公开(公告)号：US10437025B2

公开(公告)日：2019-10-08

申请号：US14605298

申请日：2015-01-26

Applicant: OmniVision Technologies, Inc.

Inventor： Tsung-Wei Wan ,  Wei-Ping Chen ,  Jui-Yi Chiu ,  Jau-Jan Deng

IPC: G02B13/00 ,  B29D11/00 ,  B29C45/00 ,  B29C45/14 ,  B29L11/00

Abstract: A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.

公开(公告)号：US10075636B2

公开(公告)日：2018-09-11

申请号：US15138568

申请日：2016-04-26

Applicant: OmniVision Technologies, Inc.

Inventor： Tsung Wei Wan ,  Ting-Yu Cheng ,  Wei-Ping Chen ,  Chuen-Yi Yin

IPC: H04N7/00 ,  H04N5/232 ,  H04N5/225 ,  G02B13/00 ,  G02B9/10 ,  B29C43/18 ,  B29C43/02 ,  B29D11/00 ,  A61B1/05 ,  A61B1/00 ,  G02B5/20 ,  B29K63/00 ,  B29K105/20 ,  B29K701/00 ,  B29K709/08 ,  B29L31/00

CPC classification number: A61B1/00186 ,  A61B1/00096 ,  A61B1/0011 ,  A61B1/041 ,  A61B1/051 ,  B29C43/021 ,  B29C43/18 ,  B29D11/00009 ,  B29D11/00307 ,  B29D11/0073 ,  B29K2063/00 ,  B29K2105/20 ,  B29K2701/00 ,  B29K2709/08 ,  B29L2011/00 ,  B29L2031/753 ,  G02B5/20 ,  G02B9/10 ,  G02B13/003 ,  G02B13/006 ,  G02B13/0085 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N2005/2255

Abstract: An ultra-small camera module with wide field of view includes (a) a wafer-level lens system for forming, on an image plane, an image of a wide field-of-view scene, wherein the wafer-level lens system includes (i) a distal planar surface positioned closest to the scene and no more than 2.5 millimeters away from the image plane in direction along optical axis of the wafer-level lens system, and (ii) a plurality of lens elements optically coupled in series along the optical axis, each of the lens elements having a curved surface, and (b) an image sensor mechanically coupled to the wafer-level lens system and including a rectangular array of photosensitive pixels, positioned at the image plane, for capturing the image, wherein cross section of the ultra-small camera module, orthogonal to the optical axis, is rectangular with side lengths no greater than 1.5 millimeters.

公开(公告)号：US09915763B2

公开(公告)日：2018-03-13

申请号：US14941174

申请日：2015-11-13

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Ping Chen ,  Tsung-Wei Wan

IPC: G02B9/04 ,  G02B3/00 ,  B32B37/12 ,  G02B13/00 ,  G03B17/12 ,  H01L27/146

CPC classification number: G02B3/0062 ,  B32B37/12 ,  B32B2551/00 ,  G02B3/0031 ,  G02B13/0085 ,  G03B17/12 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/14687

Abstract: A stacked-lens assembly includes a lower substrate and an upper substrate. The lower substrate includes a lower-substrate top surface having thereon a lower element and an inner spacer, the inner spacer at least partially surrounding the lower element. The upper substrate includes an upper-substrate bottom surface opposite the lower-substrate top surface and having thereon an upper element and an outer spacer, the outer spacer (i) being attached to the inner spacer and (ii) at least partially surrounding the upper element. In any cross-section of the stacked-lens assembly parallel to the upper substrate and including both the inner spacer and the outer spacer, the entirety of the inner spacer is within a perimeter of the outer spacer.

公开(公告)号：US20170139086A1

公开(公告)日：2017-05-18

申请号：US14941174

申请日：2015-11-13

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Ping Chen ,  Tsung-Wei Wan

IPC: G02B3/00 ,  H01L27/146 ,  G02B13/00 ,  B32B37/12 ,  G03B17/12

CPC classification number: G02B3/0062 ,  B32B37/12 ,  B32B2551/00 ,  G02B3/0031 ,  G02B13/0085 ,  G03B17/12 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/14687

Abstract: A stacked-lens assembly includes a lower substrate and an upper substrate. The lower substrate includes a lower-substrate top surface having thereon a lower element and an inner spacer, the inner spacer at least partially surrounding the lower element. The upper substrate includes an upper-substrate bottom surface opposite the lower-substrate top surface and having thereon an upper element and an outer spacer, the outer spacer (i) being attached to the inner spacer and (ii) at least partially surrounding the upper element. In any cross-section of the stacked-lens assembly parallel to the upper substrate and including both the inner spacer and the outer spacer, the entirety of the inner spacer is within a perimeter of the outer spacer.

