公开(公告)号：US20190074227A1

公开(公告)日：2019-03-07

申请号：US15774025

申请日：2018-04-05

Applicant: KLA-TENCOR CORPORATION

Inventor： Einat Peled ,  Eran Amit ,  Alexander Svizher ,  Yuval Lamhot ,  Noga Sella ,  Wei-Te Cheng

IPC: H01L21/66 ,  H01L21/67 ,  G03F7/20

Abstract: Methods applicable in metrology modules and tools are provided, which enable adjusting metrology measurement parameters with respect to process variation, without re-initiating metrology recipe setup. Methods comprise, during an initial metrology recipe setup, recording a metrology process window and deriving baseline information therefrom, and during operation, quantifying the process variation with respect to the baseline information, and adjusting the metrology measurement parameters within the metrology process window with respect to the quantified process variation. The quick adjustment of metrology parameters avoids metrology-related process delays and releases prior art bottlenecks related thereto. Models of effects of various process variation factors on the metrology measurements may be used to enhance the derivation of required metrology tuning and enable their application with minimal delays to the production process.

公开(公告)号：US20180299791A1

公开(公告)日：2018-10-18

申请号：US15568304

申请日：2017-08-21

Applicant: KLA-Tencor Corporation

Inventor： Eran Amit ,  Roie Volkovich ,  Liran Yerushalmi

IPC: G03F7/20

CPC classification number: G03F7/70625 ,  G03F7/70483 ,  G03F7/70491 ,  G03F7/70525 ,  G03F7/70533 ,  G03F7/70616 ,  G03F7/70633 ,  G03F7/70991

Abstract: Lithography systems and methods are provided with enhanced performance based on broader utilization of the integrated metrology tool in the printing tool to handle the metrology measurements in the system in a more sophisticated and optimized way. Additional operation channels are disclosed, enabling the integrated metrology tool to monitor and/or allocate metrology measurements thereby and by a standalone metrology tool with respect to specified temporal limitations of the printing tool; to adjust and optimize the metrology measurement recipes; to provide better process control to optimize process parameters of the printing tool; as well as to group process parameters of the printing tool according to a metrology measurements landscape.

公开(公告)号：US20150316490A1

公开(公告)日：2015-11-05

申请号：US14797754

申请日：2015-07-13

Applicant: KLA-Tencor Corporation

Inventor： Eran Amit ,  Zeev Bomzon ,  Barak Bringoltz ,  Boris Efraty

IPC: G01N21/88 ,  G01N21/47

CPC classification number: G01N21/8851 ,  G01N21/47 ,  G03F7/70633

Abstract: Metrology methods and respective software and module are provided, which identify and remove measurement inaccuracy which results from process variation leading to target asymmetries. The methods comprise identifying an inaccuracy contribution of process variation source(s) to a measured scatterometry signal (e.g., overlay) by measuring the signal across a range of measurement parameter(s) (e.g., wavelength, angle) and targets, and extracting a measurement variability over the range which is indicative of the inaccuracy contribution. The method may further assume certain functional dependencies of the resulting inaccuracy on the target asymmetry, estimate relative donations of different process variation sources and apply external calibration to further enhance the measurement accuracy.

Abstract translation: 提供了计量方法和各自的软件和模块，其识别和消除由过程变化导致的目标不对称性的测量不准确度。 所述方法包括通过测量跨越测量参数（例如波长，角度）和目标的范围的信号来识别过程变化源对测量的散射测量信号（例如，覆盖）的不准确贡献，并且提取 在范围内的测量变异性表示不准确的贡献。 该方法可以进一步假设所得到的不准确性对目标不对称性的某些功能依赖性，估计不同过程变化源的相对捐赠并应用外部校准以进一步提高测量精度。

公开(公告)号：US20130342831A1

公开(公告)日：2013-12-26

申请号：US13904318

申请日：2013-05-29

Applicant: KLA-Tencor Corporation

Inventor： Vladimir Levinski ,  Daniel Kandel ,  Eran Amit

IPC: G01B11/27 ,  H01L23/544

CPC classification number: G01B11/272 ,  G01N21/47 ,  G01N21/956 ,  G03F7/70633 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In one embodiment, a semiconductor target for detecting overlay error between two or more successive layers of a substrate or between two or more separately generated patterns on a single layer of a substrate is disclosed. The target comprises at least a plurality of a plurality of first grating structures having a course pitch that is resolvable by an inspection tool and a plurality of second grating structures positioned relative to the first grating structures. The second grating structures have a fine pitch that is smaller than the course pitch, and the first and second grating structures are both formed in two or more successive layers of a substrate or between two or more separately generated patterns on a single layer of a substrate. The first and second gratings have feature dimensions that all comply with a predefined design rules specification.

