公开(公告)号：US5606376A

公开(公告)日：1997-02-25

申请号：US460795

申请日：1995-06-02

申请人： Toshiaki Shinohara

发明人： Toshiaki Shinohara

IPC分类号： H04N19/50 ,  G06T7/20 ,  H04N19/105 ,  H04N19/109 ,  H04N19/136 ,  H04N19/196 ,  H04N19/423 ,  H04N19/51 ,  H04N19/59 ,  H04N19/80 ,  H04N19/85 ,  H04N5/272 ,  H04N1/41

CPC分类号： G06T7/2053

摘要： A differential/absolute value image is derived by calculating an absolute value of each pixel in an image produced by subtracting a background image from an input image. A mean value and a variance of a pixel in the differential/absolute value image are calculated from the levels of pixels included in a small region on the differential/absolute value image which has the pixel located at the center thereof. The calculated mean value and variance of the pixel are used to distinguish whether the pixel is a pixel included in a moving object existing region, a background region, or an input image sudden change region. A method of updating the background image is changed in accordance with whether the pixel is a pixel included in the moving object existing region, the background region, or the input image sudden change region.

摘要翻译： 通过计算通过从输入图像中减去背景图像而产生的图像中的每个像素的绝对值，导出差分/绝对值图像。 从包含在具有位于其中心的像素的差分/绝对值图像的小区域中的像素的电平计算差分/绝对值图像中的像素的平均值和方差。 使用所计算的像素的平均值和方差来区分像素是否包括在移动物体存在区域，背景区域或输入图像突变区域中的像素。 根据该像素是否包括在移动物体存在区域，背景区域或输入图像突变区域中的像素，来改变背景图像的更新方法。

公开(公告)号：US4942455A

公开(公告)日：1990-07-17

申请号：US108907

申请日：1987-10-13

申请人： Toshiaki Shinohara

发明人： Toshiaki Shinohara

IPC分类号： H01L23/50 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L21/565 ,  H01L23/49582 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48611 ,  H01L2224/48639 ,  H01L2224/49171 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49121

摘要： A lead frame for a semiconductor device and a method for manufacturing the semiconductor device using the frame, the lead frame comprising a dice pad, inner leads, tie bar, outer leads and a thin metal layer of lead which is hard to melt and is easily transformed formed on the surface of that portion of the inner leads, outer leads and the tie bar which is not covered with the sealing resin. In injection molding of a resin material on the lead frame with a semiconductor chip therein, the gap between the lead frame and the mold is filled while the thin metal layer is transformed by the clamping pressure, so that the bur may be prevented from being generated.

摘要翻译： 用于半导体器件的引线框架和使用该框架的半导体器件的制造方法，引线框架包括骰子垫，内部引线，连接条，外部引线和难以熔化并且容易的铅的薄金属层 在未被密封树脂​​覆盖的内引线，外引线和连杆的部分的表面上形成。 在其中具有半导体芯片的引线框架上注塑树脂材料时，在通过夹紧压力使薄金属层变形的同时填充引线框架和模具之间的间隙，从而可以防止产生毛刺 。

公开(公告)号：US20130009298A1

公开(公告)日：2013-01-10

申请号：US13365409

申请日：2012-02-03

申请人： Tatsuo OTA ,  Toshiaki Shinohara

发明人： Tatsuo OTA ,  Toshiaki Shinohara

IPC分类号： H01L23/495 ,  B82Y99/00

CPC分类号： H01L23/4952 ,  H01L23/24 ,  H01L23/3135 ,  H01L23/3735 ,  H01L23/4334 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2924/01029 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor module includes: an insulating plate; a plurality of metal patterns formed on the insulating plate and spaced apart from each other; a power device chip solder-joined on one the metal pattern; a lead frame solder-joined on the metal pattern to which the power device chip is not solder-joined, and on the power device chip; an external main electrode provided to an outer casing, and joined by wire bonding to the lead frame above the metal pattern to which the power device chip is not joined; and a sealing resin formed by potting to seal the power device chip, the lead frame, and the metal patterns.

摘要翻译： 半导体模块包括：绝缘板; 形成在所述绝缘板上并彼此间隔开的多个金属图案; 在一个金属图案上焊接接合的功率器件芯片; 在功率器件芯片未焊接到的金属图案上焊接的引线框架和功率器件芯片; 外部主电极，设置在外壳上，通过引线接合连接到功率器件芯片未连接的金属图案上方的引线框架; 以及通过灌封形成的密封树脂，以密封功率器件芯片，引线框架和金属图案。

公开(公告)号：US07848104B2

公开(公告)日：2010-12-07

申请号：US12512439

申请日：2009-07-30

申请人： Toshiaki Shinohara

发明人： Toshiaki Shinohara

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3107 ,  H01L23/4334 ,  H01L24/29 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10272 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099

摘要： A power module includes a power device having a top electrode and a bottom electrode, an upper metal block connected to the top electrode, a lower metal block connected to the bottom electrode, a resin covering the power device, the upper metal block and the lower metal block so as to expose a upper surface of the upper metal block and a lower surface of the lower metal block, an upper terminal-cooling power-applying block connected to the upper metal block, a lower terminal-cooling power-applying block connected to the lower metal block, an upper terminal connected to the upper terminal-cooling power-applying block, a lower terminal connected to the lower terminal-cooling power-applying block, and a insulating case covering all elements so as to expose a part of the upper terminal and a part of the lower terminal.