公开(公告)号：US20170123190A1

公开(公告)日：2017-05-04

申请号：US14932368

申请日：2015-11-04

Applicant: OmniVision Technologies, Inc.

Inventor： Tsung-Wei Wan ,  Wei-Ping Chen

IPC: G02B13/00 ,  B29D11/00 ,  G02B1/04

CPC classification number: G02B13/0085 ,  B29D11/00307 ,  B29D11/00403 ,  B29K2995/0029 ,  G02B1/041 ,  G02B13/005

Abstract: A hybrid compound lens includes a substrate lens and a resin lens. The substrate lens has a non-planar substrate surface surrounded by a flange having a flange surface bordering the non-planar substrate surface and forming an obtuse angle therewith. The resin lens has a non-planar resin surface adjoining the substrate lens along the non-planar substrate surface. A lens wafer includes a substrate wafer and resin lenses. The substrate wafer has a top surface having non-planar surface features each bordered by a planar region of the top surface and forming an obtuse angle therewith. Each resin lens has a non-planar resin surface adjoining the substrate wafer along a non-planar surface feature. A method for fabricating a wafer-level hybrid compound lens includes depositing a resin portion on a non-planar feature of a side of a substrate. The method also includes forming the resin portion into a lens on the non-planar feature.

公开(公告)号：US20160231473A1

公开(公告)日：2016-08-11

申请号：US14616925

申请日：2015-02-09

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Ping Chen ,  Jau-Jan Deng ,  Tsung-Wei Wan ,  Chuen-Yi Yin

IPC: G02B5/04 ,  B29D11/00

CPC classification number: B29D11/0074 ,  B29K2995/0026 ,  G02B3/0006 ,  G02B3/0031 ,  G02B3/0056 ,  G02B5/045 ,  G02B13/006 ,  G02B13/0065

Abstract: A wide-angle camera and fabrication method thereof includes a sensor with a plurality of pixel sub-arrays and an array of optical elements on a first side of a substrate. Each of the optical elements is capable of forming an image from a field of view onto a different one of the pixel sub-arrays. The wide-angle camera also includes an array of achromatic doublet prisms on a second side of the substrate, where each of the achromatic doublet prisms is aligned to provide a viewing angle with a different one of the optical elements. The sensor captures a wide-angle field of view while having a compact format.

Abstract translation: 广角照相机及其制造方法包括具有多个像素子阵列的传感器和在基板的第一侧上的光学元件阵列。 每个光学元件能够从视野形成图像到不同的像素子阵列上。 广角摄像机还包括在衬底的第二侧上的消色差双棱镜阵列，其中每个消色差双棱镜对准以提供与不同的一个光学元件的视角。 传感器捕获广角视野，同时具有紧凑的格式。

公开(公告)号：US20160057323A1

公开(公告)日：2016-02-25

申请号：US14465292

申请日：2014-08-21

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Ping Chen ,  Tsung-Wei Wan

IPC: H04N5/225

CPC classification number: H04N5/2254

Abstract: A PCB-mountable lens adapter includes an adapter lens for being a component of an imaging system that has a second field of view different from the first field of view, the imaging system comprising the adapter lens and the camera lens; and an adapter housing for holding the adapter lens and for attaching to a PCB. A method for modifying the field of view of an camera module includes attaching a PCB-mountable lens adapter to a PCB, the PCB-mountable lens adapter including an adapter lens mounted in an adapter housing, the PCB being configured for surface-mounting of the camera module thereto.

