公开(公告)号：US06655547B2

公开(公告)日：2003-12-02

申请号：US09924844

申请日：2001-08-09

申请人： Koji Saito ,  Taro Yasuda ,  Hiroyuki Matsui

发明人： Koji Saito ,  Taro Yasuda ,  Hiroyuki Matsui

IPC分类号： B65G4724

CPC分类号： H05K13/028

摘要： A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.

公开(公告)号：US06290095B1

公开(公告)日：2001-09-18

申请号：US09571264

申请日：2000-05-15

申请人： Koji Saito ,  Taro Yasuda ,  Hiroyuki Matsui

发明人： Koji Saito ,  Taro Yasuda ,  Hiroyuki Matsui

IPC分类号： B65H500

CPC分类号： H05K13/028

摘要： A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.

公开(公告)号：US06028076A

公开(公告)日：2000-02-22

申请号：US29076

申请日：1998-03-03

申请人： Kohsaku Hirota ,  Yoshiaki Isobe ,  Nobuyoshi Chiba ,  Harumi Satoh ,  Haruo Takaku ,  Hiroyuki Matsui ,  Haruhisa Ogita

发明人： Kohsaku Hirota ,  Yoshiaki Isobe ,  Nobuyoshi Chiba ,  Harumi Satoh ,  Haruo Takaku ,  Hiroyuki Matsui ,  Haruhisa Ogita

IPC分类号： C07D473/00 ,  C07D473/30 ,  C07D473/34 ,  A61K31/52 ,  C07D473/38

CPC分类号： C07D473/00 ,  C07D473/30 ,  C07D473/34

摘要： This invention relates to novel purine derivatives of formula (I): ##STR1## where R.sup.2 and R.sup.9 are hydrocarbon groups, R.sup.6 is an amino group and R.sup.8 is a hydroxyl, or acyloxy group. These purine derivatives are effective at promoting secretion of interferon in patients, and can be used to treat diseases against which interferon is effective.

摘要翻译： PCT No.PCT / JP97 / 02310 Sec。 371日期1998年3月3日 102（e）1998年3月3日PCT PCT 1997年7月3日PCT公布。 出版物WO98 / 01448 日本1998年1月15日本发明涉及式（I）的新型嘌呤衍生物：其中R2和R9为烃基，R6为氨基，R8为羟基或酰氧基。 这些嘌呤衍生物有效促进患者的干扰素分泌，并可用于治疗干扰素有效的疾病。

公开(公告)号：US5933506A

公开(公告)日：1999-08-03

申请号：US441988

申请日：1995-05-16

申请人： Shigeaki Aoki ,  Kazumasa Mitsuhashi ,  Yutaka Nishino ,  Kohichi Matsumoto ,  Chikara Yuse ,  Hiroyuki Matsui

发明人： Shigeaki Aoki ,  Kazumasa Mitsuhashi ,  Yutaka Nishino ,  Kohichi Matsumoto ,  Chikara Yuse ,  Hiroyuki Matsui

IPC分类号： H04R1/46 ,  H04R3/00 ,  H04R25/00

CPC分类号： H04R1/46 ,  H04R3/005 ,  H04R2460/13

摘要： Ear-piece type acoustic transducing part is provided with a bone-conducted sound pickup microphone for picking up a bone-conducted sound, a directional microphone for picking up an air-conducted sound and an electro-acoustic transducer for transducing a received speech signal to a received speech sound. A transmitting-receiving circuit connected to the acoustic transducing part includes: a low-pass filter which permits the passage therethrough of low-frequency components in a bone-conducted sound signal from the bone-conducted sound pickup microphone; a high-pass filter which permits the passage therethrough of high-frequency components in an air-conducted sound signal from the directional microphone; first and second variable loss circuits which impart losses to the outputs from the low-pass filter and the high-pass filter, respectively; a comparison/control circuit which compares the output levels of the low-pass filter and the high-pass filter with predetermined first and second reference levels, respectively, and based on the results of comparison, controls losses that are set in the first and second variable loss circuits; and a combining circuit which combines the outputs from the first and second variable loss circuits into a speech sending signal.

