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21.发明授权Electronic system comprising stacked electronic devices provided with integrated-circuit chips 有权电子系统包括具有集成电路芯片的堆叠式电子设备公开(公告)号：US09275977B2
公开(公告)日：2016-03-01
申请号：US14524906
申请日：2014-10-27
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Jean-Michel Riviere , Nadine Martin
IPC: H01L23/52 , H01L25/065 , H01L25/10 , H01L23/367 , H01L23/498 , H01L23/538 , H01L23/40
CPC classification number: H01L25/0657 , H01L23/367 , H01L23/3675 , H01L23/49816 , H01L23/5389 , H01L25/105 , H01L2023/4056 , H01L2023/4062 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/15173 , H01L2924/15311 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: An electronic system includes a first electronic device (with a first integrated-circuit chip) and a second electronic device (with a second integrated-circuit chip). The second electronic device is stacked above the first electronic device on a same side as the first integrated-circuit chip. Electrical connection elements located around the first integrated-circuit chip electrically connected to the second electronic device to the first electronic device. A metal plate configured for heat capture and transfer extends between the first and second electronic devices. The metal plate includes through-passages aligned to permit the electrical connection elements to pass at a distance.
Abstract translation: 电子系统包括第一电子设备（具有第一集成电路芯片）和第二电子设备（具有第二集成电路芯片）。 第二电子装置在与第一集成电路芯片相同的一侧堆叠在第一电子装置的上方。 电连接元件围绕第一集成电路芯片电连接到第二电子设备到第一电子设备。 配置用于捕获和传送的金属板在第一和第二电子设备之间延伸。 金属板包括对准以允许电连接元件一段距离通过的通孔。
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公开(公告)号：US12274003B2
公开(公告)日：2025-04-08
申请号：US17961911
申请日：2022-10-07
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Patrick Laurent , Jean-Michel Riviere
IPC: H05K1/02 , B81B7/02 , H01L23/13 , H01L23/24 , H01L23/552 , H01L23/66 , H04R19/04 , H05K1/11 , H05K1/14 , H05K1/18 , G01S7/481
Abstract: A device includes comprising first and second printed circuit boards. Walls couple the first and second printed circuit boards to each other and define a first cavity between the first and second printed circuit boards. Electric conductors associated with the walls electrically connect the first and second printed circuit boards. An integrated circuit chip is mounted to a first surface of the first integrated circuit board in the first cavity. The integrated circuit chip is electrically connected to conductive tracks of the first surface of the first printed circuit board. Surface-mounted components are mounted on top of and in contact with conductive tracks of a first surface of the second printed circuit board. The first surfaces of the first and second printed circuit boards are arranged facing towards each other. The first and second printed circuit boards may form rigid components of a flex-rigid type printed circuit board.
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公开(公告)号：US11641002B2
公开(公告)日：2023-05-02
申请号：US17199180
申请日：2021-03-11
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Alexandre Coullomb , Romain Coffy , Jean-Michel Riviere
Abstract: A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.
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公开(公告)号：US11211772B2
公开(公告)日：2021-12-28
申请号：US16432576
申请日：2019-06-05
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Romain Coffy , Jean-Michel Riviere
Abstract: The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a barrel comprising a mounting for a diffuser; and a diffuser positioned in the mounting, wherein the barrel comprises first and second conducting columns and a fuse or conductive wire electrically coupling the first and second conducting columns. A portion of the fuse is mechanically fixed to the diffuser and/or the fuse being arranged to trap the diffuser in said mounting.
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公开(公告)号：US10978607B2
公开(公告)日：2021-04-13
申请号：US16409714
申请日：2019-05-10
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Alexandre Coullomb , Romain Coffy , Jean-Michel Riviere
Abstract: A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.
