公开(公告)号：US20170232558A1

公开(公告)日：2017-08-17

申请号：US15515464

申请日：2014-10-17

申请人： Mitsubishi Electric Corporation

发明人： Junji KANO

IPC分类号： B23K26/38 ,  B23K26/00 ,  B23K26/382 ,  B23K26/064 ,  B23K26/14 ,  B23K26/042 ,  B23K26/06

CPC分类号： B23K26/38 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/042 ,  B23K26/048 ,  B23K26/064 ,  B23K26/0665 ,  B23K26/0861 ,  B23K26/14 ,  B23K26/142 ,  B23K26/18 ,  B23K26/382 ,  B23K26/384 ,  B23K26/55

摘要： A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.

公开(公告)号：US20170214213A1

公开(公告)日：2017-07-27

申请号：US14099948

申请日：2013-12-07

申请人： Mark S. Zediker ,  Brian O. Faircloth ,  Charles C. Rinzler

发明人： Mark S. Zediker ,  Brian O. Faircloth ,  Charles C. Rinzler

IPC分类号： H01S3/30 ,  H01S3/067 ,  H01S3/0941 ,  H01S3/16 ,  E21B43/24 ,  E21B29/02 ,  E21B7/15 ,  E21B29/06 ,  E21B43/11 ,  H01S3/094 ,  H01S3/109

CPC分类号： H01S3/302 ,  B23K26/06 ,  B23K26/38 ,  B23K26/382 ,  E21B7/14 ,  E21B7/15 ,  E21B29/02 ,  E21B29/06 ,  E21B43/11 ,  E21B43/2405 ,  H01S3/06708 ,  H01S3/0675 ,  H01S3/094007 ,  H01S3/094015 ,  H01S3/094042 ,  H01S3/094046 ,  H01S3/094092 ,  H01S3/094096 ,  H01S3/09415 ,  H01S3/109 ,  H01S3/1603 ,  H01S3/1616 ,  H01S3/1693 ,  H01S3/1695 ,  H01S3/2383

摘要： High power lasers and high power laser systems that provide high power laser beams having preselected wavelengths and characteristics to optimize or enhance laser beam performance in predetermined environments, conditions and use requirements. In particular, lasers, methods and systems that relate to, among other things, Raman lasers, up conversion lasers, wavelength conversion laser systems, and multi-laser systems that are configured to match and create specific and predetermined wavelengths at specific points along an optical path having varying requirements along that path.

公开(公告)号：US20170182597A1

公开(公告)日：2017-06-29

申请号：US15389244

申请日：2016-12-22

申请人： Universität Stuttgart

发明人： MARWAN ABDOU-AHMED ,  RUDOLF WEBER ,  VOLKHER ONUSEIT

IPC分类号： B23K26/388 ,  G02B27/42 ,  B23K26/067

CPC分类号： B23K26/388 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0676 ,  B23K26/082 ,  B23K26/382 ,  B23K26/389 ,  G02B5/1814 ,  G02B5/1861 ,  G02B5/1871 ,  G02B27/4233

摘要： The invention relates to a drilling device comprising a light source configured to provide a light beam and a diffractive beam propagation device having a substantially planar surface, wherein the light source is configured such that the light beam is incident on the planar surface of the diffractive beam propagation device, and wherein the diffractive beam propagation device is configured to propagate the light beam as one or more propagated beams such that the one or more propagated beams, at least when being integrated over time, surround an area with a substantially circular shape. A use of the drilling device for drilling a hole in a work piece and a method suitable for drilling a hole in a work piece are also provided.

