公开(公告)号：US09634486B2

公开(公告)日：2017-04-25

申请号：US14327410

申请日：2014-07-09

Applicant: QUALCOMM Incorporated

Inventor： Hee Jun Park ,  Yuancheng Christopher Pan ,  Christopher Kong Yee Chun

IPC: G06F1/28 ,  H02J3/00 ,  H02J1/00 ,  H02J1/10

CPC classification number: H02J3/00 ,  G06F1/28 ,  H02J1/00 ,  H02J1/08 ,  H02J1/102

Abstract: Managing power rails, including: a plurality of power rails, each power rail coupled to at least one power supply and configured to support a plurality of similarly-configured loads; and a power rail controller configured to merge and split the plurality of power rails based on total power consumption of the plurality of similarly-configured loads. The power rail management also determines the optimal power rail mode (merge/split) based on current load of each rail and adjusts the dynamic clock and voltage scaling policy, workload allocation on each core, and performance limit/throttling management according to the power rail mode.

公开(公告)号：US20160334845A1

公开(公告)日：2016-11-17

申请号：US14709276

申请日：2015-05-11

Applicant: QUALCOMM Incorporated

Inventor： Rajat Mittal ,  Hee Jun Park ,  Peng Wang ,  Mehdi Saeidi ,  Arpit Mittal

IPC: G06F1/20 ,  H01L25/10

CPC classification number: G06F1/206 ,  G01K7/04 ,  G05D23/1906 ,  H01L23/34 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/49811 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1094 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.

Abstract translation: 封装封装（PoP）器件包括第一封装，第二封装和双向热电冷却器（TEC）。 第一封装包括第一基板和耦合到第一基板的第一管芯。 第二个包装耦合到第一个包装。 第二包装包括第二基板和耦合到第二基板的第二管芯。 TEC位于第一模具和第二基板之间。 TEC适于在第一包装和第二包装之间动态地散发热量。 TEC适于在第一时间段内将热量从第一管芯散热到第二管芯。 TEC进一步适于在第二时间段内将热量从第二管芯传送到第一管芯。 TEC适于通过第二衬底将热量从第一裸片散发到第二裸片。

公开(公告)号：US09461626B2

公开(公告)日：2016-10-04

申请号：US14330464

申请日：2014-07-14

Applicant: QUALCOMM Incorporated

Inventor： Hee Jun Park ,  Dexter Tamio Chun

IPC: H03K3/012 ,  H03K3/011 ,  G11C7/10 ,  G11C11/4074 ,  G11C11/4093

CPC classification number: H03K3/012 ,  G11C7/1057 ,  G11C7/1084 ,  G11C11/4074 ,  G11C11/4093 ,  H03K3/011

Abstract: Techniques for adjusting swing voltage for an I/O interface signal are described herein. In one embodiment, a device comprises an input/output (I/O) interface, and an I/O voltage controller. The I/O voltage controller is configured to determine a frequency or temperature of the I/O interface, and to adjust a swing voltage of the I/O interface based at least in part upon the determined frequency or temperature.

Abstract translation: 本文描述了用于调整I / O接口信号的摆动电压的技术。 在一个实施例中，设备包括输入/​​输出（I / O）接口和I / O电压控制器。 I / O电压控制器被配置为确定I / O接口的频率或温度，并且至少部分地基于所确定的频率或温度来调整I / O接口的摆幅电压。

公开(公告)号：US09423853B2

公开(公告)日：2016-08-23

申请号：US14102468

申请日：2013-12-10

Applicant: Qualcomm Incorporated

Inventor： Hee Jun Park ,  Jewon Kang

IPC: G06F1/32 ,  H04L12/18 ,  H04N7/15 ,  G09G5/00

CPC classification number: G06F1/3206 ,  G06F1/3234 ,  G09G5/005 ,  G09G2320/0613 ,  G09G2320/08 ,  G09G2330/021 ,  G09G2330/045 ,  G09G2340/0407 ,  G09G2360/08 ,  G09G2370/022 ,  H04L12/1827 ,  H04N7/15

Abstract: Various embodiments of methods and systems for balancing user experience in a multimedia conferencing community are disclosed. An exemplary embodiment envisions a portable computing device (“PCD”) receiving data indicative of one or more visual multimedia parameter settings in a companion PCD of the community. Based on the received data, the PCD may determine an adjustment to the settings of one or more of its own visual multimedia parameters such that a multimedia output in the form of a data packet stream is adjusted. In this way, the PCD may conserve power consumption by avoiding unnecessary multimedia workload processing for encoding a multimedia output that would not benefit the quality of service (“QoS”) delivered by the companion PCD. Additionally, by optimizing the quality of the multimedia output in view of the companion device parameter settings, the PCD may allocate more of its power budget to improving its own QoS level.

