公开(公告)号：US20230287568A1

公开(公告)日：2023-09-14

申请号：US17692351

申请日：2022-03-11

申请人： Applied Materials, Inc.

发明人： Laksheswar Kalita ,  Joseph Behnke ,  David Knapp

IPC分类号： C23C16/455 ,  C23C18/32 ,  C23C14/16 ,  C23C18/16 ,  C23C14/58

CPC分类号： C23C16/45565 ,  C23C18/32 ,  C23C14/165 ,  C23C18/1689 ,  C23C14/5853

摘要： Described herein is a chamber component including a metal layer comprising nickel and a barrier layer of nickel oxide over the metal layer. The barrier layer of nickel oxide may be formed by ozone treating the chamber component with air, nitrogen or argon O2, O3 at a temperature from about 25° C. to about 350° C.

公开(公告)号：US20230250535A1

公开(公告)日：2023-08-10

申请号：US18119350

申请日：2023-03-09

申请人： C3 Nano, Inc.

发明人： Yongxing Hu ,  Xiqiang Yang ,  Ying-Syi Li ,  Alexander Seung-il Hong ,  Melanie Mariko Inouye ,  Yadong Cao ,  Ajay Virkar

IPC分类号： C23C18/44 ,  C23C18/54 ,  C09D133/06 ,  C23C18/16 ,  B32B27/20 ,  B32B9/04 ,  B32B27/28 ,  B32B27/08 ,  B32B15/04 ,  B32B15/08 ,  B82Y30/00 ,  C09D11/52 ,  C09D101/02 ,  C09D139/06 ,  C23C18/42 ,  H01B1/22 ,  H01B13/30 ,  H05K1/02 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  B32B15/01

CPC分类号： C23C18/44 ,  B32B9/045 ,  B32B15/04 ,  B32B15/08 ,  B32B15/018 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B82Y30/00 ,  C09D11/52 ,  C09D101/02 ,  C09D133/06 ,  C09D139/06 ,  C23C18/42 ,  C23C18/54 ,  C23C18/1635 ,  C23C18/1637 ,  H01B1/22 ,  H01B13/30 ,  H05K1/02 ,  H05K1/097 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/105 ,  H05K3/1283 ,  C09D105/08

摘要： Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

公开(公告)号：US11718727B2

公开(公告)日：2023-08-08

申请号：US16496591

申请日：2018-03-26

申请人： Chemische Fabrik Budenheim KG

发明人： Sven Fünderich ,  David Garcia Martinez ,  Thomas Futterer ,  Christian Litterscheid ,  Rüdiger Wissemborski ,  Jorge Flores

IPC分类号： C08K3/01 ,  C08K3/32 ,  C23C18/14 ,  C08K3/30 ,  C08K5/00 ,  C23C18/16 ,  C25D5/56 ,  G03F7/20 ,  H05K1/03 ,  H05K3/10

CPC分类号： C08K3/01 ,  C08K3/30 ,  C08K3/32 ,  C08K5/0008 ,  C23C18/1612 ,  C25D5/56 ,  G03F7/2053 ,  H05K1/0373 ,  H05K3/105

摘要： A method for manufacturing electrically conductive structures, preferably conductive pathway structures using laser beams on a non-conductive carrier (LDS method), wherein a non-conductive carrier material is provided which contains at least one inorganic metal phosphate compound and at least one stabiliser finely distributed or dissolved therein, the carrier material is irradiated in regions by laser beams generating the electrically conductive structures in the irradiated regions.

公开(公告)号：US20230197509A1

公开(公告)日：2023-06-22

申请号：US17926093

申请日：2021-05-20

申请人： Lam Research Corporation

发明人： Lee J. Brogan ,  Matthew Martin Huie ,  Yi Hua Liu ,  Jonathan David Reid

IPC分类号： H01L21/768 ,  C23C16/06 ,  C23C16/455 ,  C23C16/02 ,  C23C18/31 ,  C23C18/16

CPC分类号： H01L21/76843 ,  C23C16/06 ,  C23C16/0272 ,  C23C16/45525 ,  C23C18/31 ,  C23C18/165 ,  H01L21/76826 ,  C23F17/00

摘要： Various embodiments relate to methods, apparatus, and systems for forming an interconnect structure, or a portion thereof. The method may include contacting the substrate with a functionalization bath comprising a first solvent and a functionalization reactant to form a modified first material, and then depositing a second material on the modified first material through electroless plating, electroplating, chemical vapor deposition, or atomic layer deposition. The first material may be a dielectric material, a barrier layer, or a liner, and the second material may be a barrier layer or a barrier layer precursor, a liner, a seed layer, or a conductive metal that forms the interconnect of the interconnect structure, according to various embodiments.

公开(公告)号：US20230182434A1

公开(公告)日：2023-06-15

申请号：US18079808

申请日：2022-12-12

申请人： Metamaterial Technologies USA, Inc.

发明人： Boris Kobrin

IPC分类号： B32B3/30 ,  C23C18/16 ,  C23C18/22 ,  B32B3/02 ,  B32B15/04 ,  B32B15/02 ,  B32B15/08

CPC分类号： B32B3/30 ,  C23C18/165 ,  C23C18/1605 ,  C23C18/22 ,  B32B3/02 ,  B32B15/04 ,  B32B15/02 ,  B32B15/08 ,  B05D5/083

摘要： A self-cleaning transparent conductive surface includes a hydrophobic film and a metal nano-web coupled to the hydrophobic film. The metal nano-web imparts conductive properties to the surface of the film and texturing formed by either the hydrophobic film, substrate or metal nano-web create a super-hydrophobic surface. This super-hydrophobic and conductive surface may be created by etching and layering a metal nano-web over the surface of a hydrophobic film or a rigid substrate, the metal grid may the hydrophobic film or substrate may also be etched in a moth's eye pattern. Both the hydrophobic film or substrate and metal nano-web may be coated in a layer of hydrophobic material to further increase the hydrophobic effect.

