公开(公告)号：US20190176179A1

公开(公告)日：2019-06-13

申请号：US16203719

申请日：2018-11-29

申请人： SCREEN Holdings Co., Ltd.

发明人： Yukifumi YOSHIDA ,  Hiroaki TAKAHASHI ,  Masayuki OTSUJI ,  Manabu OKUTANI ,  Chikara MAEDA ,  Hiroshi ABE ,  Shuichi YASUDA ,  Yasunori KANEMATSU

IPC分类号： B05B12/10 ,  B08B3/10 ,  B05D1/00 ,  B05B1/24 ,  H01L21/67

摘要： A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate, a holding layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removing the particle holding layer from the substrate, a liquid film of the second processing liquid, a solidifying step of cooling the liquid film to a temperature not more than a melting point of the sublimable substance to make the liquid film solidify on the substrate and form a solid film, and a sublimating step of sublimating and thereby removing the solid film from the substrate.

公开(公告)号：US20190139756A1

公开(公告)日：2019-05-09

申请号：US16181819

申请日：2018-11-06

申请人： TOKYO ELECTRON LIMITED

发明人： Tatsuya YAMAGUCHI

IPC分类号： H01L21/02 ,  H01L21/67 ,  H01L21/687 ,  B05B1/24 ,  B05B1/30 ,  B08B7/00

摘要： A substrate processing apparatus for processing a substrate to manufacture a semiconductor device, includes: a mounting table on which a substrate is mounted; a first liquid supply part that supplies a first liquid to form a polymer film having a urea bond on the substrate mounted on the mounting table; a second liquid supply part that supplies a second liquid reacting with the first liquid; and a nozzle part provided at an end portion of a liquid flow path where the first liquid supplied from the first liquid supply part and the second liquid supplied from the second liquid supply part are joined with each other to obtain a mixed solution, and configured to supply the mixed solution to the substrate to form the polymer film on a surface of the substrate, wherein the polymer film is temporarily used for manufacturing the semiconductor device and is subsequently removed by depolymerization.

公开(公告)号：US10159995B2

公开(公告)日：2018-12-25

申请号：US12515831

申请日：2006-12-15

申请人： Dan Vanderzwet ,  Zygmunt Baran ,  Gerald Mills

发明人： Dan Vanderzwet ,  Zygmunt Baran ,  Gerald Mills

IPC分类号： B05B1/24 ,  B05B7/00 ,  B05B7/14 ,  B05B7/16 ,  C23C24/04

摘要： A gas dynamic spray unit is provided that includes gun housing halves secured about a heater assembly. The heater assembly includes a one-piece, multi-passage ceramic heater core. The heater assembly is retained within the gun housing using locating features provided on the heater assembly and the gun housing. The heater assembly includes a heater housing at least partially surrounding the heater core. A biasing member biases the ceramic heater core toward a tapered outlet, which is provided by a deflecting cone surrounded by an insulating cone.

公开(公告)号：US20180354467A1

公开(公告)日：2018-12-13

申请号：US15615866

申请日：2017-06-07

申请人： Ford Global Technologies, LLC

发明人： David Brian Glickman ,  Paul Kenneth Dellock ,  Stuart C. Salter ,  Venkatesh Krishnan ,  Jose Garcia Crespo

IPC分类号： B60S1/56 ,  B05B1/24 ,  B05B15/10 ,  B60S1/48 ,  B60S1/66

CPC分类号： B60S1/56 ,  B05B1/24 ,  B05B15/70 ,  B29C45/14549 ,  B29K2071/00 ,  B29K2077/00 ,  B60S1/488 ,  B60S1/528 ,  B60S1/66

摘要： An apparatus, according to an exemplary aspect of the present disclosure includes, among other things, a housing and a plunger moveable between a retracted position within the housing and an extended position to spray fluid on a vehicle component. A heater is mounted for movement with the plunger. A method according to an exemplary aspect of the present disclosure includes, among other things, molding a heater element and a body having an internal channel extending between a fluid inlet and a fluid outlet together to form a plunger configured to spray fluid out of the fluid outlet.

公开(公告)号：US20180343921A1

公开(公告)日：2018-12-06

申请号：US15771760

申请日：2016-10-27

申请人： Fontem Holdings 1 B.V.

发明人： Neha Daryani

IPC分类号： A24F47/00 ,  A24F7/00 ,  B05B1/24

CPC分类号： A24F47/008

摘要： An electronic smoking device is provided comprising a housing with a mouthpiece portion and a heating element arranged within the housing. Furthermore, the electronic smoking device comprises a liquid reservoir adapted to receive a base liquid therein. Moreover, the electronic smoking device further comprises a pump mechanism that is adapted to provide at least a part of the base liquid within the liquid reservoir onto the heating element upon an actuation of the pump mechanism in a fully assembled state of the electronic smoking device.

公开(公告)号：US20180326321A1

公开(公告)日：2018-11-15

申请号：US16036281

申请日：2018-07-16

申请人： Michael J. Hochbrueckner

发明人： Michael J. Hochbrueckner

IPC分类号： A63J5/02 ,  B05B1/24

CPC分类号： A63J5/025 ,  B05B1/24

摘要： An adjustable atomizer nozzle assembly includes an assembly body; first and second side nozzle components, including compressed air tubes, liquid tubes, liquid heater, air heater, atomizer nozzles, which are mounted with an impingement angle to create a combined aerosol stream with reduced droplet size. An adjustable atomizer nozzle system includes a nozzle assembly; a mast assembly; a self-coiling line assembly, including a compressed air line, a pressurized liquid line, and a power line; a pressure tank; a compressor; a power supply; a mounting base; and wheels. A nozzle assembly can include one atomizer nozzle with a liquid heater. A method of use includes providing an adjustable atomizer nozzle system, configuring impingement for spraying, spraying a room, configuring impingement for fogging, and fogging the room.