Abstract translation: 公开了用于平衡多媒体会议社区中的用户体验的方法和系统的各种实施例。 示例性实施例设想便携式计算设备（“PCD”）在社区的伴侣PCD中接收指示一个或多个可视多媒体参数设置的数据。 基于接收的数据，PCD可以确定对其自己的可视多媒体参数中的一个或多个的设置的调整，使得调整数据分组流形式的多媒体输出。 以这种方式，PCD可以通过避免不利的多媒体工作负载处理来节省功耗，所述多媒体工作负载处理将不利于伴随的PCD提供的服务质量（“QoS”）的多媒体输出。 此外，通过根据配套设备参数设置优化多媒体输出的质量，PCD可以分配更多的功率预算来提高自己的QoS水平。

公开(公告)号：US09378536B2

公开(公告)日：2016-06-28

申请号：US14266685

申请日：2014-04-30

Applicant: QUALCOMM INCORPORATED

Inventor： Hee Jun Park ,  Young Hoon Kang ,  Mriganka Mondal

IPC: G06F1/32 ,  G06T1/20

CPC classification number: G06T1/20 ,  G06F1/3206 ,  G06F1/3228 ,  G06F1/324 ,  G06F1/3296 ,  G09G2330/021 ,  G09G2360/06 ,  Y02D10/126 ,  Y02D10/172

Abstract: Systems, methods, and computer programs are disclosed for minimizing power consumption in graphics frame processing. One such method comprises: initiating graphics frame processing to be cooperatively performed by a central processing unit (CPU) and a graphics processing unit (GPU); receiving CPU activity data and GPU activity data; determining a set of available dynamic clock and voltage/frequency scaling (DCVS) levels for the GPU and the CPU; and selecting from the set of available DCVS levels an optimal combination of a GPU DCVS level and a CPU DCVS level, based on the CPU and GPU activity data, which minimizes a combined power consumption of the CPU and the GPU during the graphics frame processing.

Abstract translation: 公开了用于使图形帧处理中的功率消耗最小化的系统，方法和计算机程序。 一种这样的方法包括：启动由中央处理单元（CPU）和图形处理单元（GPU）协同执行的图形帧处理; 接收CPU活动数据和GPU活动数据; 确定用于GPU和CPU的一组可用动态时钟和电压/频率缩放（DCVS）电平; 以及基于CPU和GPU活动数据，从可用DCVS级别中选择GPU DCVS级别和CPU DCVS级别的最佳组合，其在图形帧处理期间最小化CPU和GPU的组合功耗。

公开(公告)号：US20160013643A1

公开(公告)日：2016-01-14

申请号：US14327410

申请日：2014-07-09

Applicant: QUALCOMM Incorporated

Inventor： Hee Jun Park ,  Yuancheng Christopher Pan ,  Christopher Kong Yee Chun

IPC: H02J3/00 ,  G06F1/28

CPC classification number: H02J3/00 ,  G06F1/28 ,  H02J1/00 ,  H02J1/08 ,  H02J1/102

Abstract: Managing power rails, including: a plurality of power rails, each power rail coupled to at least one power supply and configured to support a plurality of similarly-configured loads; and a power rail controller configured to merge and split the plurality of power rails based on total power consumption of the plurality of similarly-configured loads. The power rail management also determines the optimal power rail mode (merge/split) based on current load of each rail and adjusts the dynamic clock and voltage scaling policy, workload allocation on each core, and performance limit/throttling management according to the power rail mode.

Abstract translation: 管理电源轨，包括：多个电源轨，每个电源轨耦合到至少一个电源并且被配置为支撑多个类似配置的负载; 以及电力轨控制器，其被配置为基于所述多个类似配置的负载的总功率消耗来合并和分割所述多个电力轨。 电力轨道管理还根据每个轨道的当前负载确定最佳电力轨模式（合并/分割），并调整动态时钟和电压调整策略，每个核心上的工作负载分配以及根据电力轨道的性能限制/节流管理 模式。

