Abstract:
Cracking in a thermoelectric element made of a filled-skutterudite-type alloy is suppressed. A p-type thermoelectric element includes: a p-type thermoelectric conversion layer made of an alloy having a filled-skutterudite structure containing antimony; a p-side first metal layer that contains titanium simple substances and iron simple substances, and is laminated on the p-type thermoelectric conversion layer; and a p-side second metal layer that contains titanium simple substances, and is laminated on the p-side first metal layer.
Abstract:
Thermoelectric materials based on tetrahedrite structures for thermoelectric devices and methods for producing thermoelectric materials and devices are disclosed.
Abstract:
Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: InxCo4Sb12-zSez, where 0
Abstract translation:公开了可用于太阳能电池或作为热电材料的新型化合物半导体及其应用。 化合物半导体可以由化学式:In x Co 4 Sb 12-z S z 3表示,其中0
Abstract:
A structure and method for cooling a three-dimensional integrated circuit (3DIC) are provided. A cooling element is configured for thermal connection to the 3DIC. The cooling element includes a plurality of individually controllable cooling modules disposed at a first plurality of locations relative to the 3DIC. Each of the cooling modules includes a cold pole and a heat sink. The cold pole is configured to absorb heat from the 3DIC. The heat sink is configured to dissipate the heat absorbed by the cold pole and is coupled to the cold pole via an N-type semiconductor element and via a P-type semiconductor element. A temperature sensing element includes a plurality of thermal monitoring elements disposed at a second plurality of locations relative to the 3DIC for measuring temperatures at the second plurality of locations. The measured temperatures control the plurality of cooling modules.
Abstract:
The present invention relates to a thermoelement for use in thermoelectric energy converters for power generation as well as cooling applications. The thermoelement includes a thermoelectric layer with a first side and a second side. Further, the thermoelement includes a first high power factor electrode and a second high power factor electrode. The first high power factor electrode is thermally and electrically attached to the first side of the thermoelectric layer and the second high power factor electrode is thermally and electrically attached to the second side of the thermoelectric layer. Furthermore, the thermoelement includes a plurality of metal layers. The plurality of metal layers are attached to the first high power factor electrode and the second high power factor electrode. In an embodiment of the present invention, a thermoelement comprises a plurality of micro thermoelements that are configured to reduce thermal density at the electrodes. In an embodiment of the present disclosure, the thermoelectric layer is hemispherical in shape, wherein the hemispherical thermoelectric layer is deposited in an etched metal layer.
Abstract:
A thermoelectric semiconductor includes a matrix element that forms a matrix, and a dopant element having an atomic radius that is at least 1.09 times as large as the atomic radius of the matrix element.
Abstract:
Thermoelectric materials with high figures of merit, ZT values, are disclosed. In many instances, such materials include nano-sized domains (e.g., nanocrystalline), which are hypothesized to help increase the ZT value of the material (e.g., by increasing phonon scattering due to interfaces at grain boundaries or grain/inclusion boundaries). The ZT value of such materials can be greater than about 1, 1.2, 1.4, 1.5, 1.8, 2 and even higher. Such materials can be manufactured from a thermoelectric starting material by generating nanoparticles therefrom, or mechanically alloyed nanoparticles from elements which can be subsequently consolidated (e.g., via direct current induced hot press) into a new bulk material. Non-limiting examples of starting materials include bismuth, lead, and/or silicon-based materials, which can be alloyed, elemental, and/or doped. Various compositions and methods relating to aspects of nanostructured thermoelectric materials (e.g., modulation doping) are further disclosed.
Abstract:
In accordance with one embodiment of the present disclosure, a thermoelectric device includes a plurality of thermoelectric elements that each include a diffusion barrier. The diffusion barrier includes a refractory metal. The thermoelectric device also includes a plurality of conductors coupled to the plurality of thermoelectric elements. The plurality of conductors include aluminum. In addition, the thermoelectric device includes at least one plate coupled to the plurality of thermoelectric elements using a braze. The braze includes aluminum.
Abstract:
A thermoelectric conversion material is provided, in which only a desired crystal is selectively precipitated. An MxV2O5 crystal is selectively precipitated in vanadium-based glass, wherein M is one metal element selected from the group consisting of iron, arsenic, antimony, bismuth, tungsten, molybdenum, manganese, nickel, copper, silver, an alkali metal and an alkaline earth metal, and 0
Abstract translation:提供了仅选择性沉淀所需晶体的热电转换材料。 在钒基玻璃中选择性地析出M x V 2 O 5晶体,其中M是选自铁,砷,锑,铋,钨,钼,锰,镍,铜,银,碱金属和碱中的一种金属元素 地球金属,0
Abstract:
Compound semiconductors, expressed by the following formula: Bi1-xMxCuwOa-yQ1yTeb-zQ2z. Here, M is at least one element selected from the group consisting of Ba, Sr, Ca, Mg, Cs, K, Na, Cd, Hg, Sn, Pb, Eu, Sm, Mn, Ga, In, Tl, As and Sb; Q1 and Q2 are at least one element selected from the group consisting of S, Se, As and Sb; x, y, z, w, a, and b are 0≦x
Abstract translation:化合物半导体,由下式表示:Bi1-xMxCuwOa-yQ1yTeb-zQ2z。 这里,M是选自Ba,Sr,Ca,Mg,Cs,K,Na,Cd,Hg,Sn,Pb,Eu,Sm,Mn,Ga,In,Tl,As和 锑 Q1和Q2是选自S,Se,As和Sb中的至少一种元素; x,y,z,w,a和b分别为0&nlE; x <1,0,0