公开(公告)号：US10041234B2

公开(公告)日：2018-08-07

申请号：US15786703

申请日：2017-10-18

申请人： KOHLER MIRA LIMITED

发明人： Kevin T. Peel

IPC分类号： E03B1/00 ,  E03C1/04 ,  B05D1/24 ,  B05B1/18 ,  G05D23/19 ,  G05D23/185 ,  G05D23/13 ,  G05D11/16 ,  G05D11/13 ,  G05D7/06 ,  F17D1/00 ,  F16K49/00 ,  F16K31/04 ,  F16K27/02 ,  F16K11/00 ,  F16K11/24 ,  F16K11/22 ,  F16K1/44 ,  E03C1/05 ,  E03C1/044 ,  E03C1/02 ,  E03B7/07 ,  E03B7/00 ,  B05B1/24

CPC分类号： E03C1/055 ,  B05B1/18 ,  B05B1/24 ,  B05D1/24 ,  E03B7/006 ,  E03B7/074 ,  E03B7/075 ,  E03B7/078 ,  E03C1/02 ,  E03C1/04 ,  E03C1/0404 ,  E03C1/0409 ,  E03C1/044 ,  F16K1/44 ,  F16K11/22 ,  F16K11/24 ,  F16K19/00 ,  F16K19/006 ,  F16K27/0263 ,  F16K31/04 ,  F16K49/002 ,  F17D1/00 ,  G05D7/0617 ,  G05D11/13 ,  G05D11/16 ,  G05D23/1393 ,  G05D23/1858 ,  G05D23/19 ,  G05D23/1917 ,  H05K999/99 ,  Y10T137/0318 ,  Y10T137/0329 ,  Y10T137/0391 ,  Y10T137/0424 ,  Y10T137/6606 ,  Y10T137/7759 ,  Y10T137/8376 ,  Y10T137/8593 ,  Y10T137/86389 ,  Y10T137/87668 ,  Y10T137/87684 ,  Y10T137/87692

摘要： A mixing valve having a housing and first and second flow control valves. The housing has a mixing chamber, a first outlet, and a second outlet. The first flow control valve controls fluid flow through the first outlet to the mixing chamber, and the second flow control valve controls fluid flow through the second outlet to the mixing chamber. The first and second outlets each have a size so that the mixing valve has a flow coefficient of approximately 2.5 in a mid-open position of both flow control valves, and the housing has a length dimension, a width dimension, and a thickness dimension, and the largest of these dimensions is no more than approximately 65 millimeters.

公开(公告)号：US20180207652A1

公开(公告)日：2018-07-26

申请号：US15936638

申请日：2018-03-27

申请人： SCREEN Holdings Co., Ltd.

发明人： Yukihiko INAGAKI

IPC分类号： B05B1/24 ,  H01L21/677 ,  H01L21/67 ,  B05C13/00 ,  B05C13/02

摘要： A substrate treating apparatus includes a front heat-treating block, a front relay block and a solution treating block. The front heat-treating block has heat-treating units and main transport mechanisms. The front relay block has receivers and transport mechanisms. The solution treating block has solution treating units and transport mechanisms for solution treatment. The front heat-treating block and front relay block are connected to be able to transport substrates reciprocally. The front relay block and solution treating block are connected to be able to transport the substrates reciprocally. The front relay block is disposed between the solution treating block and front heat-treating block.

公开(公告)号：US20180194614A1

公开(公告)日：2018-07-12

申请号：US15915454

申请日：2018-03-08

申请人： STMicroelectronics Asia Pacific Pte Ltd ,  STMicroelectronics S.r.l. ,  STMicroelectronics, Inc.

发明人： Teck Khim Neo ,  Mauro Pasetti ,  Franco Consiglieri ,  Luca Molinari ,  Andrea Nicola Colecchia ,  Simon Dodd

IPC分类号： B81B7/00 ,  B05B1/24

CPC分类号： B81B7/008 ,  B05B1/24 ,  B05B17/06 ,  B41J2/04501 ,  B41J2/04541 ,  B41J2/04543 ,  B41J2/14016 ,  B41J2/14072 ,  B81B2201/05 ,  B81B2207/012 ,  B81B2207/091

摘要： The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.

公开(公告)号：US09956565B2

公开(公告)日：2018-05-01

申请号：US15226460

申请日：2016-08-02

申请人： SCREEN Holdings Co., Ltd.

发明人： Yukihiko Inagaki

IPC分类号： H01L21/67 ,  B05B1/24 ,  B05C13/00 ,  B05C13/02 ,  H01L21/677

CPC分类号： B05B1/24 ,  B05C13/00 ,  B05C13/02 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67276 ,  H01L21/67745

摘要： A substrate treating apparatus includes a front heat-treating block, a front relay block and a solution treating block. The front heat-treating block has heat-treating units and main transport mechanisms. The front relay block has receivers and transport mechanisms. The solution treating block has solution treating units and transport mechanisms for solution treatment. The front heat-treating block and front relay block are connected to be able to transport substrates reciprocally. The front relay block and solution treating block are connected to be able to transport the substrates reciprocally. The front relay block is disposed between the solution treating block and front heat-treating block.