摘要翻译： 功率模块包括具有顶电极和底电极的功率器件，连接到顶电极的上金属块，连接到底电极的下金属块，覆盖功率器件的树脂，上金属块和下电极 金属块，以暴露上金属块的上表面和下金属块的下表面，连接到上金属块的上端子冷却功率施加块，连接到下金属块的下端子冷却功率施加块 与下部金属块连接的上端子连接到上端子冷却功率施加块，下端连接到下端子冷却功率施加块，以及绝缘壳，覆盖所有元件，以暴露部分 上端子和下端子的一部分。

公开(公告)号：US07642640B2

公开(公告)日：2010-01-05

申请号：US11258213

申请日：2005-10-26

申请人： Toshiaki Shinohara

发明人： Toshiaki Shinohara

IPC分类号： H01L23/04

CPC分类号： H01L24/72 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099 ,  H01L2224/37599

摘要： The semiconductor device according to one of the embodiments of the present invention includes a metal block having first and second main surfaces and defining a recess on the first main surface. It also includes a semiconductor chip received within the recess of the metal block and mounted on the metal block. Further, a first terminal electrically connected with the semiconductor chip is provided, and a second terminal electrically connected with the metal block is also provided.

摘要翻译： 根据本发明实施例之一的半导体器件包括具有第一和第二主表面并且在第一主表面上限定凹陷的金属块。 它还包括容纳在金属块的凹部内并安装在金属块上的半导体芯片。 此外，提供与半导体芯片电连接的第一端子，并且还提供与金属块电连接的第二端子。

公开(公告)号：US07239663B2

公开(公告)日：2007-07-03

申请号：US10626567

申请日：2003-07-25

申请人： Kengo Tsuzuki ,  Toshiaki Shinohara

发明人： Kengo Tsuzuki ,  Toshiaki Shinohara

IPC分类号： H04B1/66 ,  H04N7/12

CPC分类号： H04L12/40117 ,  H04N21/4223 ,  H04N21/4305 ,  H04N21/43632 ,  H04N21/44008 ,  H04N21/4622

摘要： An image capture and transmission system includes first and second imaging devices. A timing signal generator produces a timing signal. A common drive circuit operates for driving the first and second imaging devices at equal timings determined by the timing signal. A first signal processor operates for converting an output signal of the first imaging device into first digital video data. A second signal processor operates for converting an output signal of the second imaging device into second digital video data. The first digital video data and the second digital video data are processed into a stream of packets. The packet stream is transmitted to, for example, a network.

摘要翻译： 图像捕获和传输系统包括第一和第二成像装置。 定时信号发生器产生定时信号。 公共驱动电路用于在由定时信号确定的相等定时驱动第一和第二成像装置。 第一信号处理器用于将第一成像装置的输出信号转换为第一数字视频数据。 第二信号处理器用于将第二成像装置的输出信号转换为第二数字视频数据。 第一数字视频数据和第二数字视频数据被处理成分组流。 分组流被发送到例如网络。

公开(公告)号：US06977677B1

公开(公告)日：2005-12-20

申请号：US09401853

申请日：1999-09-22

申请人： Toshiaki Shinohara

发明人： Toshiaki Shinohara

IPC分类号： H04N5/232 ,  H04N5/335 ,  H04N5/341 ,  H04N5/353 ,  H04N5/357 ,  H04N5/363 ,  H04N5/378 ,  H04N7/18

CPC分类号： H04N7/163 ,  H04N5/232 ,  H04N7/183 ,  H04N21/4223 ,  H04N21/4305 ,  H04N21/4307 ,  H04N21/4425 ,  H04N21/8547

摘要： A communication circuit transmits the digital video signal to a transmission line and receives a clock signal and timing data transmitted through the transmission line. The timing data indicates a communication timing. A timing signal generation circuit generates timing signals from the detected clock signal to control the imager, the a/d converting circuit, the signal processing circuit, and the communication circuit. A communication control circuit detects a communication timing from the timing data, judges whether the communication timing is detected within a predetermined condition (communication error), and controls the timing signal generation circuit to stop transmitting the digital video signal when the communication timing is not detected within the predetermined condition to prevent a fail in transmitting the video data. A shutter interval of the imager is further controlled toward a constant shutter interval in response to the communication error. The video signal is stored in a memory in response to the communication error and read if the communication error eliminated. The communication error is displayed. A system control signal indicative of data transmission period is generated in response to a received cycle start packet in accordance with the obtained data rate and channel timing.