公开(公告)号：US20170157711A1

公开(公告)日：2017-06-08

申请号：US15441560

申请日：2017-02-24

申请人： TRUMPF Werkzeugmaschinen GmbH + Co. KG

发明人： Martin Spiess ,  Dieter Hallasch ,  Daniel Knorreck ,  Markus Blaschka

IPC分类号： B23K26/382 ,  B23K26/10 ,  B23K26/08 ,  B23K26/03 ,  B23K26/04

CPC分类号： B23K26/382 ,  B23K26/03 ,  B23K26/048 ,  B23K26/0884 ,  B23K26/10 ,  B23K26/38 ,  B23K2103/04

摘要： This disclosure relates to methods and apparatuses for piercing workpieces at a piercing point using a laser beam, which exits from a laser processing nozzle with a process gas, whereby a bulge is formed on the workpiece surface around the piercing point during the piercing. A distance between the laser processing nozzle and the bulge is determined during the piercing and at least one piercing parameter is changed in dependence on the distance determined.

公开(公告)号：US20170120390A1

公开(公告)日：2017-05-04

申请号：US15337513

申请日：2016-10-28

申请人： Laser Systems Inc. ,  NICHIA CORPORATION

发明人： Kock Khuen SEET ,  Masayuki HAYASHIDA ,  Masakazu SAKAMOTO ,  Hiroto TAMAKI

IPC分类号： B23K26/382 ,  B23K26/0622 ,  B23K26/402 ,  B23K26/082

CPC分类号： B23K26/382 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/18 ,  B23K26/402 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/42 ,  H05K3/0035 ,  H05K2201/09127 ,  H05K2203/0554

摘要： A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.

公开(公告)号：US20170008129A1

公开(公告)日：2017-01-12

申请号：US15276627

申请日：2016-09-26

申请人： Micron Technology, Inc.

发明人： Charles M. Watkins ,  William M. Hiatt

IPC分类号： B23K26/382 ,  H01L21/768 ,  H05K3/00 ,  H01L21/48 ,  B23K26/03 ,  B23K26/362

CPC分类号： B23K26/382 ,  B23K26/03 ,  B23K26/0342 ,  B23K26/361 ,  B23K26/362 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/486 ,  H01L21/76898 ,  H05K3/0026 ,  H05K2203/163 ,  Y10T29/49165

摘要： Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.

摘要翻译： 本文公开了用于在微特征工件中形成孔的系统和方法。 在一个实施例中，一种方法包括将激光束引向微特征工件以形成孔径并且感测激光束实时地通过微特征工件。 该方法还可以包括确定激光束的脉冲数量和/或经过的时间以形成孔径并且基于所确定的脉冲数量和/或确定的经过时间来控制激光束以形成第二孔径 微特工件。

公开(公告)号：US20160374206A1

公开(公告)日：2016-12-22

申请号：US14742070

申请日：2015-06-17

申请人： KINSUS INTERCONNECT TECHNOLOGY CORP.

发明人： Jaen-Don Lan ,  PIN-CHUNG LIN ,  CHEN-RUI TSENG ,  CHENG-EN HO ,  YU-AN CHEN

IPC分类号： H05K3/00 ,  B23K26/402 ,  H05K3/16 ,  B23K26/386

CPC分类号： B23K26/402 ,  B23K26/382 ,  B23K26/389 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0341

摘要： Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 μm for fine line width/pitch.

摘要翻译： 公开了一种制造电路板的方法，包括制备具有树脂层和停止层的基板，形成穿过树脂层的至少一个导电孔并在停止层处停止，通过溅射工艺形成第一金属层， 通过化学镀工艺在第一金属层上形成第二金属层，形成具有电路图案的第三金属层，暴露第二金属层的一部分并通过电镀工艺填充导电孔，并蚀刻第二金属层 以及第二金属层下面的第一金属层，以暴露第一金属层下的树脂层。 由于第一金属层提供优异的表面性质，所以第二和第三金属层是良好固定和稳定的。 蚀刻电路图案对于细线宽/间距具有小于10μm的线宽/间距。

公开(公告)号：US20160293784A1

公开(公告)日：2016-10-06

申请号：US15036227

申请日：2014-11-18

申请人： VISMUNDA SRL

发明人： Davide SPOTTI ,  Elisa BACCINI

IPC分类号： H01L31/0224 ,  B29C65/48 ,  B23K26/142 ,  H01L31/18 ,  B23K26/382

CPC分类号： H01L31/022441 ,  B23K26/142 ,  B23K26/382 ,  B29C65/48 ,  B29L2031/34 ,  B32B37/0053 ,  B32B37/223 ,  B32B38/0004 ,  B32B38/04 ,  B32B2038/047 ,  B32B2310/0843 ,  B32B2457/12 ,  H01L31/049 ,  H01L31/18 ,  Y02E10/50