公开(公告)号：US20160007024A1

公开(公告)日：2016-01-07

申请号：US14855359

申请日：2015-09-15

Applicant: QUALCOMM Incorporated

Inventor： Hee Jun Park ,  Yiran Li ,  Jewon Kang

IPC: H04N19/156 ,  H04N19/107 ,  H04N19/182 ,  H04N19/154 ,  H04N19/196

CPC classification number: H04N19/156 ,  H04N19/103 ,  H04N19/107 ,  H04N19/154 ,  H04N19/182 ,  H04N19/196 ,  H04N19/40 ,  H04N19/42 ,  H04N19/57

Abstract: In an example, a method includes encoding video data at a first video quality using an encoding parameter, and determining an operating characteristic of one or more components of an electronic device configured to record the video data. The method also includes adjusting the encoding parameter based at least in part on the determined operating characteristic and while maintaining the first video quality, and encoding the video data at the first video quality using the adjusted encoding parameter.

公开(公告)号：US20150137598A1

公开(公告)日：2015-05-21

申请号：US14262181

申请日：2014-04-25

Applicant: Qualcomm Incorporated

Inventor： Shadi Hawawini ,  VaraPrasad Arikatla ,  Hee Jun Park

IPC: H02J4/00 ,  H02J7/00

CPC classification number: H02J7/0052 ,  G01R31/00 ,  H02J2007/0062 ,  H02M2001/007 ,  H02M2001/008 ,  Y10T307/406

Abstract: In one embodiment, an electronic system comprises one or more power circuits configured to receive a first voltage from an external power source and produce a second voltage to one or more electronic components of the electronic system, and a power management circuit configured to determine one or more output currents of the one or more power circuits, wherein the power management circuit causes the external power source to change the first voltage based on at least one output current of at least one power circuit to reduce power loss of the at least one power circuit.

Abstract translation: 在一个实施例中，电子系统包括被配置为从外部电源接收第一电压并且向电子系统的一个或多个电子部件产生第二电压的一个或多个电力电路，以及被配置为确定一个或多个 所述一个或多个电源电路的更多输出电流，其中所述功率管理电路使得所述外部电源基于至少一个电源电路的至少一个输出电流来改变所述第一电压，以减少所述至少一个电源电路的功率损耗 。

公开(公告)号：US20140249690A1

公开(公告)日：2014-09-04

申请号：US13783142

申请日：2013-03-01

Applicant: QUALCOMM INCORPORATED

Inventor： Hee Jun Park

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F1/203 ,  G06F1/3206 ,  G06F1/324 ,  Y02D10/126

Abstract: Some implementations provide a method for performing thermal management of an electronic device. The method determines a sensation value based on (i) a temperature of the electronic device, and (ii) a temperature rate change of the electronic device. The method associates a discomfort level from a plurality of discomfort levels, based on the determined sensation value, to the electronic device. At least one discomfort level is dynamically adjustable. The discomfort level specifies a maximum allowed activity for a processing unit of the electronic device. In some implementations, the discomfort level specifies how thermally uncomfortable the electronic device is for a user of the electronic device. In some implementations, each discomfort level from the several discomfort levels is associated with a particular range of sensation values. The sensation value is based on a user adjustable sensation model. The user adjustable sensation model is based on one of several thermal coefficient constants.

Abstract translation: 一些实现提供了一种用于执行电子设备的热管理的方法。 该方法基于（i）电子设备的温度和（ii）电子设备的温度变化来确定感觉值。 该方法基于确定的感觉值将来自多个不适等级的不适等级与电子设备相关联。 至少有一个不适等级是动态可调的。 不适等级指定电子设备的处理单元的允许活动的最大值。 在一些实施方案中，不适等级规定了电子设备对电子设备的用户的热不舒服。 在一些实施方案中，来自几个不适水平的每个不适等级与感觉值的特定范围相关联。 感觉值基于用户可调节的感觉模型。 用户可调感觉模型基于几个热系数常数之一。

公开(公告)号：US11520628B2

公开(公告)日：2022-12-06

申请号：US16878974

申请日：2020-05-20

Applicant: QUALCOMM INCORPORATED

Inventor： Hee Jun Park

IPC: G06F9/48 ,  G06F9/50 ,  G06F1/04 ,  G06F1/06 ,  G06F1/08 ,  G06F11/30

Abstract: In a real-time system having first and second processor systems, cooperative dynamic clock and voltage scaling (“DCVS”) may include a first processor system monitoring a condition indicative of first processor workload, adjusting a first processor operating frequency in response to a detected amount of change in the first processor workload, and providing an indication based on the detected amount of change in the first processor workload to the second processor contemporaneously with providing first processor output data to the second processor. The cooperative DCVS may further include the second processor system adjusting a second processor operating frequency in response to the indication.