摘要:
Lightweight semiconductor devices are fabricated upon a relatively thin substrate member by a process wherein the substrate is first bonded to a relatively thick support member. The semiconductor device is then formed on the bonded substrate, and the substrate is subsequently removed from the support member by utilizing a beam of radiant energy to skive the substrate from the support member without damage to the semiconductor device. Also disclosed herein is a system for implementing the invention.
摘要:
A base metal repair tape includes a first layer formed braze alloy bonded together with fibrillated polytetrafluoroethylene, a second layer formed from powdered base metal comprising oxygen-sensitive superalloy bonded together by fibrillated polytetrafluoroethylene and a third layer comprising a brazing alloy bonded together by fibrillated polytetrafluoroethylene. This is used to repair base metal by placing the first layer on the base metal and brazing the base metal powder so that the brazing alloy melts and diffuses into the base metal powder bonding it to the surface of the article. This permits the braze powder to be bonded to the base metal surface with minimal distance between the base powder particles. The number of alternating layers of base metal and braze alloy can be increased to increase the thickness of the repair. This can also be used to form small intricate parts.
摘要:
A method to remove during fabrication of a flexible electrostatographic imaging member, the curl from a curled layered member having a top surface and a bottom surface and comprised of a substrate and a thickest coated layer including: (a) heating a section of the curled layered member to at least the glass transition temperature of the thickest coated layer, thereby defining a heated layered member section containing a thickest coated layer section and a substrate section; (b) compressing the top surface and the bottom surface of the heated layered member section to expand the thickest coated layer section beyond the dimensions of the substrate section; and (c) cooling the heated layered member section such that the expanded thickest coated layer section shrinks to about the dimensions of the substrate section.
摘要:
Composite films and film laminates comprising at least one elastomeric core and a surrounding nonelastomeric matrix preferably prepared by coextrusion. The film when stretched and allowed to recover will create an elastomeric composite.
摘要:
A method of fabricating optical waveguides includes providing first, second and third layers of material, with the second layer being clear and the first and third layers having an index of refraction at least 0.01 lower than the second layer. A laminate of the layers of material is formed with the second layer sandwiched between the first and third layers and the laminate is heated until plastic and pressed together at spaced apart locations to form the second layer into at least one optical waveguide core with the first and third layers forming cladding layers therearound.
摘要:
A seal for connecting abutting first and second elastomeric sheets having overlying metallic portions including an elastomeric strip. The elastomeric strip is bonded to the elastomeric portions of the first and second sheets. An electrically conductive filler is attached to the metallic portions of the abutting sheets. A metallic layer is then plated to the conductive filler. A layer of flexible and abrasion resistant material adheres to the metallic plate and the metallic portions of the abutting sheets.
摘要:
A corrugated plastic slip pallet is provided and comprises an intermediate corrugated member sandwiched between two generally planar sheet-like panel members and having a flat body portion on which boxes are supported and three lip portions hingedly connected to edges of the flat body portion and forming an included angle therewith of between about 135 and 160 degrees and wherein the hinge connection comprises two spaced apart welded portions extending parallel to an associated edge of the flat body portion and wherein the portions of the intermediate corrugated member and the two generally planar sheet-like panel members between the two spaced apart welded portions are not welded together. The flat body portion has a generally planar bottom surface and the hinge connection has a portion thereof located below the generally planar bottom surface so that when an unloaded plastic slip pallet is supported by a planar support surface, a major portion of the bottom surface is spaced from the support surface so that when the boxes are loaded onto the flat body portion, the major portion will be moved into contact with the support surface and move the lip portion to decrease the included angle between the lip portions and the flat body portion. Also provided is apparatus for forming a plurality of corrugated plastic board-like members into corrugated plastic slip pallets using an ultrasonic welding apparatus.
摘要:
A seal for connecting abutting first and second elastomeric sheets having overlying metallic portions including an elastomeric strip. The elastomeric strip is bonded to the elastomeric portions of the first and second sheets. A metallic plug is attached to the metallic portion of the abutting sheets and is itself covered by a layer of flexible and abrasion resistant material which adheres to the metallic plug and the metallic portions of the abutting sheets.
摘要:
A packaging material including one or more expandable layers that provide protection to contents of a packaging enclosure formed with the packaging material. The packaging material includes at least a first layer and a second layer bonded to one another. The first layer is pulled or extended in a first direction that is effective to cause the second layer to expand in a second direction. The second layer is a cut-patterned layer which increases in thickness and provides structural strength to the packaging material when expanded.
摘要:
An applicator repair system for an additive manufacturing (AM) system, and an AM system including the same are disclosed. The applicator repair system includes a repair device including a repair element configured to repair a damaged applicator element on an applicator of an AM system. The damaged applicator element is configured to distribute a layer of raw material on a build platform of the AM system. The repair device is positioned within a processing chamber of the AM system. A damaged applicator controller may be provided that is configured to cause repair of the damaged active applicator in response to the damaged applicator being identified as damaged.