摘要翻译： 耳机式声学传感部件设置有用于拾取骨传导声音的骨传导拾音麦克风，用于拾取空气传导声音的定向麦克风和用于将接收到的语音信号转换的电声换能器 接收到的语音 连接到声学传感部分的发射接收电路包括：低通滤波器，其允许来自骨导声音传声器的骨传导声音信号中的低频分量的通过; 高通滤波器，其允许来自定向麦克风的空气传导声音信号中的高频分量的通过; 分别对来自低通滤波器和高通滤波器的输出赋予损耗的第一和第二可变损耗电路; 比较/控制电路，其分别将低通滤波器和高通滤波器的输出电平与预定的第一和第二参考电平进行比较，并且基于比较结果，控制在第一和第二参考电平中设置的损耗 可变损耗电路; 以及将来自第一和第二可变损耗电路的输出组合成语音发送信号的组合电路。

公开(公告)号：US5127330A

公开(公告)日：1992-07-07

申请号：US539333

申请日：1990-06-18

申请人： Satoshi Okazaki ,  Hiroyuki Matsui ,  Satoshi Takeuchi

发明人： Satoshi Okazaki ,  Hiroyuki Matsui ,  Satoshi Takeuchi

IPC分类号： B41M1/00 ,  B41M1/06 ,  B41M1/10 ,  H05K3/00

CPC分类号： B41M1/00 ,  B41M1/06 ,  B41M1/10 ,  H05K3/0079 ,  H05K2203/0537

摘要： For printing fine patterns, a fine pattern of a setting type ink is applied to a printing plate surface to become printing elements. Then, the setting type ink thus applied on the printing plate is subjected to a setting treatment thereby to set at least one part of the ink pattern, and thereafter the printing plate and an object to be printed are pressed relatively against each other thereby to transfer the ink pattern onto the print object. The printing plate can be an intaglio plate or a lithographic plate. Fine patterns of printing element widths as fine as 3 .mu.m with an ink film thickness of 2 .mu.m can be printed efficiently with the high precision on various objects including hard and rigid objects.

公开(公告)号：US09059407B2

公开(公告)日：2015-06-16

申请号：US13816999

申请日：2011-08-10

申请人： Tatsuo Hasegawa ,  Hiromi Minemawari ,  Toshikazu Yamada ,  Hiroyuki Matsui

发明人： Tatsuo Hasegawa ,  Hiromi Minemawari ,  Toshikazu Yamada ,  Hiroyuki Matsui

IPC分类号： H01L51/40 ,  H01L51/00 ,  C09D11/322 ,  C09D11/52

CPC分类号： H01L51/0002 ,  C09D11/322 ,  C09D11/52 ,  H01L51/0005 ,  H01L51/0007 ,  H01L51/0094

摘要： A method for manufacturing a uniform organic semiconductor thin film consisting of single organic molecule with extremely few pinholes and of which both quality and thickness are uniform when the organic semiconductor thin film is manufactured by printing process. The uniform organic semiconductor thin film is manufactured by steps of: preparing a first ink obtained by dissolving a high concentration of the organic semiconductor in an organic solvent with high affinity for the organic semiconductor, and a second ink consisting of an organic solvent having a low affinity for the organic semiconductor; mixing the first and second inks on a substrate by simultaneously or alternately discharging the first and second inks from each ink head.