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Patent Agency Ranking
公开(公告)号：US10965376B2
公开(公告)日：2021-03-30
申请号：US16218948
申请日：2018-12-13
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Jean-Michel Riviere , Romain Coffy , Karine Saxod
Abstract: A cover for an electronic circuit package, including: a body having an opening extending therethrough; a first element located in the opening and having a surface continuing planar or rounded shapes of a surface of the cover; and a second element of connection of the first element to the body.
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公开(公告)号：US10480994B2
公开(公告)日：2019-11-19
申请号：US15611266
申请日：2017-06-01
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Karine Saxod , Jean-Michel Riviere
IPC: G01J1/02 , H01L25/16 , G01J1/04 , G01V8/10 , H05K1/18 , H05K3/28 , H01L31/0203 , H01L31/167
Abstract: A microchip has a rear face attached to a front mounting face of a support plate. An encapsulation cover for the microchip is mounted to the support plate. The encapsulation cover includes a front wall, a peripheral wall extending from the front wall and an inside partition extending from the front wall and between opposite sides of the peripheral wall. The inside partition passes locally above the microchip to delimit two cavities. A bonding material is interposed between encapsulation cover and the support plate and microchip. An end part of the inside partition of the cover, adjacent to the front face of the microchip, include an accumulation and containment recess that is configured to at least partly receive the bonding material.
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公开(公告)号：US20180058920A1
公开(公告)日：2018-03-01
申请号：US15611266
申请日：2017-06-01
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Karine Saxod , Jean-Michel Riviere
CPC classification number: G01J1/0271 , G01J1/0403 , G01V8/10 , H01L25/167 , H01L31/0203 , H01L31/167 , H05K1/18 , H05K3/284 , H05K2201/10151 , H05K2201/10378
Abstract: A microchip has a rear face attached to a front mounting face of a support plate. An encapsulation cover for the microchip is mounted to the support plate. The encapsulation cover includes a front wall, a peripheral wall extending from the front wall and an inside partition extending from the front wall and between opposite sides of the peripheral wall. The inside partition passes locally above the microchip to delimit two cavities. A bonding material is interposed between encapsulation cover and the support plate and microchip. An end part of the inside partition of the cover, adjacent to the front face of the microchip, include an accumulation and containment recess that is configured to at least partly receive the bonding material.
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29.发明申请公开(公告)号：US20150115424A1
公开(公告)日：2015-04-30
申请号：US14524906
申请日：2014-10-27
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Jean-Michel Riviere , Nadine Martin
IPC: H01L23/495 , H01L25/065
CPC classification number: H01L25/0657 , H01L23/367 , H01L23/3675 , H01L23/49816 , H01L23/5389 , H01L25/105 , H01L2023/4056 , H01L2023/4062 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/15173 , H01L2924/15311 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: An electronic system includes a first electronic device (with a first integrated-circuit chip) and a second electronic device (with a second integrated-circuit chip). The second electronic device is stacked above the first electronic device on a same side as the first integrated-circuit chip. Electrical connection elements located around the first integrated-circuit chip electrically connected to the second electronic device to the first electronic device. A metal plate configured for heat capture and transfer extends between the first and second electronic devices. The metal plate includes through-passages aligned to permit the electrical connection elements to pass at a distance.
Abstract translation: 电子系统包括第一电子设备（具有第一集成电路芯片）和第二电子设备（具有第二集成电路芯片）。 第二电子装置在与第一集成电路芯片相同的一侧堆叠在第一电子装置的上方。 电连接元件围绕第一集成电路芯片电连接到第二电子设备到第一电子设备。 配置用于捕获和传送的金属板在第一和第二电子设备之间延伸。 金属板包括对准以允许电连接元件一段距离通过的通孔。
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公开(公告)号：US11640946B2
公开(公告)日：2023-05-02
申请号：US17466941
申请日：2021-09-03
Inventor： Denis Farison , Romain Coffy , Jean-Michel Riviere
IPC: H01L23/52 , H01L23/00 , H01L21/56 , H01L23/528 , H01L25/065 , H04L9/00
Abstract: A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.
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