed, excitation parameters of the component may also be constantly updated.
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公开(公告)号：US11798777B2
公开(公告)日：2023-10-24
申请号：US16824499
申请日：2020-03-19
IPC分类号： H01J37/21 , H01J37/244 , H01J37/28
CPC分类号： H01J37/21 , H01J37/244 , H01J37/28 , H01J2237/0453 , H01J2237/2817
摘要： A charged particle beam apparatus includes a beamlet forming unit configured to form and scan an array of beamlets on a sample. A first portion of the array of beamlets is focused onto a focus plane, and a second portion of the array of beamlets has at least one beamlet with a defocusing level with respect to the focus plane. The charged particle beam apparatus also includes a detector configured to detect an image of the sample formed by the array of beamlets, and a processor configured to estimate a level of separation between the focus plane and the sample based on the detected image and then reduce the level of separation based on the estimated level.
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公开(公告)号：US20230326714A1
公开(公告)日：2023-10-12
申请号：US18027051
申请日：2021-08-04
发明人： Michinobu MIZUMURA
IPC分类号： H01J37/28 , H01J37/317 , H01J37/32 , H01J37/244 , H01J37/22
CPC分类号： H01J37/28 , H01J37/3178 , H01J37/32449 , H01J37/244 , H01J37/226 , H01J2237/2817 , H01J2237/2806
摘要： A metal pattern inspection method which applies a pulsed voltage to a metallic pattern, sets a cycle of the pulsed voltage to be shorter than a scanning cycle in which a focused ion beam is swept, indicating only a region of a secondary charged particle image corresponding to a portion of the metallic pattern which is isolated by a wire breakage and to which the pulsed voltage is applied in the form of a first pattern created as a function of surface electrical potentials changing in level with time, detecting, as a disconnection, a boundary between the first pattern and a second pattern created as a function of surface electrical potentials not changing in level with time, and determining whether there is a breaking of or a short circuit in the metallic pattern based on the presence or absence of the disconnection.
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公开(公告)号：US20230326710A1
公开(公告)日：2023-10-12
申请号：US17967854
申请日：2022-10-17
申请人： KLA Corporation
发明人： Stefan Eyring
IPC分类号： H01J37/22 , H01J37/28 , H01J37/244
CPC分类号： H01J37/222 , H01J37/28 , H01J37/244 , H01J2237/2814 , H01J2237/2817
摘要： A simulated tool signal is determined from design data and tool properties of the tool making the measurements. A design-assisted composite signal is determined from measurements. An edge placement uniformity signal is then determined by comparing the simulated tool signal and the design-assisted composite signal. A shape and/or an area of the edge placement uniformity signal can be analyzed. The edge placement uniformity signal enables screening of structures with respect to wafer stochastics without the need to fully characterize all individual structures.
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27.发明公开公开(公告)号：US20230317409A1
公开(公告)日：2023-10-05
申请号：US18306985
申请日：2023-04-25
申请人： TSINGHUA UNIVERSITY
发明人： Rong YU , Wenfeng YANG , Haozhi SHA , Jizhe CUI
IPC分类号： H01J37/28 , H01J37/244 , H01J37/22
CPC分类号： H01J37/28 , H01J37/222 , H01J37/244 , H01J2237/2801
摘要： The present disclosure discloses a method, which includes: obtaining, by controlling to move an electron beam to scan a sample, a diffraction intensity of the sample at each scanning position; initializing a sample transmission function and an electron beam function, establishing, based on the diffraction intensity, the sample transmission function, and the electron beam function, a forward propagation model containing to-be-optimized parameters, and calculating a value of a loss function; solving a derivative of the loss function with respect to the to-be-optimized parameters, to obtain gradients of the to-be-optimized parameters in the sample transmission function and the electron beam function, optimizing the to-be-optimized parameters based on the gradients, and updating the value of the loss function; and repeating an iteration process until an iteration termination condition is satisfied, and outputting an optimized sample transmission function and an optimized electron beam function.
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公开(公告)号：US20230317407A1
公开(公告)日：2023-10-05
申请号：US17709272
申请日：2022-03-30
发明人： Lior Akerman , Vadim Kuchik
IPC分类号： H01J37/244 , H01J37/28 , H01J37/22
CPC分类号： H01J37/244 , H01J37/222 , H01J37/28
摘要： A method for determining a depth of a hidden structural element of an object, the method may include (i) obtaining contrast information regarding a contrast between (a) hidden structural element detection signals that are indicative of electrons emitted from the hidden structural element, and (b) surroundings detection signals that are indicative of electrons emitted from a surroundings of the hidden structural element; wherein the hidden structural element detection signals and the surroundings detection signals are detected as a result of a scanning of a region of the object, with an illuminating electron beam; wherein the region comprises the hidden structural element and the surroundings; and (ii) determining the depth of the hidden structural element based, at least in part, on the contrast information.
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公开(公告)号：US20230307208A1
公开(公告)日：2023-09-28
申请号：US18184761
申请日：2023-03-16
发明人： Hyobin YOO
IPC分类号： H01J37/28 , H01J37/20 , H01J37/244
CPC分类号： H01J37/28 , H01J37/20 , H01J37/244
摘要： Provided is a microscopic specimen including a lower plate that includes a lower opening portion, an upper plate that covers the lower opening portion, a target material layer on the upper plate, a lower electrode layer between the upper plate and the target material layer, an upper electrode layer on the target material layer, and a wiring pattern electrically connected to each of the upper electrode layer and the lower electrode layer.
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公开(公告)号：US20230304949A1
公开(公告)日：2023-09-28
申请号：US18323096
申请日：2023-05-24
发明人： Roy Ramon VEENSTRA
IPC分类号： G01N23/2251 , H01J37/28 , H01J37/12 , H01J37/244
CPC分类号： G01N23/2251 , H01J37/28 , H01J37/12 , H01J37/244 , G01N2223/6116 , H01J2237/1207 , H01J2237/2448 , H01J2237/24495 , H01J2237/24564
摘要： A multi-beam electron-optical system for a charged-particle assessment tool, the system comprising:
an objective lens array assembly comprising a plurality of objective lenses, each configured to project one of a plurality of charged-particle beams onto a sample;
a detector array associated with the objective lens array assembly and configured to detect charged-particles emitted from the sample; and
a circuit comprising an amplifier in data communication with the detector array;
wherein the amplifier is configured to be tunable in order to tune amplification of signals from the detector array.
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