摘要翻译： 一种制造均匀的有机半导体薄膜的方法，所述均匀的有机半导体薄膜由具有极少针孔的单一有机分子组成，并且当通过印刷方法制造有机半导体薄膜时，质量和厚度均匀。 均匀的有机半导体薄膜是通过以下步骤制造的：制备通过将有机半导体的高浓度溶解在有机半导体中具有高亲和力的有机溶剂中获得的第一种油墨和由有机半导体的有机溶剂组成的第二种油墨 对有机半导体的亲和力; 通过从每个墨头同时或交替地排放第一和第二墨水将第一和第二墨水混合在基底上。

公开(公告)号：US07321066B2

公开(公告)日：2008-01-22

申请号：US10544764

申请日：2004-01-28

申请人： Hisayuki Kawamura ,  Hiroyuki Matsui ,  Koji Hirota

发明人： Hisayuki Kawamura ,  Hiroyuki Matsui ,  Koji Hirota

IPC分类号： C07C209/00 ,  C07C209/12

CPC分类号： C07C209/62 ,  C07C211/54

摘要： The invention provides a method for efficiently producing an aromatic diamine derivative represented by formula (3) at high yield, the method including reacting an aromatic amide represented by formula (1) with an aromatic halide represented by formula (2): (wherein each of Ar, Ar1 and Ar2 represents a substituted or unsubstituted aryl group or heteroaryl group; Ar3 represents a substituted or unsubstituted arylene group or heteroarylene group; and X represents a halogen atom).

摘要翻译： 本发明提供一种以高收率有效地制备式（3）表示的芳族二胺衍生物的方法，该方法包括使由式（1）表示的芳族酰胺与式（2）表示的芳族卤化物反应： Ar，Ar 1和Ar 2表示取代或未取代的芳基或杂芳基; Ar 3表示取代或未取代的亚芳基或亚杂芳基 基团; X表示卤素原子）。

公开(公告)号：US06470082B1

公开(公告)日：2002-10-22

申请号：US09711086

申请日：2000-11-14

申请人： Ryozo Nunokawa ,  Hiroyuki Matsui ,  Satoru Abe ,  Yutaka Nishino

发明人： Ryozo Nunokawa ,  Hiroyuki Matsui ,  Satoru Abe ,  Yutaka Nishino

IPC分类号： H04M342

CPC分类号： H04M3/42255 ,  H04M3/53383 ,  H04M3/54

摘要： By using an external portable recording medium (for instance, IC card) that stores a personal ID, a communications apparatus automatically transmits the personal ID and its own terminal identification information to a center apparatus. The center apparatus manages the personal ID and the terminal identification information so that they are correlated with each other. For example, the terminal identification information includes a called-party address, a communication mode, and a position ID. Further, the center apparatus manages a present/absent mode for each personal ID. During the present mode, the center apparatus forwards a call using a personal telecommunication number, such as a UPT (universal personal telecommunication) number, which corresponds to a certain personal ID to a communications apparatus that corresponds to the personal ID. During the absent mode, the center apparatus automatically records a message. Further, the communications apparatus reads a card ID, which may be composed of a personal ID, a personal telecommunication number, etc., from the IC card, and compares it with a card ID that is stored in a card ID storing section. If they are identical, the communications apparatus judges that the IC card is not a new one and skips a center authentication operation. If they are not identical, the communications apparatus judges that the IC card is a new one and effects the center authentication operation.

摘要翻译： 通过使用存储个人ID的外部便携式记录介质（例如，IC卡），通信装置将个人ID及其自己的终端识别信息自动发送到中心设备。 中心设备管理个人ID和终端识别信息，使得它们彼此相关。 例如，终端识别信息包括被叫方地址，通信模式和位置​​ID。 此外，中心设备管理每个个人ID的当前/不存在模式。 在本模式中，中心设备使用与个人ID对应的通信装置的个人电话号码（例如与特定个人ID相对应的UPT（通用个人电信）号码）转接呼叫。 在缺席模式下，中心设备自动记录消息。 此外，通信装置从IC卡读取可以由个人ID，个人电信号等构成的卡ID，并将其与存储在卡ID存储部中的卡ID进行比较。 如果它们相同，则通信装置判断IC卡不是新的，并且跳过中心认证操作。 如果它们不相同，则通信装置判断IC卡是新卡，并进行中心认证操作。