摘要： Composite operating station and method of drilling and fixing for the continuous production of conductive backsheets with an integrated encapsulating and dielectric layer, for photovoltaic panels of the back-contact type. The composite operating station is automated and integrates a plurality of working processes carried out simultaneously in a cyclic sequence. In particular, it is based on a multifunction cylindrical roller which by rotating lays out the film of integrated encapsulating and dielectric material, heats it and presses it on the conductive layer of the supporting backsheet for the purpose of the fixing in a correct position, the roller being provided with openings to enable drilling from outside with a laser device and also to enable the forced suction from inside of the fumes and of the residues by means of an exhaust fan.

摘要翻译： 用于连续生产具有集成封装和介电层的导电底片的复合操作台和钻孔和固定方法，用于背接触型光伏面板。 复合操作站是自动化的，并且以循环序列同时进行多个工作处理。 特别地，它是基于多功能圆柱滚子，其通过旋转布置整合的包封和电介质材料的膜，将其加热并将其按压在支撑底片的导电层上，以便固定在正确的位置， 滚筒设置有开口以能够利用激光装置从外部进行钻孔，并且还能够通过排风扇从烟气和残余物的内部强制抽吸。

公开(公告)号：US09451693B2

公开(公告)日：2016-09-20

申请号：US13198756

申请日：2011-08-05

申请人： Rabindra N. Das ,  Voya R. Markovich ,  John M. Lauffer ,  Roy H. Magnuson ,  Konstantinos I. Papathomas ,  Benson Chan

发明人： Rabindra N. Das ,  Voya R. Markovich ,  John M. Lauffer ,  Roy H. Magnuson ,  Konstantinos I. Papathomas ,  Benson Chan

IPC分类号： H05K1/11 ,  H05K1/03

CPC分类号： H05K1/0313 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/52 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/097 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0257 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00

摘要： A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.

摘要翻译： 用于连接多级Z轴互连的多层导电粘合剂（ECA）混合物和形成连接多级Z轴互连的ECA的方法。 具有多层能力的ECA包含允许糊料适应特定要求的组成成分的混合物，其中制造电路化衬底组件的方法，其中具有潜在不同的热膨胀系数（CTE）的两个或更多个子组件对齐，并且Z- 在连接期间创建轴互连。 导体的冶金和多层导电浆料的冶金被有效地混合，并且在配合子组件之间使用的可流动的中间电介质流动以接合和围绕导体耦合。

公开(公告)号：US20160243654A1

公开(公告)日：2016-08-25

申请号：US14626955

申请日：2015-02-20

申请人： General Electric Company

发明人： Zhaoli Hu ,  Abe Denis Darling ,  Shamgar Elijah McDowell ,  Douglas Anthony Serieno ,  Jonathan Matthew Lomas

IPC分类号： B23K26/382 ,  B23K26/042 ,  B23K26/03

CPC分类号： B23K26/382 ,  B23K26/032 ,  B23K26/042 ,  B23K26/0876 ,  B23K26/14 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/001 ,  F01D5/005 ,  F01D5/147 ,  F05D2230/13 ,  Y02T50/673

摘要： A method for repairing one or more holes in a near wall of a component is provided. The method includes determining updated hole information, including an updated location, of a first hole in the near wall of the component. The method also includes directing a confined laser beam of the confined laser drill towards the near wall of the component at the updated location of the first hole to drill through a coating of the component extending over and/or positioned in the first hole. The method also includes sensing a characteristic of light reflected from the updated location of the first hole and determining the confined laser beam of the confined laser drill has drilled through a portion of the coating of the component extending over and/or positioned in the first hole based on the sensed characteristic of light.