Abstract translation: 在一个实施例中，公开了一种半导体靶，用于检测衬底的两个或更多个连续层之间或在衬底的单层上的两个或更多个分开产生的图案之间的重叠误差。 目标包括至少多个多个第一光栅结构，其具有可由检测工具分辨的光程间距和相对于第一光栅结构定位的多个第二光栅结构。 第二光栅结构具有小于光栅间距的细间距，并且第一和第二光栅结构均形成在衬底的两个或更多个连续层中，或者在衬底的单个层上的两个或更多个分开产生的图案之间 。 第一和第二光栅具有全部符合预定义的设计规则规范的特征尺寸。

公开(公告)号：US20210373445A1

公开(公告)日：2021-12-02

申请号：US17401750

申请日：2021-08-13

Applicant: KLA-TENCOR CORPORATION

Inventor： Amnon Manassen ,  Yuri Paskover ,  Eran Amit

IPC: G03F7/20 ,  G01B9/02 ,  G01B11/27

Abstract: Scatterometry overlay (SCOL) measurement methods, systems and targets are provided to enable efficient SCOL metrology with in-die targets. Methods comprise generating a signal matrix by: illuminating a SCOL target at multiple values of at least one illumination parameter, and at multiple spot locations on the target, wherein the illumination is at a NA (numerical aperture) >⅓ yielding a spot diameter

公开(公告)号：US11085754B2

公开(公告)日：2021-08-10

申请号：US16132157

申请日：2018-09-14

Applicant: KLA-Tencor Corporation

Inventor： Eran Amit ,  Amnon Manassen ,  Nadav Gutman

IPC: G01B11/06 ,  G06N20/00 ,  G03F7/20 ,  G01N21/47

Abstract: Metrology targets designs, design methods and measurement methods are provided, which reduce noise and enhance measurement accuracy. Disclosed targets comprise an additional periodic structure which is orthogonal to the measurement direction along which given target structures are periodic. For example, in addition to two or more periodic structures along each measurement direction in imaging or scatterometry targets, a third, orthogonal periodic structure may be introduced, which provides additional information in the orthogonal direction, can be used to reduce noise, enhances accuracy and enables the application of machine learning algorithms to further enhance accuracy. Signals may be analyzed slice-wise with respect to the orthogonal periodic structure, which can be integrated in a process compatible manner in both imaging and scatterometry targets.

公开(公告)号：US11067904B2

公开(公告)日：2021-07-20

申请号：US16398175

申请日：2019-04-29

Applicant: KLA-Tencor Corporation

Inventor： Eran Amit ,  Raviv Yohanan

IPC: G03F7/20 ,  G01N21/47 ,  G01N21/95

Abstract: Metrology targets, design files, and design and production methods thereof are provided. The targets comprise two or more parallel periodic structures at respective layers, wherein a predetermined offset is introduced between the periodic structures, for example, opposite offsets at different parts of a target. Quality metrics are designed to estimate the unintentional overlay from measurements of a same metrology parameter by two or more alternative measurement algorithms. Target parameters are configured to enable both imaging and scatterometry measurements and enhance the metrology measurements by the use of both methods on the same targets. Imaging and scatterometry target parts may share elements or have common element dimensions. Imaging and scatterometry target parts may be combined into a single target area or may be integrated into a hybrid target using a specified geometric arrangement.

公开(公告)号：US10763146B2

公开(公告)日：2020-09-01

申请号：US15751514

申请日：2017-12-11

Applicant: KLA-TENCOR CORPORATION

Inventor： Roie Volkovich ,  Michael Adel ,  Liran Yerushalmi ,  Eitan Herzel ,  Mengmeng Ye ,  Eran Amit

IPC: H01L21/67 ,  G01D18/00 ,  H01L21/66

Abstract: Metrology methods and modules are provided, which comprise carrying out recipe setup procedure(s) and/or metrology measurement(s) using zonal analysis with respect to respective setup parameter(s) and/or metrology metric(s). The zonal analysis comprises relating to spatially variable values of the setup parameter(s) and/or metrology metric(s) across one or more wafers in one or more lots. Wafer zones may be discrete or spatially continuous, and be used to weight one or more parameter(s) and/or metric(s) during any of the stages of the respective setup and measurement processes.

公开(公告)号：US10331050B2

公开(公告)日：2019-06-25

申请号：US15568304

申请日：2017-08-21

Applicant: KLA-Tencor Corporation

Inventor： Eran Amit ,  Roie Volkovich ,  Liran Yerushalmi

IPC: G03B27/32 ,  G03F7/20

Abstract: Lithography systems and methods are provided with enhanced performance based on broader utilization of the integrated metrology tool in the printing tool to handle the metrology measurements in the system in a more sophisticated and optimized way. Additional operation channels are disclosed, enabling the integrated metrology tool to monitor and/or allocate metrology measurements thereby and by a standalone metrology tool with respect to specified temporal limitations of the printing tool; to adjust and optimize the metrology measurement recipes; to provide better process control to optimize process parameters of the printing tool; as well as to group process parameters of the printing tool according to a metrology measurements landscape.

公开(公告)号：US10303835B2

公开(公告)日：2019-05-28

申请号：US14710201

申请日：2015-05-12

Applicant: KLA-TENCOR CORPORATION

Inventor： Eran Amit ,  Raviv Yohanan ,  Tal Itzkovich ,  Nuriel Amir ,  Roie Volkovich ,  Dongsub Choi

IPC: B32B3/10 ,  G06F17/50 ,  G01N21/93 ,  G01N21/956 ,  H01L21/3105 ,  H01L21/311 ,  G03F7/00

Abstract: Target designs methods and targets are provided, in which at least some of the differentiation between target elements and their background is carried out by segmenting either of them. Directed self-assembly (DSA) processes are used to generate fine segmentation, and various characteristics of the polymer lines and their guiding lines are used to differentiate target elements from their background. Target designs and design principles are disclosed in relation to the DSA process, as well as optimization of the DSA process to yield high metrology measurement accuracy in face of production inaccuracies. Furthermore, designs and methods are provided for enhancing and using ordered regions of a DSA-produced polymer surface as target elements and as hard masks for production processes. The targets and methods may be configured to enable metrology measurements using polarized light to distinguish target elements or DSA features.