公开(公告)号：US06344407B1

公开(公告)日：2002-02-05

申请号：US09691075

申请日：2000-10-19

申请人： Hirohisa Matsuki ,  Fumihiko Taniguchi ,  Kunio Kodama ,  Eiji Watanabe ,  Masataka Mizukoshi ,  Hiroyuki Matsui

发明人： Hirohisa Matsuki ,  Fumihiko Taniguchi ,  Kunio Kodama ,  Eiji Watanabe ,  Masataka Mizukoshi ,  Hiroyuki Matsui

IPC分类号： B23K3522

CPC分类号： B23K35/38 ,  B23K35/262 ,  B23K35/268 ,  B23K35/3618 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K3/3489 ,  H01L2924/00 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/05166

摘要： A semiconductor device manufacturing method comprises the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing formic acid to form the solder bumps. Accordingly, the solder bumps can be formed without flux generating voids in the solder layer. Furthermore, the cleaning required after the solder bumps are formed can be omitted.

摘要翻译： 半导体器件制造方法包括以下步骤：在半导体器件的下面的金属膜上形成焊料凸块，并将半导体器件和焊料层放置在含有甲酸的减压气氛中以形成焊料凸块。 因此，可以在焊料层中形成焊剂凸块而没有焊剂产生空隙。 此外，可以省略在形成焊料凸块之后所需的清洁。

公开(公告)号：US6006789A

公开(公告)日：1999-12-28

申请号：US776664

申请日：1997-01-31

申请人： Takaaki Toyooka ,  Akira Yorifuji ,  Motoaki Itadani ,  Toshio Ohnishi ,  Yuji Hashimoto ,  Nobuki Tanaka ,  Hiroyuki Matsui

发明人： Takaaki Toyooka ,  Akira Yorifuji ,  Motoaki Itadani ,  Toshio Ohnishi ,  Yuji Hashimoto ,  Nobuki Tanaka ,  Hiroyuki Matsui

IPC分类号： B21B17/14 ,  B21B37/00 ,  B21B37/74 ,  B21B37/78 ,  B21B45/00 ,  B21B45/02 ,  B21C37/06 ,  B21C37/08 ,  B21C37/30 ,  C21D8/10 ,  C21D9/08 ,  F16L9/00 ,  B23K17/14

CPC分类号： C21D8/10 ,  B21B37/74 ,  B21C37/08 ,  B21C37/0807 ,  B21C37/30 ,  B21B17/14 ,  B21B2045/0227 ,  B21B37/78 ,  B21B45/004

摘要： A steel mother pipe obtained by a solid phase butt-welding pipe-making process or a welding pipe-making process is reduced by heating the pipe prior to the reduction at a temperature exceeding 100.degree. C. and lower than 800.degree. C. wherein the temperature of the steel pipe being reduced is controlled within a defined range. The temperature difference along the circumferential direction of the mother pipe at the inlet side of a reducer is within a defined range, and the temperature of the steel pipe at interstand positions of the reducer is also controlled. By virtue of this control, the reduction becomes possible at low load while suppressing work hardening without degrading surface properties. The resultant product pipe has a dimensional accuracy maintained at a high level.

摘要翻译： PCT No.PCT / JP96 / 02334 Sec。 371日期1997年1月31日 102（e）日期1997年1月31日PCT PCT 1996年8月21日PCT公布。 公开号WO97 / 07906 日期1997年3月6日通过在超过100℃且低于800℃的温度下通过加热管道，通过固相对接制管工艺或焊接制管工艺获得的钢母管被减少 ℃，其中钢管的温度降低控制在规定的范围内。 在减速机的入口侧的母管的周向的温差在规定的范围内，也可以控制还原器的夹板位置处的钢管的温度。 通过该控制，能够在低负荷的同时抑制加工硬化而不会降低表面性能。 所得产品管具有维持在高水平的尺寸精度。