Abstract translation: 一种可安装PCB的透镜适配器，包括：适配器透镜，用于成像系统的部件，该成像系统具有与第一视野不同的第二视野，该成像系统包括适配器透镜和照相机镜头; 以及用于保持适配器透镜并用于附接到PCB的适配器壳体。 一种用于修改相机模块的视野的方法包括将PCB可安装的镜头适配器附接到PCB，所述PCB可安装的镜头适配器包括安装在适配器壳体中的适配器镜头，所述PCB被配置为用于表面安装 相机模块。

公开(公告)号：US11892654B2

公开(公告)日：2024-02-06

申请号：US16594534

申请日：2019-10-07

Applicant: OmniVision Technologies, Inc.

Inventor： Shih-Hsin Hsu ,  Jau-Jan Deng ,  Wei-Ping Chen

IPC: G02B27/48 ,  G02B5/02 ,  G02B3/00 ,  G02B5/18

CPC classification number: G02B27/48 ,  G02B3/0037 ,  G02B5/0278 ,  G02B5/0294 ,  G02B5/1871

Abstract: A passive speckle-suppressing diffuser includes a microlens array for diffusing a light field originating from one or more coherent light beams, and a diffractive optical element mounted in series with the microlens array and having a pixelated thickness distribution, characterized by a spatial variation across the diffractive optical element, to impose a spatially varying phase shift on the light field. The pixelated thickness distribution may be configured such that the spatially varying phase shift suppresses speckle of the light field while minimizing introduction of distinct diffraction structure. A method for passive speckle-suppressing diffusion a light field originating from one or more coherent light beams may include refracting the light field, through a microlens array, to diffuse the light field, and imposing a spatially varying phase shift on the light field to decohere the light field without introducing any first-order diffraction components deflected beyond angle spread introduced by the microlens array.

公开(公告)号：US11782256B2

公开(公告)日：2023-10-10

申请号：US15271679

申请日：2016-09-21

Applicant: OmniVision Technologies, Inc.

Inventor： Yi-Fan Lin ,  Wei-Ping Chen ,  Jau-Jan Deng ,  Suganda Jutamulia

IPC: G02B23/10 ,  A61B1/04 ,  G02B23/04 ,  A61B1/06 ,  A61B1/00 ,  H04N23/55 ,  H04N23/56 ,  A61B1/05 ,  A61B1/313 ,  G02B23/24 ,  H04N23/50 ,  G02B27/28

CPC classification number: G02B23/10 ,  A61B1/00096 ,  A61B1/00177 ,  A61B1/051 ,  A61B1/0623 ,  A61B1/0676 ,  A61B1/0684 ,  A61B1/3137 ,  G02B23/04 ,  G02B23/2423 ,  G02B23/2446 ,  G02B23/2461 ,  G02B23/2484 ,  H04N23/55 ,  H04N23/56 ,  G02B27/283 ,  H04N23/555

Abstract: An endoscope imager includes a system-in-package and a specularly reflective surface. The system-in-package includes (a) a camera module having an imaging lens with an optical axis and (b) an illumination unit. The system-in-package includes (a) a camera module having an imaging lens with an optical axis and (b) an illumination unit configured to emit illumination propagating in a direction away from the imaging lens, the direction having a component parallel to the optical axis. The specularly reflective surface faces the imaging lens and forming an oblique angle with the optical axis, to deflect the illumination toward a scene and deflect light from the scene toward the camera module.

公开(公告)号：US11538269B2

公开(公告)日：2022-12-27

申请号：US17243176

申请日：2021-04-28

Applicant: OmniVision Technologies, Inc.

Inventor： Tsung-Wei Wan ,  Wei-Ping Chen

IPC: G06V40/13 ,  G02F1/1335 ,  G02B13/14

Abstract: An optical fingerprint sensor (OFPS) for use with a liquid-crystal display (LCD) panel having a backlight module is positioned under the backlight module and captures an image of a fingerprint sensing area on the LCD panel through an aperture in both a reflector and a metal shield of the backlight module. The OFPS includes a sensor layer, a wafer-level optic layer bonded to the sensor layer and an infrared pass filter (IRPF) coating formed on a substantially flat top surface of the wafer-level optic layer. An OFPS may be formed with a flat top and may include a wafer-level optic layer having one or more lenses to direct light generated by a light source beneath the wafer-level optic layer. The wafer-level lenses may be bonded with the fingerprint scanner. The flat top of the OFPS may be made with an IRPF coating.