公开(公告)号：US11674228B2

公开(公告)日：2023-06-13

申请号：US17547541

申请日：2021-12-10

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Yuki Sato

IPC分类号： C23C18/16 ,  B05C1/06 ,  B05C3/18

CPC分类号： C23C18/1664 ,  B05C1/06 ,  B05C3/18 ,  C23C18/1637 ,  C23C18/1698

摘要： Provided is a device and a method for forming a metal plating film having a thick film thickness by a solid substitution-type electroless plating method. The present disclosure relates to a film formation device for forming a film of a first metal on a plating film of a second metal by a solid substitution-type electroless plating method, comprising: a conductive mounting base; a third metal; an insulating material; a microporous membrane; a plating bath chamber; and a pressing unit, wherein the third metal has an ionization tendency larger than ionization tendencies of the first metal and the second metal, and wherein the insulating material is installed between a base material and the third metal so as to contact respective materials of the base material and the third metal when the base material having the plating film of the second metal is installed.

公开(公告)号：US20230168592A1

公开(公告)日：2023-06-01

申请号：US17538066

申请日：2021-11-30

申请人： CANON KABUSHIKI KAISHA

发明人： Byung-Jin Choi ,  Seth J. Bamesberger ,  Alex Ruiz

IPC分类号： G03F7/20 ,  F16J15/10 ,  G03F7/00 ,  C23C18/16

CPC分类号： G03F7/70808 ,  C23C18/161 ,  F16J15/104 ,  G03F7/0002

摘要： Some devices and systems comprise one or more walls of a reaction chamber; an adjustable gap in the one or more walls, wherein the adjustable gap is formed between a first gap surface and a second gap surface facing the first gap surface, and wherein a distance between the first gap surface and the second gap surface is adjustable; a plurality of stops, wherein each stop of the plurality of stops is positioned on either the first gap surface or the second gap surface, wherein the plurality of stops ensure a minimum distance of the adjustable gap, wherein a total length of the plurality of stops is less than 1% of a length of the first gap surface; and one or more vacuum ports in the first gap surface or the second gap surface.

公开(公告)号：US20230160139A1

公开(公告)日：2023-05-25

申请号：US17997220

申请日：2021-06-28

申请人： NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY ,  ASANO FIBERS, INC. ,  YAMADA CO., LTD.

发明人： Akihiro WAKISAKA ,  Miki NAKAGAWA ,  Hitomi KOBARA ,  Takahiro ASANO ,  Takao YAMADA

IPC分类号： D06M11/83 ,  C23C18/31 ,  C23C18/52 ,  C23C18/16 ,  C23C18/18

CPC分类号： D06M11/83 ,  C23C18/31 ,  C23C18/52 ,  C23C18/1658 ,  C23C18/18

摘要： The amount of a processing solution used is reduced, and the quality of an electroless plated fiber material is improved. The present invention relates to a manufacturing method for an electroless plated fiber material A4. The manufacturing method includes a step S5 of electrostatically spraying a solution B containing a catalyst precursor in a state of being electrically charged to a positive potential onto a fiber material A2 while grounding the fiber material A2 and moistening the fiber material A2, and electrostatically spraying a solution C containing a reducing agent in a state of being electrically charged to a positive potential onto the fiber material A2, and a step S7 of electrostatically spraying each of a solution D containing metal ions and a solution E containing a reducing agent each in a state of being electrically charged to a positive potential onto the fiber material A3 such that the solution D containing metal ions and the solution E containing the reducing agent react with each other in the same electric field on the fiber material A3 while grounding the fiber material A3 to which a catalyst is given and moistening the fiber material A3. The present invention relates to the electroless plated fiber material A4 manufactured by the manufacturing method. The present invention relates to a manufacturing system of the electroless plated fiber material A4.

公开(公告)号：US11639552B2

公开(公告)日：2023-05-02

申请号：US16679635

申请日：2019-11-11

申请人： LACKS ENTERPRISES, INC.

发明人： Michael LaVallee

IPC分类号： C23C18/16 ,  C25D5/02 ,  C25D3/04 ,  C25D5/56 ,  C25D5/00 ,  C25D5/12 ,  C25D5/14

摘要： A method for plating a work piece includes forming a work piece, where the work piece includes first and second segments that are electrically isolated. The first segment is connected in a first circuit and the second segment is connected in a second circuit. The first circuit may include a first power source and the second circuit may include a second power source. The work piece and the first and second segments may be disposed in a common solution, and current may be applied in the first circuit and the second circuit to create first and second metal surfaces. The first and second metal surfaces may be made from the same base metal. The first and second metal surfaces may be created simultaneously, with the work piece and the first and second segments disposed in a common solution.

公开(公告)号：US20230083886A1

公开(公告)日：2023-03-16

申请号：US17903339

申请日：2022-09-06

申请人： Northwestern University

发明人： Luke Clyde Oak Prestowitz ,  Jiaxing Huang ,  David C. Dunand

IPC分类号： C23C18/40 ,  C22C1/04 ,  C23C18/16 ,  B22F1/17

摘要： Methods of treating metal nanocrystals are provided. In embodiments, such a method comprises exposing metal nanocrystals comprising a metal and characterized by at least one twinning boundary therein, to a plating solution comprising a reducing agent and coating metal cations comprising a different metal, under conditions to form a coating of the different metal on surfaces of the metal nanocrystals via electroless deposition by chemical reduction of the coating metal cations, thereby providing coated metal nanocrystals. Methods of forming bulk nanostructured metal alloys from the coated metal nanocrystals are also provided.