Abstract:
A method of manufacturing a rotary abrasive machining tool, the rotary abrasive machining tool including a hub and a plurality of abrasive segments mounted to the hub, the method including the steps of: mounting each abrasive segment on the hub; machining an abrading edge on each abrasive segment while the abrasive segment is mounted on the hub.
Abstract:
A system for monitoring contamination level of effluent of an offline brush conditioning system includes a first set of reservoirs configured to collect first effluents from corresponding portions of a first brush and a second set of reservoirs configured to collect second effluents from corresponding portions of a second brush, and the first and second effluents are from a fluid used to condition the first and second brushes that are configured to clean a surface of a semiconductor wafer. An effluent contamination monitor is configured to monitor contamination levels of the first and second effluents, wherein the monitored contamination levels may provide feedback for use in the brush conditioning.
Abstract:
A dresser includes: a mount component; and a cutting edge component inserted in the mount component at a base end portion side, wherein the portion of the cutting edge component inserted in the mount component has one or more portions in each of which an area of a cross section is increased from the front end portion side toward the base end portion side in the insertion direction, and a ratio L1/M1 of a length L1 and a maximum value M1 is more than or equal to 2.1, where L1 represents a length of the portion of the cutting edge component inserted in the mount component and M1 represents a maximum value of a diameter of a circle having an area equal to the area of the cross section of the portion of the cutting edge component inserted in the mount component.
Abstract:
A method for the dressing of a multi-thread grinding worm by a dressing roll, wherein the grinding worm has at least two screw channels which are arranged parallel to another, which screw channels extend helically around an axis of the grinding worm and wherein the dressing roll has at least two adjacent dressing profiles which are arranged along an axis of the dressing roll, wherein the dressing profiles of the dressing roll are guided simultaneously through adjacent screw channels of the grinding worm during the dressing of the grinding worm. To improve the precision of the dressing the method includes the steps: a) execution of a first partial dressing process at which the dressing profiles of the dressing roll are guided simultaneously through first adjacent screw channels of the grinding worm; b) execution of at least one second partial dressing process at which the dressing profiles of the dressing roll are guided simultaneously through second adjacent screw channels of the grinding worm, wherein the second adjacent screw channels are, compared with step a), offset in the direction of the axis of the grinding worm by at least one screw channel of the grinding worm.
Abstract:
The two piece spindle grinder fixture is adapted to minimize the size of the frame by a two piece spindle assembled into a frame having a bearing race formed between the frame and the two piece spindle. An angularity adjustable angle indicator mounted concentric with a spindle axis to allow the indicator to be adjusted relative to a part attached to the two piece spindle. A chuck or other holding tool may be mounted on the chuck end of the two piece spindle opposite a handle on a handle end.
Abstract:
A grinding tool includes a substrate having a surface provided with a plurality of openings, and a plurality of grinding studs. Each of the grinding studs includes a stud portion and an abrasive particle attached to each other, the stud portions being respectively attached into the openings, and the abrasive particles protruding outward from the surface, each of the abrasive particles having a pattern cut across a tip thereof to define multiple apexes adjacent to one another.
Abstract:
The present disclosure relates to a method of dressing a tool which can be used for the gear manufacturing machining of a workpiece on a dressing machine, wherein the dressing takes place with line contact between the dresser and the tool; wherein a specific modification of the surface geometry of the tool is produced in that the position of the dresser with respect to the tool during dressing is varied in dependence on the tool width position.
Abstract:
A machining apparatus has a frame carrying a headstock capable of gripping one end of an elongated workpiece and rotating the workpiece about a machining axis. A turntable support is spaced axially from the headstock on the frame. A tailstock carried on the support can be aligned with the machining axis in a machining position of the support. A machining drive is carried on the frame and itself carries a rotatable grinding disk engageable radially of the machining axis with the workpiece when the workpiece is engaged between the headstock and tailstock. A dressing tool carried on the support axially offset from the support axis and angularly offset about the support axis from the tailstock is engageable in a dressing position of the support with the grinding disk for dressing same in the dressing position with the workpiece engaged between the headstock and tailstock.
Abstract:
A CMP pad conditioner including: (a) a disk-shaped substrate having a working surface which is provided by one of its axially opposite end surfaces and which is to be brought into contact with the CMP pad; and (b) abrasive grains which are fixed to the working surface. The substrate includes a radially inner portion and a radially outer portion which is located radially outwardly of the radially inner portion. The working surface in the radially outer portion is inclined with respect to the working surface in the radially inner portion, such that a thickness of the radially outer portion as measured in an axial direction of the substrate is reduced as viewed in a direction away from an axis of the substrate toward a periphery of the substrate. A ratio of an outside diameter of the radially inner portion to an outside diameter of the substrate is 60-85%.
Abstract:
A semiconductor wafer polishing pad conditioner which includes a support structure and a roller which is rotatably mounted to the support structure. The roller has a working surface which is formed with a plurality of blades.