摘要翻译： 通信电路将数字视频信号发送到传输线，并接收通过传输线传输的时钟信号和定时数据。 定时数据表示通信定时。 定时信号发生电路根据检测到的时钟信号产生定时信号，以控制成像器，a / d转换电路，信号处理电路和通信电路。 通信控制电路根据定时数据检测通信定时，判断在预定条件下是否检测到通信定时（通信错误），并且当未检测到通信定时时，控制定时信号发生电路停止发送数字视频信号 在预定条件下，以防止发送视频数据的失败。 响应于通信错误，进一步将成像器的快门间隔控制为恒定的快门间隔。 视频信号响应于通信错误存储在存储器中，并且如果通信错误被消除则读取。 显示通讯错误。 根据获得的数据速率和信道定时，响应于接收到的周期开始分组生成指示数据传输周期的系统控制信号。

公开(公告)号：US20050100101A1

公开(公告)日：2005-05-12

申请号：US10626567

申请日：2003-07-25

申请人： Kengo Tsuzuki ,  Toshiaki Shinohara

发明人： Kengo Tsuzuki ,  Toshiaki Shinohara

IPC分类号： H04N5/225 ,  H04L12/40 ,  H04L12/64 ,  H04N5/232 ,  H04N21/2365 ,  H04N21/434 ,  H04N7/12

CPC分类号： H04L12/40117 ,  H04N21/4223 ,  H04N21/4305 ,  H04N21/43632 ,  H04N21/44008 ,  H04N21/4622

摘要： An image capture and transmission system includes first and second imaging devices. A timing signal generator produces a timing signal. A common drive circuit operates for driving the first and second imaging devices at equal timings determined by the timing signal. A first signal processor operates for converting an output signal of the first imaging device into first digital video data. A second signal processor operates for converting an output signal of the second imaging device into second digital video data. The first digital video data and the second digital video data are processed into a stream of packets. The packet stream is transmitted to, for example, a network.

摘要翻译： 图像捕获和传输系统包括第一和第二成像装置。 定时信号发生器产生定时信号。 公共驱动电路用于在由定时信号确定的相等定时驱动第一和第二成像装置。 第一信号处理器用于将第一成像装置的输出信号转换为第一数字视频数据。 第二信号处理器用于将第二成像装置的输出信号转换为第二数字视频数据。 第一数字视频数据和第二数字视频数据被处理成分组流。 分组流被发送到例如网络。

公开(公告)号：US06611892B1

公开(公告)日：2003-08-26

申请号：US09578467

申请日：2000-05-26

申请人： Yuhi Sasaki ,  Toshiaki Shinohara ,  Kengo Tsuzuki

发明人： Yuhi Sasaki ,  Toshiaki Shinohara ,  Kengo Tsuzuki

IPC分类号： G06F1338

CPC分类号： H04L12/40058 ,  H04L12/40091 ,  H04L12/462

摘要： The two-way transmissions are performed between a first bus and a usual portal of a first full-duplex 3-portal bridge and between a second bus and a usual portal of a second full-duplex 3-portal bridge, respectively. The one-way transmission of an isochronous packet and an asynchronous stream packet is performed between transmission and reception portals of the first full-duplex 3-portal bridge and reception and transmission portals of the second full-duplex 3-portal bridge. The first full-duplex 3-portal bridge and the second full-duplex 3-portal bridge perform a conversion between the asynchronous stream packet and an asynchronous packet if necessary.

摘要翻译： 双向传输分别在第一全双工3入口网桥的第一总线和通常入口之间以及第二总线与第二全双工3端口桥的通常入口之间执行。 在第一全双工3端口桥接器的发送和接收端口以及第二全双工3端口桥接器的接收和发送端口之间执行同步分组和异步流分组的单向传输。 如果需要，第一个全双工3端口桥接器和第二个全双工3端口桥接器在异步流分组和异步分组之间执行转换。

公开(公告)号：USRE38043E1

公开(公告)日：2003-03-25

申请号：US09517748

申请日：2000-03-03

申请人： Toshiaki Shinohara ,  Yoshiharu Takahashi

发明人： Toshiaki Shinohara ,  Yoshiharu Takahashi

IPC分类号： H01L23495

CPC分类号： H01L23/49558 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： In a lead frame, L-shaped support tapes are applied to inner leads and suspension leads. Ends of the support tapes are overlapped with each other at the suspension leads to form, together, a rectangular ring shape. Since the support tapes are L-shaped, when the overlapped portions are positioned at the suspension leads, there are only two overlapped portions of the support tapes at the suspension leads. Thus, the number of overlapped portions requiring accurate alignment is reduced. Moreover, the L-shaped support tapes can be cut from the material for the support tape with higher efficiency.

摘要翻译： 在引线框架中，L形支撑带应用于内引线和悬挂引线。 支撑带的端部在悬挂引线处彼此重叠，以形成矩形环形状。 由于支撑带是L形的，当重叠部分位于悬挂引线上时，悬挂引线上的支撑带只有两个重叠的部分。 因此，需要精确对准的重叠部分的数量减少。 此外，可以以更高的效率从用于支撑带的材料切割L形支撑带。